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Microstructure evolution and mechanical properties of the Sip/Zn- Al composite joints by ultrasonic-assisted soldering in air 被引量:4
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作者 Kang Yuqing Shen Haoran +7 位作者 Fu Yang Chen Yunru Xu Chang Li Xin Gu Keyun Li Xiaohai An Ledong Wang Qian 《China Welding》 EI CAS 2018年第2期39-44,共6页
Hypereutectic Al -27Si alloys were joined without flux by ultrasonic-assisted soldering at 420 ℃ in air using Zn -5Al the filler alloys, and Si particulate-reinforced Zn - Al based composites filler joints were obtai... Hypereutectic Al -27Si alloys were joined without flux by ultrasonic-assisted soldering at 420 ℃ in air using Zn -5Al the filler alloys, and Si particulate-reinforced Zn - Al based composites filler joints were obtained. The ultrasonic vibration introduced into soldering could influence the migration of Si particles and the microstructure of solidified Zn - Al based alloys. Both the distribution of Si particles and microstructure of the solidified Zn - Al based alloys affected the shear strength of joints. The shear strength increased with the ultrasonic vibration time. The highest average shear strength of joints reached to -68.5 MPa. Transcrystalline rupture mode was observed on the fracture surface. 展开更多
关键词 Hypereutectic Al - Si alloys ultrasonic soldering microstructure mechanical properties
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MCM组件盒体与盖板气密封装倒置钎焊工艺方法 被引量:11
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作者 解启林 朱启政 《电子工艺技术》 2007年第4期211-213,共3页
提出了MCM组件盒体与盖板气密封装的一种倒置钎焊工艺方法。将盒体、焊片、盖板预装在一起,倒置在加热台上,盖板直接接触热台,借助夹具、合适的盒体结构形式以及适当的焊接工艺参数,能够实现盒体底部温度低于封盖焊料熔点30℃以上且实... 提出了MCM组件盒体与盖板气密封装的一种倒置钎焊工艺方法。将盒体、焊片、盖板预装在一起,倒置在加热台上,盖板直接接触热台,借助夹具、合适的盒体结构形式以及适当的焊接工艺参数,能够实现盒体底部温度低于封盖焊料熔点30℃以上且实现气密封装,经测试,组件的电性能在封装前后没有明显变化,该方法操作简单、可靠,易于组件返修。 展开更多
关键词 MCM 气密封装 倒置钎焊
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