A model for transient diffusion in bidisperse pore structures

A bidisperse model for transient diffusion and adsorption processes in porous materials is presented in this paper.The mathematical model is solved by numerical methods based on finite elements combined with the linear driving force approximation.A criterion based on the model to identify the diffusion controlling mechanism(macropore diffusion,micropore diffusion,or both)is proposed.The effects of different adsorption isotherms(linear,Freundlich,or Langmuir)on the concentration profiles and on curves of fractional uptake versus time are investigated.In addition,the influences of model parameters concerning the pore networks on the fractional uptake are studied as well.

Localized space-tim e method of fundamental solutions for three-dimensional transient diffusion problem

A localized space-time method of fundamental solutions(LSTMFS)is extended for solving three-dimensional transient diffusion problems in this paper.The interval segmentation in temporal direction is developed for the accurate simulation of long-time-dependent diffusion problems.In the LSTMFS,the whole space-time domain with nodes arranged i divided into a series of overlapping subdomains with a simple geometry.In each subdomain,the conventional method of fundamental solutions is utilized and the coefficients associated with the considered domain can be explicitly determined.By calculating a combined sparse matrix system,the value at any node inside the space-time domain can be obtained.Numerical experi-ments demonstrate that high accuracy and efficiency can be simultaneously achieved via the LSTMFS,even for the problems defined on a long-time and quite complex computational domain.

New Insights on Convergence Properties of Peridynamic Models for Transient Diffusion and Elastodynamics

Recent analytical solutions for peridynamic(PD)models of transient diffusion and elastodynamics allow us to revisit convergence of 1D PD models to their classical counterparts.We find and explain the reasons for some interesting differences between the convergence behavior for transient diffusion and elastodynamics models.Except for very early times,PD models for transient diffusion converge monotonically to the classical one.In contrast,for elastodynamic problems this convergence is more complex,with some periodic/almost-periodic characteristics present.These special features are investigated for sine waves used as initial conditions.The analysis indicates that the convergence behavior of PD solutions to the classical one can be understood in terms of convergence properties for models using the Fourier series expansion terms of a particular initial condition.The results obtained show new connections between PD models and their corresponding classical versions.

A two-step transient liquid phase diffusion bonding process of T91 steels

In this study, a two-step heating process is introduced for transient liquid phase （ TLP） diffusion bonding fo r sound joints with T91 heat resistant steels. At first, a short-time higher temperature heating step is addressed to melt the interlayer, followed by the second step to complete isothermal solidification at a low temperature. The most critical feature of our new method is producing a non-planar interface at the T9／ heat resistant steels joint. We propose a transitional liquid phase bonding of T91 heat resistant steels by this approach. Since joint microstructures have been studied, we tested the tensile strength to assess joint mechanical property. The result indicates that the solidified bond may contain a primary solid-solution, similar composition to the parent metal and free from precipitates. Joint tensile strength of the joint is not lower than parent materials. Joint bend＇s strengths are enhanced due to the higher metal-to-metal junction producing a non-planar bond lines. Nevertheless, the traditional transient liquid phase diffusion bonding produces planar ones. Bonding parameters of new process are 1 260 °C for 0. 5 min and 1 230 °C fo r 4 min.

A study on the two-step transient liquid phase diffusion bonding of K640 superalloy

A new technology, the two-step transient liquid phase diffusion bonding （TLP-DB） technology for cobalt-based K640 superalloy, was investigated. The method consists of a short-time high temperature heating to melt interlayer followed by isothermal solidification of liquid phase at a lower temperature than that of the conventional TLP-DB. The result indicates that the two-step TLP-DB can reliably produce an ideal joint with uniform chemical composition, which is superior to the joint welded by conventional TLP-DB in microstructure and mechanical properties. Bonding parameters of new process are 1 250℃ for 0. 5 h and 1 180℃ for 3 h. The high-temperature tensile strength of the joint by two-step TLP-DB reaches 74% of that of the base material on an equal basis, but the high-temperature tensile strength of the joint by conventional TLP-DB is only 58% of that of the base material.

Recent development of transient electronics

Transient electronics are an emerging class of electronics with the unique characteristic to completely dissolve within a programmed period of time. Since no harmful byproducts are released, these electronics can be used in the human body as a diagnostic tool, for instance, or they can be used as environmentally friendly alternatives to existing electronics which disintegrate when exposed to water. Thus, the most crucial aspect of transient electronics is their ability to disintegrate in a practical manner and a review of the literature on this topic is essential for understanding the current capabilities of transient electronics and areas of future research. In the past, only partial dissolution of transient electronics was possible, however, total dissolution has been achieved with a recent discovery that silicon nanomembrane undergoes hydrolysis. The use of single- and multi-layered structures has also been explored as a way to extend the lifetime of the electronics. Analytical models have been developed to study the dissolution of various functional materials as well as the devices constructed from this set of functional materials and these models prove to be useful in the design of the transient electronics.