THERMAL STRESSES RELAXATION DESIGN OF Ni/NiFe_(2)O_(4) SYSTEM FUNCTIONALLY GRADED CERMET INERT ANODE

The thermal stresses relaxation of Ni/NiFe2O4 system functionally graded cermet inert anode for aluminum electrolysis was optimally designed. The transient thermal stresses of the inert anode under complex boundary condition during high-temp （955℃） electrolysis were calculated using the finite-element software ANSYS, the influence of different parameters on the distribution of the thermal stresses were analyzed. The results showed that, during the process of thermal shock, the thermal hoop tensile stress on the surface of the anode is very large, which is possibly the major cause of anode crack; when the radius of the anode is between 0.05-0.15m, a range that can be realized by recent manufacturing technology, the optimum composition distribution exponent p is 0.25; The hoop tensile stresses reduce with the decrease of anode scale and also decrease with the decrease of the convection coefficient between the electrolyte and the anode.

Thermal Stresses and Theorem on Decomposition

The thermal expansion strain is considered as a special case of eigenstrain.The authors proved the theorem on decomposition of eigenstrain existing in a body into two constituents:Impotent eigenstrain(not causing stress in any point of a body)and nilpotent eigenstrain(not causing strain in any point of a body).According to this theorem,the thermal stress can be easily found through the nilpotent eigenstrain.If the eigenstrain is an impotent one,the thermal stress vanishes.In this case,the eigenstrain must be compatible.The authors suggest a new approach to measure of eigenstrain incompatibility and hence to estimate of thermal stresses.

INFLUENCE OF TEMPERATURE-DEPENDENT PROPERTIES ON THERMAL STRESSES RESPONSE AND OPTIMUM DESIGN OF C/M FGMS UNDER THERMAL CYCLIC LOADING

The influence of temperature-dependent properties on thermal stresses response and optimum design of newly developed ceramic-metal functionally graded materials under cyclic thermal loaning and high temperature gradient environment is studied. The thermal conductivity of material is considered to be dependent on the temperature. In this paper, the thermal stresses response of the material is calculated rising a nonlinear finite element method. Emphasis is placed on the influence of temperature-dependent properties on the thermal stresses response characteristics, the thermal stresses relaxation property and the thermal stresses history under the different graded compositional distributions and different heat flux magnitudes. Through tile analysis. it is suggested that the influence of temperature-dependent properties can not be neglected In the thermal stresses response analysis and the optimum design process of the material must be based on the temperature-dependent thermo-elastic-plastic theory.

Role of Thermal Stresses in Degradation of High Power Laser Diodes

Catastrophic degradation of high power laser diodes is due to the generation of extended defects inside the active parts of the laser structure during the laser operation.The mechanism driving the degradation is strongly related to the existence of localized thermal stresses generated during the laser operation.These thermal stresses can overcome the yield strength of the materials forming the active part of the laser diode.Different factors contribute to reduce the laser power threshold for degradation.Among them the thermal transport across the laser structure constitutes a critical issue for the reliability of the device.

Thermal stresses induced by a point heat source in a circular plate by quasi-static approach

The present paper deals with the determination of quasi-static thermal stresses due to an instantaneous point heat source of strength g_(pi) situated at certain circle along the radial direction of the circular plate and releasing its heat spontaneously at time t=τ.A circular plate is considered having arbitrary initial temperature and subjected to time dependent heat flux at the fixed circular boundary of r=b.The governing heat conduction equation is solved by using the integral transform method,and results are obtained in series form in terms of Bessel functions.The mathematical model has been constructed for copper material and the thermal stresses are discussed graphically.

