This article presents a modeling and simulation method for transient thermal analyses of integrated circuits(ICs)using the original and voltage-in-current(VinC)latency insertion method(LIM).LIM-based algorithms are a ...This article presents a modeling and simulation method for transient thermal analyses of integrated circuits(ICs)using the original and voltage-in-current(VinC)latency insertion method(LIM).LIM-based algorithms are a set of fast transient simulation methods that solve electrical circuits in a leapfrog updating manner without relying on large matrix operations used in conventional Simulation Program with Integrated Circuit Emphasis(SPICE)-based methods which can significantly slow down the solution process.The conversion from the thermal to electrical model is performed first by using the analogy between heat and electrical conduction.Since electrical inductance has no thermal equivalence,a modified VinC LIM formulation is presented which removes the requirement of the insertion of fictitious inductors.Numerical examples are presented,which show that the modified VinC LIM formulation outperforms the basic LIM formulation,in terms of both stability and accuracy in the transient thermal simulation of ICs.展开更多
目的：研究自发性高血压大鼠降压前后的机械痛阈和热痛阈改变.方法：15只自发性高血压大鼠在实验 d 4～11肌注利血平注射液（1 μg·kg^-1·d^-1）.血压、机械刺激缩足反应阈值和热刺激缩足反应潜伏期作为观察指标.结果：自发...目的：研究自发性高血压大鼠降压前后的机械痛阈和热痛阈改变.方法：15只自发性高血压大鼠在实验 d 4～11肌注利血平注射液（1 μg·kg^-1·d^-1）.血压、机械刺激缩足反应阈值和热刺激缩足反应潜伏期作为观察指标.结果：自发性高血压大鼠经利血平降压治疗后血压明显下降约 50 mmHg 左右,机械痛阈和热痛阈均降低（P＜0.05）.结论：自发性高血压可能对自发性高血压大鼠的伤害性感受系统存在可逆的结构和（或）功能影响.展开更多
基金This work was supported by the Fundamental Research Grant Scheme(FRGS)sponsored by the Ministry of Higher Education,Malaysia under Grant No.FRGS/1/2020/TK0/USM/02/7.
文摘This article presents a modeling and simulation method for transient thermal analyses of integrated circuits(ICs)using the original and voltage-in-current(VinC)latency insertion method(LIM).LIM-based algorithms are a set of fast transient simulation methods that solve electrical circuits in a leapfrog updating manner without relying on large matrix operations used in conventional Simulation Program with Integrated Circuit Emphasis(SPICE)-based methods which can significantly slow down the solution process.The conversion from the thermal to electrical model is performed first by using the analogy between heat and electrical conduction.Since electrical inductance has no thermal equivalence,a modified VinC LIM formulation is presented which removes the requirement of the insertion of fictitious inductors.Numerical examples are presented,which show that the modified VinC LIM formulation outperforms the basic LIM formulation,in terms of both stability and accuracy in the transient thermal simulation of ICs.
