Interfacial reactions and diffusion path in partial transient liquid-phase bonding of Si_3N_4/Ti/Ni/Ti/Si_3N_4

The interfacial reactions in partial transient liquid-phase bonding of Si3N4 ceramics with Ti/Ni/Ti interlayers were studied by means of scanning electron microscopy （SEM）, energy dispersive spectrometry （EDS） and X-ray diffractometry （XRD）. It was shown that the interfacial structure of Si3N4/TiN/Ti5Si3+Ti5Si4 + Ni3Si/ （NiTi ） /Ni3Ti/ Ni was formed after bonding. The activation energies for TiN layer and the mixed reaction layer of Ti5Si3 + Ti5Si4 + Ni3Si are 546. 8 kJ/mol and 543. 9 kJ/mol, respectively. The formation and transition processes of interface layer sequence in the joint were clarified by diffusion path. An important characteristic, which is different from the conventional brazing and soid-state diffusion bonding, has been found, i. e., during the partial transient liquid-phase bonding, not only the reaction layers which have formed grow, but also the diffusion path in the subsequent reaction changes because of the remarkable variation of the concentration on the metal side.

Microstructural developments and precipitate transformation during transient liquid-phase bonding of a duplex stainless steel

Effect of holding time on microstructural developments and transformation of precipitates formed at the interface during transient liquid-phase bonding of a duplex stainless steel using a Ni-based amorphous insert alloy was studied. The experimental results reveal that the microstructure of the adjacent base metal varies clearly as a function of holding time. The migration of Cr and Ni elements and the → transformation seem to play relevant roles in this microstructure evolution. The scanning electron microscopy (SEM) and electron prob X-ray microanalysis (EPMA) results indicate the transformation of BN→BN and (N, Mo) boride→BN at the interface with the holding time of 60-1 800 s. N content changes with holding time increasing at locations at the interface might be a controlling factor contributing to this transformation.

Interfacial Microstructure and Properties of Ti(C, N)/Ni Bonded by Transient Liquid-phase Diffusion

Effects of the main process parameters（temperature and time） on microstructure and properties of Ti（C, N）/Ni interface bonded by （Cu＋Nb） interlayer in a vacuum diffusion bonding device were investigated. The interfacial microstructures consisted initially of Ni3Nb metallic compound and eutectic of Ni3Nb ＋ CuNiss, and finally transformed to （Ti, Nb） （C, N）＋Ni3Nb near Ti （C, N） and NiCuss ＋ Ni3Nb near Ni when diffusion bonding temperature was 1 523-1 573 K. It was clear that Cu was a constituent in the transient liquid phase （TLP） into which Ni was dissolved by forming Cu-Ni transition liquid. Nb was dissolved in Cu-Ni transition liquid rapidly. Ti （C, N） conld be wetted by resultant Ni-Nb-Cu transient liquid phase which was followed by a little （Ti, Nb） （C, N） solid solution formed at interface. This increased the interface combining capability. Ultimately the interface shear strength was able to reach 140 MPa. The theoretle analysis and experimental results show that the growth of interfacial reaction layer Ni3Nb accords with parabola law, and the activation energy of diffusion reaction is 115.0±0.5 kJ/mol, while the diffusion reaction speed constant is 12.53 mm/s^1/2.

Improvement of Joint Strength of SiCp/Al Metal Matrix Composite in Transient Liquid Phase Bonding Using Cu/Ni/Cu Film Interlayer

The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase （TLP） bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy （SEM） was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal.

Study on interfacial structure and strength of Si_3N_4/Ti/Cu/Ti/Si_3N_4 PTLP bonding

Partial transient liquid-phase bonding （PTLP bonding） of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure and joint strength was discussed. The joint interface structures are investigated by scanning electron microscope （SEM） and energy dispersion spectroscopy（EDS）. The results show that the maximum joint strength of 210 MPa is obtained at room temperature in the experiments. When joining temperature and time are not changed and the process of isothermal solidification is sufficient , interface structure, reaction layer thickness and isothermal solidification thickness change with the thickness of Ti foil.