Size-dependent thermal stresses in the core–shell nanoparticles

The thermal stress in a magnetic core–shell nanoparticle during a thermal process is an important parameter to be known and controlled in the magnetization process of the core–shell system. In this paper we analyze the stress that appears in a core–shell nanoparticle subjected to a cooling process. The external surface temperature of the system, considered in equilibrium at room temperature, is instantly reduced to a target temperature. The thermal evolution of the system in time and the induced stress are studied using an analytical model based on a time-dependent heat conduction equation and a differential displacement equation in the formalism of elastic displacements. The source of internal stress is the difference in contraction between core and shell materials due to the temperature change. The thermal stress decreases in time and is minimized when the system reaches the thermal equilibrium. The radial and azimuthal stress components depend on system geometry, material properties, and initial and final temperatures. The magnitude of the stress changes the magnetic state of the core–shell system. For some materials, the values of the thermal stresses are larger than their specific elastic limits and the materials begin to deform plastically in the cooling process. The presence of the induced anisotropy due to the plastic deformation modifies the magnetic domain structure and the magnetic behavior of the system.

A new analytical model for thermal stresses in multi-phase materials and lifetime prediction methods

Based on the fundamental equations of the mechanics of solid continuum, the paper employs an analytical model for determination of elastic thermal stresses in isotropic continuum represented by periodically distributed spherical particles with different distributions in an infinite matrix, imaginarily divided into identical cells with dimensions equal to inter-particle distances, containing a central spherical particle with or without a spherical envelope on the particle surface. Consequently, the multi-particle-（envelope）- matrix system, as a model system regarding the analytical modelling, is applicable to four types of multi-phase materials. As functions of the particle volume fraction v, the inter-particle distances dl, d2, d3 along three mutually per- pendicular axes, and the particle and envelope radii, R1 and R2, respectively, the thermal stresses within the cell, are originated during a cooling process as a consequence of the difference in thermal expansion coefficients of phases rep- resented by the matrix, envelope and particle. Analytical-（experimental）-computational lifetime prediction methods for multi-phase materials are proposed, which can be used in engineering with appropriate values of parameters of real multi-phase materials.

Modeling and simulation of 3D thermal stresses of large-sized castings in solidification processes

When heavy machines and large scaled receiver system of communication equipment are manufactured, it always needs to produce large-sized steel castings, aluminum castings and etc. Some defects of hot cracking by thermal stress often appear during solidification process as these castings are produced, which results in failure of castings. Therefore predicting the effects of technological parameters for production of castings on the thermal stress during solidification process becomes an important means. In this paper, the mathematical models have been established and numerical calculation of temperature fields by using finite difference method (FDM) and then thermal stress fields by using finite element method (FEM) during solidification process of castings have been carried out. The technological parameters of production have been optimized by the results of calculation and the defects of hot cracking have been eliminated. Modeling and simulation of 3D thermal stress during solidification processes of large-sized castings provided a scientific basis, which promoted further development of advanced manufacturing technique.

Thermal stresses in infinite circular cylinder subjected to rotation

The present investigation is concerned with the effect of rotation on an infi- nite circular cylinder subjected to certain boundary conditions. An analytical procedure for evaluation of thermal stresses, displacements, and temperature in rotating cylinder subjected to thermal load along the radius is presented. The dynamic thermal stresses in an infinite elastic cylinder of radius a due to a constant temperature applied to a variable portion of the curved surface while the rest of surface is maintained at zero temperature are discussed. Such situation can arise due to melting of insulating material deposited on the surface cylinder. A solution and numerical results are obtained for the stress components, displacement components, and temperature. The results obtained from the present semi-analytical method are in good agreement with those obtained by using the previously developed methods.

Thermal stresses in two-and three-component anisotropic materials

This paper deals with an analytical model of thermal stresses which originate during a cooling process of an anisotropic solid continuum with uniaxial or triaxial anisotropy. The anisotropic solid continuum consists of anisotropic spherical particles periodically distributed in an anisotropic infinite matrix. The particles are or are not embedded in an anisotropic spherical envelope, and the infinite matrix is imaginarily divided into identical cubic cells with central particles. The thermal stresses are thus investigated within the cubic cell. This mulfi-particle-（envelope）-matrix system based on the cell model is applicable to two- and three-component materials of precipitate-matrix and precipitate-envelope-matrix types, respectively. Finally, an analysis of the determination of the thermal stresses in the multi-par- ticle-（envelope）-matrix system which consists of isotropic as well as uniaxial- and/or triaxial-anisotropic components is presented. Additionally, the thermal-stress induced elastic energy density for the anisotropic components is also derived. These analytical models which are valid for isotropic, anisotropic and isotropic-anisotropic multi-particle- （envelope）-matrix systems represent the determination of important material characteristics. This analytical determination includes： （1） the determination of a critical particle radius which defines a limit state regarding the crack initiation in an elastic, elastic-plastic and plastic components; （2） the determination of dimensions and a shape of a crack propagated in a ceramic components; （3） the determination of an energy barrier and micro-/macro-strengthening in a component; and （4） analytical-（experimental）-computational methods of the lifetime prediction. The determination of the thermal stresses in the anisotropic components presented in this paper can be used to determine these material characteristics of real two- and three-component materials with anisotropic components or with anisotropic and isotropic components.

