Random vibration test was done on aluminum honeycomb sandwich board.The result suggested that chaotic behavior is found in the test data.The Volterra expression can not be gained from the input and output data directl...Random vibration test was done on aluminum honeycomb sandwich board.The result suggested that chaotic behavior is found in the test data.The Volterra expression can not be gained from the input and output data directly in this paper.The state space reconstruction was used to convert the system observed data into the quasi-input/output pairs,and the second-order Volterra adaptive filter was used to predict the test data.It is shown that combining the state space reconstruction with the Volterra adaptive filter,these chaotic series could be accurately predicted.展开更多
To simulate the fatigue characteristics of the pile-board structure under long-term dynamic load, using the in-situ dynamic testing system DTS-1, the forced vibration loading was repeated one million times at differen...To simulate the fatigue characteristics of the pile-board structure under long-term dynamic load, using the in-situ dynamic testing system DTS-1, the forced vibration loading was repeated one million times at different cross-sections of the pile-board structure for high-speed railway. The dynamic deformation, permanent deformation and dynamic stress of main reinforcements were measured. The test results show that the dynamic responses of the pile-board structure almost did not vary with the forced vibration times under the simulated trainload. After one million times of forced vibration, the permanent deformations of the midspan section of intermediate span and midspan section of side span were 0.7 mm and 0. 6 mm, respectively, and there was no accumulative plastic deformation at the bearing section of intermediate span.展开更多
随着以太网技术和集成电路技术的发展,以太网物理层(Physical Layer,PHY)芯片的速率和性能都得到了极大提升,电路复杂度更是几何级增长,以至于常规的自动测试设备(Automatic Test Equipment,ATE)测试很难充分验证其功能,所以亟需开展相...随着以太网技术和集成电路技术的发展,以太网物理层(Physical Layer,PHY)芯片的速率和性能都得到了极大提升,电路复杂度更是几何级增长,以至于常规的自动测试设备(Automatic Test Equipment,ATE)测试很难充分验证其功能,所以亟需开展相应测试方法研究。提出了一种高效的基于ZYNQ MPSOC的以太网PHY芯片功能测试方法。该方法以ZYNQ MPSOC为核心,设计了一种直达应用层面的系统级测试装置,从而减少了与物理层直接交互的行为,有效降低了测试装置及程序开发难度。经试验验证,提出的基于ZYNQ MPSOC的以太网PHY芯片功能测试方法能够用于以太网PHY芯片测试。展开更多
系统级封装(System in Package,SiP)电路包含多个功能的裸芯片,具有尺寸小、功耗低、性能高等优点,应用广泛,但结构、功能复杂,如何进行可靠性评价越来越得到关注。针对SiP电路的可靠性评价问题,设计了一套SiP电路测试系统。该测试系统...系统级封装(System in Package,SiP)电路包含多个功能的裸芯片,具有尺寸小、功耗低、性能高等优点,应用广泛,但结构、功能复杂,如何进行可靠性评价越来越得到关注。针对SiP电路的可靠性评价问题,设计了一套SiP电路测试系统。该测试系统包含相应的软件和硬件,主要实现对SiP电路的实装测试、ATE(Automatic Test Equipment)测试和老化测试,使用该测试系统能够筛选出故障电路,实现电路的可靠性评价。展开更多
基金Sponsored by the National High Technology Research and Development Programm of China(Grant No.2007AA702202)
文摘Random vibration test was done on aluminum honeycomb sandwich board.The result suggested that chaotic behavior is found in the test data.The Volterra expression can not be gained from the input and output data directly in this paper.The state space reconstruction was used to convert the system observed data into the quasi-input/output pairs,and the second-order Volterra adaptive filter was used to predict the test data.It is shown that combining the state space reconstruction with the Volterra adaptive filter,these chaotic series could be accurately predicted.
基金Key Subject for Science Research and De-velopment Plan of Railway Ministry (No.2006G004-B)
文摘To simulate the fatigue characteristics of the pile-board structure under long-term dynamic load, using the in-situ dynamic testing system DTS-1, the forced vibration loading was repeated one million times at different cross-sections of the pile-board structure for high-speed railway. The dynamic deformation, permanent deformation and dynamic stress of main reinforcements were measured. The test results show that the dynamic responses of the pile-board structure almost did not vary with the forced vibration times under the simulated trainload. After one million times of forced vibration, the permanent deformations of the midspan section of intermediate span and midspan section of side span were 0.7 mm and 0. 6 mm, respectively, and there was no accumulative plastic deformation at the bearing section of intermediate span.
文摘系统级封装(System in Package,SiP)电路包含多个功能的裸芯片,具有尺寸小、功耗低、性能高等优点,应用广泛,但结构、功能复杂,如何进行可靠性评价越来越得到关注。针对SiP电路的可靠性评价问题,设计了一套SiP电路测试系统。该测试系统包含相应的软件和硬件,主要实现对SiP电路的实装测试、ATE(Automatic Test Equipment)测试和老化测试,使用该测试系统能够筛选出故障电路,实现电路的可靠性评价。
文摘为了研究使用矩形钢管连接的新型全预制冷弯薄壁型钢复合墙体的抗侧性能,设计了6个足尺试件,并进行了水平低周往复加载试验,分析了龙骨间距、覆面板类型、单面或双面覆板等因素对新型复合墙体试件抗侧性能的影响.新型墙体的覆面板为OSB板与硅晶钙板.试验结果表明:使用矩形钢管连接的新型复合墙体具有良好的整体抗震性能;单面或双面覆板对墙体抗侧性能影响显著,双面覆板的新型复合墙体的屈服荷载约为单面覆板新型复合墙体的2倍;龙骨间距和覆面板材料对墙体抗侧性能的影响相对较小.在试验基础上,使用OpenSEES软件建立了试验墙体的有限元分析模型,并针对矩形钢管壁厚、周边螺钉间距取值进行了参数分析.参数分析结果表明,矩形钢管连接件壁厚取值推荐为2.5 mm,周边螺钉间距推荐取50~100 mm.
