Preparation of nanosized W/Cu composite powder by sol-gel technique

Cu(NO3)(2) and (NH4)(6)H(2)W(12)O(40)center dot 4H(2)O were used to prepare W/Cu nanosized composite powder by sol-gel technique. The influences of heat treatment process, pH value of the solution and the amount of an addition agent on particle size were investigated by DSC, XRD and TEM. The results show that, at a certain heat treatment temperature, the W/Cu nanoparticle size increases with the pH value or the amount of the addition agent increasing.

Microstructure and properties of Cu matrix composites reinforced with surface-modified Kovar particles

The thermal conductivity of Cu/Kovar composites was improved by suppressing element diffusion at the interfaces through the formation of FeWO_(4)coating on the Kovar particles via vacuum deposition.Cu matrix composites reinforced with unmodified(Cu/Kovar)and modified Kovar(Cu/Kovar@)particles were prepared by hot pressing.The results demonstrate that the interfaces of Cu/FeWO_(4)and FeWO_(4)/Kovar in the Cu/Kovar@composites exhibit strong bonding,and no secondary phase is generated.The presence of FeWO_(4)impedes interfacial diffusion within the composite,resulting in an increase in grain size and a decrease in dislocation density.After surface modification of the Kovar particle,the thermal conductivity of Cu/Kovar@composite is increased by 110%from 40.6 to 85.6 W·m^(-1)·K^(-1).Moreover,the thermal expansion coefficient of the Cu/Kovar@composite is 9.8×10^(-6)K^(-1),meeting the electronic packaging requirements.

W/Cu/S簇基超分子大环及其三阶非线性光学性质

以前驱簇[Et_(4)N][Tp*WS_(3)(CuCl)_(3)]与三氟甲烷磺酸银(AgOTf)及3个有机桥联配体2,5‑二(吡啶‑4‑基)噻吩(L1)、5,5'‑双(4‑吡啶基)‑2,2'‑双噻吩(L_(2))和2,7‑双(4‑吡啶基)芘(L_(3))分别反应,得到了3个阳离子型W/Cu/S簇基超分子大环化合物[(Tp*WS_(3)Cu_(3))_(2)(μ‑Cl)_(2)(μ_(4)‑Cl)(L_(1))]_(2)(OTf)_(2)(1)、[(Tp*WS_(3)Cu_(3))_(2)(μ‑Cl)_(2)(μ_(4)‑Cl)(L_(2))]_(2)(OTf)_(2)·2CHCl_(3)(2·2CHCl_(3))和[(Tp*WS_(3)Cu_(3))_(2)(μ‑Cl)_(2)(μ_(4)‑Cl)(L_(3))]_(2)(OTf)_(2)·2DMF(3·2DMF),其中Tp*=hydridotris(3,5‑dimethylpyrazol‑1‑yl)borate。对3个化合物分别进行了单晶X射线衍射、核磁、质谱、红外光谱、紫外可见光谱和元素分析等结构表征。单晶X射线衍射结果表明,3个大环的主体均是由2个L1、L_(2)和L_(3)配体和3个氯桥连接的[(Tp*WS_(3)Cu_(3))_(2)(μ‑Cl)_(2)(μ_(4)‑Cl)]^(2+)阳离子簇核组成。3个大环通过不同方式堆叠形成三维结构。核磁氢谱(^(1)H NMR)和电喷雾飞行质谱(ESI‑TOF MS)结果表明这些化合物在溶液中有较好的稳定性。Z扫描测试结果表明,3个化合物的溶液有一定的三阶非线性光学响应。

Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy

The Cu/Invar composites of 40% Cu were prepared by powder metallurgy, and the composites were rolled with 70% reduction and subsequently annealed at 750 ℃. Phases, microstructures and properties of the composites were then studied. After that, the amount of a-Fe（Ni,Co） in the composites is reduced, because a-Fe（Ni,Co） partly transfers into y-Fe（Ni,Co） through the diffusion of the Ni atoms into a-Fe（Ni,Co） from Cu. When the rolling reduction is less than 40%, the deformation of Cu takes place, resulting in the movement of the Invar particles and the seaming of the pores. When the rolling reduction is in the range from 40% to 60%, the deformations of Invar and Cu occur simultaneously to form a streamline structure. After rolling till 70% and subsequent annealing, the Cu/Invar composites have fine comprehensive properties with a relative density of 98.6%, a tensile strength of 360 MPa, an elongation rate of 50%, a thermal conductivity of 25.42 W/（m.K） （as-tested） and a CTE of 10.79× 10-6/K （20-100 ℃）.