Effect of gap size on microstructure of transient liquid phase bonded IN-738LC superalloy

In order to investigate the microstructure evolution and gain complete isothermal solidification time, transient liquid phase （TLP） bonding of IN-738LC superalloy was carried out using powdered AMS 4777 as the filler metal. The influence of gap size and bonding time on the joints was investigated. For example, complete isothermal solidification time for 40μm gap size was obtained as 45 min. In the case of lack of completion of isothermal solidification step, the remained molten interlayer cooled in the bonding zone under non-equilibrium condition andγ–γ′ eutectic phase formed in that area. The relationship between gap size and holding time was not linear. With the increase in gap size, eutectic phase width became thicker. In the diffusion affected zone, a much larger amount of alloying elements were observed reaching a peak. These peaks might be due to the formation of boride or silicide intermetallic. With the increase in gap size, the time required for bonding will increase, so the alloying elements have more time for diffusion and distribution in farther areas. As a result, concentrations of alloying elements decreased slightly with the increase in the gap size. The present bi-phasic model did not properly predict the complete isothermal solidification time for IN-738LC-AMS 4777-IN-738LC TLP bonding system.

Effect of Bonding Temperature on the Microstructures and Strengths of C/C Composite/GH3044 Alloy Joints by Partial Transient Liquid-Phase(PTLP) Bonding with Multiple Interlayers

With the use of Ti/Ni/Cu/Ni multiple foils as interlayer,carbon/carbon（C/C） composite was bonded to Nibased superalloy GH3044 by partial transient liquid-phase bonding technique.The effect of bonding temperature on the microstructures and strengths of the joints was investigated.The results showed that gradient structural multiple interlayers composed of ‘‘C–Ti reaction layer/Ti–Ni intermetallic compound layer/Ni–Cu sosoloid/residual Cu layer/Ni-GH3044 diffusion layer＇＇ were formed between C/C composite and GH3044.The shear strength of the C/C composite/GH3044 joint reached the highest value of 26.1 MPa when the bonding temperature was 1,030 °C.In addition,the fracture morphology showed that the fracture mode changed with the increase of bonding temperature.

Effect of the formation process of transient liquid phase (TLP) on the interface structure of TiAl joints

TiAl has been joined employing the transient liquid phase （TLP） bonding with Ti combined with Cu, Ni or Fe foils. Experimental results showed that though the interface structures of the joints are quite different, all the joined zones are composed of five sublayers, i.e. two diffusion zones, two interfacial zones and an interlayer. It has been convinced that the formation process of the transient liquid phase controls the diffusion behavior of melting point depressant （MPD） Cu, Ni, and Fe atoms, which leads to form different interface structures of the joints.

Microstructural evaluation of Hastelloy-X transient liquid phase bonded joints:Effects of filler metal thickness and holding time

Transient liquid phase(TLP)bonding was investigated in Hastelloy-X samples with different filler metal thicknesses(20,35,50,65,and 100μm)and holding time(5,20,80,320,and 640 min)to obtain optimum bonding parameters.Microstructural evaluations using electron probe microanalysis(EPMA)and electron backscattered diffraction(EBSD)show that the central eutectic phases present in the athermally solidified zone(ASZ)are Ni_(3)B,Ni_(2)Si,and CrB,and the precipitates formed in the diffusion-affected zone(DAZ)are MoB,CrB_(2),and Mo_(2)B_(5).According to the results,decreasing the filler thickness as well as increasing the holding time helps realize the completion of isothermal solidification and reduction in the density of precipitates in the DAZ,leading to a joint with more uniform properties.Diffusion of boron and silicon to longer distances with increasing holding time causes the removal of Cr-rich borides in the DAZ and the formation of Mo-rich silicide at the joint interface.Decrease in hardness of ASZ and DAZ due to the elimination of brittle phases in these zones during long holding time causes more uniform hardness distribution in the joint area.The best results are obtained for the sample joined with the 35μm-thick filler metal for 640 min holding time.

