ALLOYING EFFECT OF Ni AND Cr ON THE WETTABILITY OF COPPER ON W SUBSTRATE

By the sessile drop technique, the wettability of Cu/W systems with the additions of Ni and Cr has been studied under vacuum atmosphere. Effects of Ni and Cr contents and wetting temperatures on the wettability and the wetting mechanisms of copper on W substrate have been investigated in detail. The results show that the wetting angles of Cu on the W substrate are decreased with an increase in the content of Ni or Cr, and also decrease with raising the wetting temperatures. SEM, EPMA, and X-ray diffraction have been used to analyze the interracial characteristics of the CuNi/W and CuCr/W systems. The results reveal that there is a transition layer about 2- 3μm in the interface of Cu-4.0 wt pct Ni/W, in which the interrnetallic phase Ni4W is precipitated. As to CuCr/W system, no reaction occurs at the interface. The two factors are that the contents of Cr and Ni and the infiltration temperature must be chosen appropriately in order to control the interfacial dissolution and reaction when the Cu- W alloys are prepared by the infiltration method.

Cube texture formation of Ni9.3W alloy substrates:preparation by optimized deformation sequence and anneal process

The Ni9.3W alloy with no ferromagnetism and high yield strength is one of the most promising textured substrate materials for coated conductors, but its low stacking fault energy makes it difficult to obtain a strong cube texture by traditional rolling methods and recrystal- lization anneals. This paper introduces four-time static recoveries during the rolling process. Rolled tapes with 80 μm in thickness were obtained by applying various deformation sequences between static recoveries to study their effects on the cube texture formation in Ni9.3W alloy substrates. The results show that rising gradient deformation sequence is an advantageous way to obtain a higher amount of cube texture, its content increases by 29.2% compared to that of traditional deformation sequence. The effect of the new recrystallization annealing process on the cube texture formation was analyzed. It is shown that the cube texture content increases with anneal temperature increasing in one-step anneal, but decreases again at higher anneal temperature. Two-step anneal could effectively improve the cube texture content, which could be further enhanced by extending holding time during the first-step anneal. However, too long holding time leads to the decrease in cube texture content. Finally, Ni9.3W alloy substrates with a cube texture content of -90.0 vol% （〈15°） are obtained by optimized two-step anneal.