Recent Advances in Interface Modification of Cu/graphite Composites and Layered Ternary Carbides of Modified Layer Candidate

We review the fundamental properties and significant issues related to Cu/graphite composites.In particular,recent research on the interfacial modification of Cu/graphite composites is addressed,including the metal-modified layer,carbide-modified layer,and combined modified layer.Additionally,we propose the use of ternary layered carbide as an interface modification layer for Cu/graphite composites.

Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density Motor

High-performance Cu/Graphene composite wire synergistically strengthened by nano Cr_(3)C_(2) phase was directly synthesized via hot press sintering followed by severe cold plastic deformation, using liquid paraffin and CuCr alloy powder as the raw materials. Since graphene is in situ formed under the catalysis of copper powder during the sintering process, the problem that graphene is easy to agglomerate and difficult to disperse uniformly in the copper matrix has been solved. The nano Cr_(3)C_(2)-particles nailed at the interface favor to improve the interface bonding. The Cu/Graphene composite possesses high electrical conductivity, hardness, and plasticity. The composite wire exhibits high electrical conductivity of 96.93% IACS, great tensile strength of 488MPa, and excellent resistance to softening. Even after annealing at 400℃ for 1 h, the tensile strength can still reach 268 MPa with a conductivity of about 99.14% IACS.The wire's temperature coefficient of resistance(TCR) is largely reduced to 0.0035/℃ due to the complex structure,which leads the wire to present low resistivity at higher temperatures. Such Cu/Graphene composite wire with excellent comprehensive performance has a good application prospect in high-power density motors.

Fabrication of an in-situ nanoAl_2O_3/Cu composite with high strength and high electric conductivity

A heat-resistant dispersion-strengthening nano-Al_2O_3/Cu composite with highstrength and high electric conductivity was fabricated in a multiplex medium. The internaloxidation product, microstructures and properties of the composite, and the process flow weresystematically studied. It is confirmed that this new technique simplifies the process and improvesthe properties of the composite. X-ray analysis indicates that the alumina particles formed duringinternal oxidation consist of a large mount of gamma-Al_2O_3 and a certain amount of theta-Al_2O_3and alpha-Al_2O_3. TEM observation shows that the obtained gamma-Al_2O_3 nano-particles areuniformly distributed in the copper grains; their mean size and space between particles are 7 runand 30 nm, respectively. The main properties of the composite with 50 percent cold deformation areas follows: the electric conductivity is 51 MS/m (87 percent IACS), sigma_b = 628 MPa, and thehardness is HRB86. After annealing at 1273 K, all or most of the above properties remain, and themicrostructures are still dependent on elongated fiber-form grains.

Tribological behavior of CNTs-Cu and graphite-Cu composites with electric current

CNTs-Cu and graphite-Cu composites were separately prepared by powder metallurgy technique under the same consolidation processing. Tribological behavior of the composites with electric current was investigated by using a pin-on-disk friction and wear tester. The results show that the friction coefficient and wear rate of the composites decrease with increasing the reinforcement content, and increase with increasing the electric current density; the effects of electric current are more obvious on tribological properties of graphite-Cu composites than on CNTs-Cu composites; for graphite-Cu composites the dominant wear mechanisms are electric arc erosion and adhesive wear, while for CNTs-Cu composites are adhesive wear.