Finite Element Analysis of Thermal Stresses in Ceramic/Metal Gradient Thermal Barrier Coatings

This paper studied the thermal stresses of ceramicl metal gradient thermal barrier coating which combines the conceptions of ceramic thermal barrier coating （TBC） and functionally gradient material （FGM）. Thermal stresses and residual thermal stresses were calculated by an ANSYS finite element analysis software. Negative thermal expansion coefficient method was proposed and element birth and death method was applied to analyze the residual thermal stresses which have non-uniform initial temperature field. The numerical results show a good agreement with the analytical results and the experimental results.

Genetic Algorithm for the Thermal Stresses Optimum Design ofFunctionally Gradient Material Plate

Based on the thermal stress distribution for functionally gradient material (FGM) plates, a Genetic Algorithm (GA) method for the thermal stresses optimum design of FGM plate with computer technologies is given. The minimum thermal stresses combination distribution for FGM is obtained.

Thermal stresses analysis of casing string used in enhanced geothermal systems wells

In the enhanced geothermal systems wells, casing temperature variation produces casing thermal stresses, resulting in casing uplift or bucking. When the induced thermal stresses exceed casing material's yield strength, the casing deforms and collapses. The traditional casing design standard only considers the influence of temperature variation on casing material's yield strength. Actually, for commonly used grades of steel pipe, casing's material properties-such as yield strength, coefficient of thermal expansion, and modulus of elasticity change with temperature variation. In this paper, the modified thermal stress equation is given. Examples show that the allowable temperature of the material grade N80's casing is only 164 ℃, which is much lower than that of the traditional design standard. The effective method to improve the casing pipe's allowable temperature is pre-stressed cementing technology. Pre-stressed cementing includes pre-tension stress cementing and pre-pressure stress cementing. This paper focuses on the design method of full casing pre-tension stress cementing and the ground anchor full casing string pre-tension cementing construction process.

Residual Thermal Stresses of Laser Cladding of Intermetallic-Ceramic Composite Coatings

The stresses in laser cladding of Ni3Al-WC composite coating co and in heat affect zone (HAZ) σh have been induced based on considering the influences of laser processing parameters power P and beam traverse speed v.According to the calculated results, certain limits of P and v are necessary in order to obtain crack free coatings. It agrees well with the experimental results.

Numerical Solution of a Problem of Thermal Stresses of a Magnetothermoelastic Cylinder with Rotation by Finite-Difference Method

The present article deals with the investigation thermal stress of a magnetothermoelastic cylinder subjected to rotation,open or closed circuit,thermal and mechanical boundary conditions.The outer and inner surfaces of the cylinder are subjected to both mechanical and thermal boundary conditions.A The transient coupled thermoelasticity in an infinite cylinder with its base abruptly exposed to a heat flux of a decaying exponential function of time is devised solve by the finite-difference method.The fundamental equations’system is solved by utilizing an implicit finite-difference method.This current method is a second-order accurate in time and space;it is also unconditionally stable.To illustrate the present model’s efficiency,we consider a suitable material and acquire the numerical solution of temperature,displacement components,and the components of stresses with time t and through the radial of an infinite cylinder.The results indicate that the effect of coupled thermoelasticity,magnetic field,and rotation on the temperature,stresses,and displacement is quite pronounced.In order to illustrate and verify the analytical developments,the numerical solution of partial differential equations,stress components,displacement components and temperature is carried out and computer simulated results are presented graphically.This study is helpful in the development of piezoelectric devices.