Transient liquid-phase bonding of superalloy K465 using a Ni-Cr-Fe-B-Si amorphous interlayer alloy

A kind of Ni-Cr-Fe-B-Si system amorphous alloy was used as interlayer in transient liquid-phase bonding(TLP bonding)of polycrystalline superalloy K465.The bonding behavior,microstructure feature and the tensile properties of the joints were investigated.There are B-rich phase and Si-rich phase formed in the center of the seam after bonding at 1210℃for 30 min.The isothermal solidification is complete after bonding at 1210℃for 4 h.The relationship of the average width of the remnant eutectic zone and bonding time at 1210℃is nonlinear.The tensile strength of the bonded joint at room temperature and 900℃is comparable to that of K465 alloy.

连接温度对GH4169合金TLP接头界面组织和性能的影响

采用50μm厚的Ni82CrSiB非晶箔片为中间层,通过瞬时液相扩散连接(TLP)方法实现GH4169合金的连接。研究TLP接头的界面组织结构,重点分析连接温度对接头界面组织和力学性能的影响规律。结果表明:GH4169合金TLP接头由等温凝固区(ISZ)和扩散区(DZ)组成。等温凝固区为单相镍基固溶体,B元素向母材的扩散导致在扩散区内晶界处形成大量的针棒状硼化物。随着连接温度的升高,扩散区厚度逐渐增加,而等温凝固区厚度基本保持不变。当连接温度为1 120℃、连接时间为2 h时,接头室温及高温(600℃)抗拉强度最高,分别为692和599 MPa,为母材强度的82%和71%。断口分析结果表明:随连接温度的升高,室温拉伸时接头断裂位置由等温凝固区逐渐转向扩散区,而高温拉伸时接头均在等温凝固区发生断裂。

Cu中间层SiC_p/Al MMCs TLP扩散连接过程分析

采用铜箔作中间层,在连接温度为853K、无压的条件下进行了瞬间液相连接,对TLP扩散连接过程及其动力学模型进行了分析,并对试验结果进行了的验证。结果表明:TLP扩散连接理论模型和试验结果之间还存在着一些差异,对等温凝固过程还需要进一步探讨。分析认为,AlMMCs中大量的晶界、亚晶界、位错等短路扩散通道的存在,直接影响TLP连接过程及其动力学。

K640合金TLP连接接头组织及力学性能

为考察瞬时液相(TLP)连接方法对钴基高温合金K640合金的适用性,采用非晶态中间层进行连接试验,观察接头区显微组织,测试接头的力学性能并进行断口分析。结果表明:瞬时液相连接能够实现K640合金的良好结合,接头组织致密,成分均匀,组织与成分均与母材接近;接头高温拉伸强度达到等条件下母材强度74%,断口具有明显的韧窝形貌;高温持久强度达到等条件下母材强度的70%以上。

日本液相扩散焊(TLP)钢管对焊技术研究近况

液相扩散焊 ( TLP)焊管方法以其特有的高自动化程度、高生产率、高性能、低变形、无焊接烟尘与飞溅等优点已引起了日本学术界与产业界的极大研发兴趣。重点介绍了日本新日铁公司的研究人员采用 α中子射线照射法对碳素钢液相扩散焊中降熔元素 B的扩散行为及存在形态的研究成果。研究结果指出 ,中间层内的降熔元素 B扩散入碳钢母材后 ,在冷却过程中 B在晶界聚集 ,以 Fe2 3( C,B) 6 化合物方式析出 ;在晶界周边则形成贫 B层 ,其结果是晶界近旁的淬硬性大幅度降低 ;接合部组织由晶界铁素体及晶内上贝氏体组成。在保温 60 0 s时 ,扩散距离达 2 mm,并求得 B在 1 4 73 K温度下的扩散系数为 1 .1× 1 0 - 9m2

保温时间对TLP扩散焊焊接TA2纯钛接头组织和性能的影响

以Cu-Ni-Sn-P非晶合金作为中间层材料,采用瞬时液相(TLP)扩散焊焊接了TA2工业纯钛,研究了保温时间对接头组织和性能的影响。结果表明:该接头结合处由残留中间层、等温凝固层和界面扩散层组成,随着保温时间的延长,残留中间层厚度减小,界面扩散层宽度增大,当保温5min后,接头处基本由羽毛状界面扩散区组成,宽度为25μm;接头剪切强度随保温时间的延长先增后降,保温时间为3min时达到最大,约180MPa,剪切断裂方式为脆性+塑性混合型断裂。