Low-temperature heat conduction characteristics of diamond/Cu composite by pressure infiltration method

In this paper,diamond/CuCr and diamond/CuB composites were prepared using the pressure infiltration method.The physical property measurement system(PPMS)was adopted to evaluate the thermal conductivity of diamond/Cu and MoCu composites within the range of100–350 K,and a scanning electron microscope(SEM)was utilized to analyze the microstructure and fracture appearance of the materials.The research indicates that the thermal conductivity of diamond/Cu composite within the range of100–350 K is 2.5–3.0 times that of the existing MoCu material,and the low-temperature thermal conductivity of diamond/Cu composite presents an exponential relationship with the temperature.If B element was added to a Cu matrix and a low-temperature binder was used for prefabricated elements,favorable interfacial adhesion,relatively high interfacial thermal conductivity,and favorable low-temperature heat conduction characteristics would be apparent.

Influence of additives and concentration of WC nanoparticles on properties of WC−Cu composite prepared by electroplating

The effects of additives(polyethylene glycol(PEG),sodium dodecyl sulfate(SDS))and WC nano-powder on the microstructure,relative density,hardness and electrical conductivity of electroplated WC−Cu composite were investigated.The preparation mechanism was also studied.The microstructure of samples was analyzed by XRD,SEM,EDS,TEM and HRTEM.The synergistic effect of PEG and SDS made the WC−Cu composite more compact during the electroplating process.The hardness of WC−Cu composites increased with the increase in WC content,while the electrical conductivity decreased with the increase in WC content.The density of samples tended to increase initially and then decreased with increase in the additive content.When the electroplating solution contained 10 g/L WC nanopowder,0.2 g/L PEG and 0.1 g/L SDS,the WC−Cu composite exhibited hardness of HV 221 and electric conductivity of 53.7 MS/m.Therefore,the results suggest that WC−Cu composite with excellent properties can be obtained by optimizing the content of additives and WC particles.

Si/Cu3_Si@C Composite Encapsulated in CNTs Network as High Performance Anode for Lithium Ion Batteries

Si/Cu3Si@C composites encapsulated in CNTs network(SCC-CNTs) were synthesized via the combination of ball-milling and CVD methods. SCC-CNTs consist of conductive Cu3Si, amorphous carbon layer, cross-linked CNTs, and the etched pores, which can play the synergistic effects on the improvement of electronic conductivity and Li^+ diffusion. The volume expansion of Si anode is also suppressed during the electrochemical process. The SCC-CNTs composites demonstrate a remarkably improved electrochemical performance compared with pure Si, which can deliver a discharge capacity of 2 171 mAh·g^-1 at 0.4 A·g^-1 with ICE of 85.2%, and retain 1197 mAh· g^-1 after 150 cycles. This work provides a facile approach to massively produce the high-performance Si-based anode materials for next-generation LIBs.

Arc erosion behavior of a nanocomposite W-Cu electrical contact material

The erosion behavior of a nanocomposite W-Cu material under arc breakdown was investigated. The arc erosion rates of the material were determined, and the eroded surfaces and arc erosion mechanisms were studied by scanning eleclion microscopy. It is concluded that the nanocomposite W-Cu electrical contact material shows a characteristic of spreading arcs. The arc breakdown of a commercially used W-Cu alloy was limited in a few areas, and its average arc erosion rate is twice as large as that of the former. Furthermore, it is also proved that the arc extinction ability and arc stability of the nanocomposite W-Cu material are excellent, and melting is the major failure modality in the make-and-break operation of arcs.

High Temperature Flow Stress Prediction of Nano-Al_2O_3/Cu Composite Using an Artificial Neural Network