Influence of Patch Side of Heat-Ray Absorbing Film on One-Dimensional Unsteady Thermal Stresses in Window Glass

Heat-ray absorbing film is used to be bonded on the existing sheet glasses of the windows.It is effective for air-conditioning energy saving against the global warming,because it absorbs heat-ray in the thin film and decreases the incoming heat-ray into the room.On the other hand,the sheet glasses increase the temperature at the surface which the sheet is bonded and sometimes yield heat cracks by thermal stresses.It is important to know the state of thermal stresses accurately in order to develop the heat-ray absorbing film with higher performance and without heat cracks.In this paper,the analysis model is treated as the two-layer plate of the conventional soda sheet glass and the heat-ray absorbing film with different absorptivities.The unsteady temperature and thermal stresses are analyzed and calculated numerically.The influence of the patch side,which the heat-ray absorbing film is bonded at the exterior side or the interior side,on the heat-ray absorbing performance and the thermal stresses is discussed.It is found that the alternative patch side has no effect on the heat-ray absorbing performance and that the patch side is recommended to be interior side from a view point of decreasing thermal stresses against the heat crack of glasses.

STUDY ON NUMERICAL SIMULATION OF CASTING THERMAL STRESSES BASED ON FDM

A system for the numerical simulation of 3D temperature and stress fields during casting process was studied, developed and practiced based on finite difference method (FDM) in this paper. An approach where the stress/strain and the heat transfer analysis use the same computational domain was presented, which avoided transferring temperature data between FDM and FEM nodes and elements. A slot-board steel casting was simulated and the calculated results are in agreements with those obtained from practical producing.

Analysis and verification of electrodynamic force,thermal stress and current sharing for CRAFT converter structure design

In the design realm of fusion power supplies,structural components play a pivotal role in ensuring the safety of fusion devices.To verify the reliability of the converter structure design at the Comprehensive Research Facility for Fusion Technology(CRAFT),meticulous analysis of the converter's dynamic impact is carefully performed based on the worst fault current(400k A),firstly.Subsequently,the thermal stress analysis based on the maximum allowable steadystate temperature is finished,and the equivalent thermal stress,thermal deformation,maximum shear stress of a single bridge arm and the whole converter are studied.Furthermore,a simple research method involving the current-sharing characteristics of a bridge arm with multithyristor parallel connection is proposed using a combination of Simplorer with Q3D in ANSYS.The results show that the current-sharing characteristics are excellent.Finally,the structural design has been meticulously tailored to meet the established requirements.

Solid oxide fuel cell interconnect design optimization considering the thermal stresses

The mechanical failure of solid oxide fuel cell(SOFC) components may cause cracks with consequences such as gas leakage,structure instability and reduction of cell lifetime.A comprehensive 3D model of the thermal stresses of an anode-supported planar SOFC is presented in this work.The main objective of this paper is to get an interconnect optimized design by evaluating the thermal stresses of an anode-supported SOFC for different designs,which would be a new criterion for interconnect design.The model incorporates the momentum,mass,heat,ion and electron transport,as well as steady-state mechanics.Heat from methane steam reforming and water-gas shift reaction were considered in our model.The results examine the relationship between the interconnect structures and thermal stresses in SOFC at certain mechanical properties.A wider interconnect of the anode side lowers the stress obviously.The simulation results also indicate that thermal stress of coflow design is smaller than that of counterflow,corresponding to the temperature distribution.This study shows that it is possible to design interconnects for an optimum thermal stress performance of the cell.

Contribution to Encyclopedia of Thermal Stresses

This paper lists the contribution in the international interdisciplinary reference – Encyclopedia of Thermal Stresses(ETS). The ETS, edited by the world famous expert in field of Thermal Stresses – Professor Richard Hetnarski from Rochester Institute of Technology, was published by Springer in 2014. This unique Encyclopedia, subdivided into 11 volumes is the most extensive and comprehensive work related to the Thermal Stresses topic. The entries were carefully prepared by specialists in the field of thermal stresses, elasticity, heat conduction, optimization among others. The Polish authors' contribution within this work is significant; over 70 entries were prepared by them.