TLP连接机制与中间层问题的探讨

瞬时液相扩散焊连接(TLP)提供了一种在低温下连接各种材料的焊接方法。TLP连接方法能够产生无界面的、无中间层残留的高强度接头,在TLP连接过程中由于降熔剂的作用使得液相中间层只能够向金属母材扩散,从而产生等温定向凝固。可见中间层中扩散是TLP连接过程的关键问题,为此阐述了中间层中各项因素对连接时间的影响,结果发现中间层的厚度以及降熔剂的选择对连接时间都有很大影响。因此,应尽量避免中间层金属间化合物的产生。

DZ40M合金缺陷试样TLP-DB接头力学性能研究

开展定向凝固钴基高温合金DZ40M的过渡液相扩散焊试验,研究不同界面缺陷率DZ40M合金TLP-DB接头的高温力学性能。结果表明:采用1260℃/0.5h+1200℃/6h规范可实现DZ40M合金过渡液相扩散焊的良好结合;接头高温持久强度达到等条件下母材的70%以上;当界面缺陷率达15%时,接头高温持久强度仍达到母材的70%以上;但随着缺陷比例的增大,断裂位置由母材转移到焊缝。

Interface Structure and Formation Mechanism of Directly-Bonded Joints of Silicated Graphite to Fe-based Alloys

Commercially available 000Cr3OMo2 ferritic stainless steel and 4J33 ferromagnetic expansion alloy were di- rectly bonded to silicated graphite at 1180-1200℃ and 1100-1150℃, respectively, Intedacial microstructures were examined by scanning electron microscopy, electron probe microanalysis, and X-ray diffraction. The results showed that transient liquid-phase present during bonding promoted the interracial reactions during bonding. Plenty of brittle chromium carbides, such as （Cr, Fe）7C3 and （Cr2.5Fe4.3Mo0.1）C3, were observed in 000Cr3OMo2/silicated graphite joints. Besides, transverse cracks were also found. In case of 4J33/silicated graphite system, well bonded joints free of defects Were obtained.

TLP连接下Ni-Sn-Cu接头显微结构演变与抗剪强度的关系

研究了瞬时液相(TLP)扩散连接过程中镍-锡-铜烧结接头的显微结构演变与其抗剪强度的关系。结果表明,由厚度为20μm的纳米镍焊膏中插入厚度为60μm的纯锡箔所组成的烧结接头,在0.6 MPa压力及340℃的烧结温度下烧结2 h,接头与基板界面逐渐形成含铜量较高的扇贝状金属间化合物(IMC)(Cu, Ni)_6Sn_5;在350℃下烧结2.5 h,接头中部形成含镍量较高、含铜量较低的(Ni,Cu)_3Sn_4 IMC;在350℃下烧结3 h后接头中部由均匀、致密的(Ni,Cu)_3Sn_4 IMC组成。整个烧结过程中接头处的空隙比先增大后减小,其抗剪强度在350℃下烧结3 h后达到最高15.4 MPa。在250℃时效24～96 h后,接头抗剪强度随着时效时间的增加不断降低,72 h后抗剪强度为10 MPa并趋于稳定。接头在高温时效后保持了一定的抗剪强度。

Influence of the Substrate Orientation on the Isothermal Solidification during TLP Bonding Single Crystal Superalloys

Angle deviations between the two substrates during transient liquid phase （TLP） bonding single crystal superalloys cannot be avoided. In the present work, specimens have been prepared to investigate the influences of the various substrate orientations. It is found that the width of the non-isothermal solidification zone （NSZ） is linear with the square root of the isothermal solidification time. This suggests that the isothermal solidification process is B-diffusion controlled in different substrate orientation deviations. And also the width of the NSZ increases with increasing angle deviation, indicating that the isothermal solidification time needed in the TLP bonding increases with increasing orientation deviation between the two substrates.