Alumina dispersion strengthened copper composite （nano-Al2O3/Cu composite） was recently emerged as a kind of potentially viable and attractive engineering material for applications requiring high strength, high thermal and electrical conductivities and resistance to softening at elevated temperatures. The nano-Al2O3/Cu composite was produced by internal oxidation. The microstructures of the composite were analyzed by the TEM and its hot deformation behavior was investigated by means of continuous compression tests performed on a Gleeble 1500 thermo-simulator. Making use of the modified algorithm-Levenberg-Marquardt （L-M） algorithm BP neural network, a model for predicting the flow stresses during hot deformation was set up on the base of the experimental data. Results show that the microstructures of the composite are characterized by uniform distribution of nano-Al2O3 particles in Cu-matrix. The sliding of dislocations is the main deformation mechanism. The dynamic recovery is the main softening mode with the flow stress decreasing gently from 500℃ to 850 ~C. The recrystallization of Cu-matrix can be retarded late into as high as 850 ℃, when it happens only partially. The well-trained BP neural network model can accurately describe the influence of the temperature, strain rate, and true strain on the flow stresses, therefore, it can precisely predict the flow stresses of the composite under given deforming conditions and provide a new way to optimize hot deforming process parameters.

Casting-cold extrusion of Al/Cu clad composite by copper tubes with different sketch sections

Casting-cold extrusion technology was presented to fabricate alttminum/copper clad composite, and copper tubes with different sketch sections were designed. The technology of aluminum/copper clad composite fabricated by casting-cold extrusion was simulated by DEFORM software using tubes with four arc grooves. The stress and strain in different deformation zones were analyzed. The groove size reduces gradually and the groove shape drives to triangle during the extrusion procedure. The maximum values of equivalent effective stress and radial stress appear in groove zones, and the maximum equivalent effective strain firstly is obtained also in groove zones. The grain size in groove zones is less than that in other zones. The experimental results are consistent with simulation results, which prove that the copper tubes with sketch section are favorable to the metallurgy bond of boundary interface between aluminum and copper.

Wear Behavior of Cu Matrix Composites Reinforced with Mixture of Carbon and Carbon Nanotubes

In order to improve wear resistance and decrease the cost, carbon and carbon nanotubes reinforced copper matrix composites were fabricated by the power metallurgy method. The effects of carbon （carbon and carbon nanotubes） volume fraction and applied load on the friction coefficient and wear rate under dry sliding of the composites were investigated at room temperature. By scanning electron microscopy （SEM）, the worn surfaces and debris were observed, and wear mechanism was also analyzed and discussed. The experimental wear process consists of the run-in, steady wear and severe wear process with the increasing of sliding distance. Both the friction coefficient and wear rate of the composites first decrease and then increase with the increasing of carbon volume fraction. The minimum friction coefficient and wear rate are obtained when carbon is 4.0vo1%. The wear mechanisms of the composites change from the adhesive wear and delamination wear to abrasive wear with the increasing of carbon volume fraction.

Microstructure and property of sub-micro WC-10 %Co particulate reinforced Cu matrix composites prepared by selective laser sintering

The WC-10%Co particulate reinforced Cu matrix composite material with a WC-Co∶Cu mass ratio of 20∶80 was successfully fabricated by selective laser sintering(SLS) process. The following optimal processing parameters were used: laser power of 700 W, scan speed of 0.06 m/s, scan line spacing of 0.15 mm, and powder layer thickness of 0.3 mm. The microstructure, composition, and phase of the laser processed material were investigated by scanning electron microscopy(SEM), X-ray diffraction(XRD), and energy dispersive X-ray(EDX) spectroscopy. The results show that the bonding mechanism of this process is liquid phase sintering. The Cu and Co act as the binder phase, while the WC acts as the reinforcing phase. The non-equilibrium effects induced by laser melting, such as high degrees of undercooling and high solidification rate, result in the formation of a metastable phase CoC0.25. The WC reinforcing particulates typically have three kinds of morphology. They are agglomerated and undissolved, incompletely separated and partially dissolved, separated and dissolved, which indicates that particle rearrangement acts as the dominant sintering mechanism for the larger WC, while dissolution-precipitation prevails for the smaller WC particles. Microhardness tester was used to determine the Vickers hardness across the cross-section of the laser sintered sample, with the average value being HV0.1268.5. However, the hardness varied considerably, which might be attributed to the WC segregation and the high solidification rate experienced by the molten pool.

RELATIONS BETWEEN INTERFACE OF CF/Al-4.5 Cu COMPOSITE AND SOLIDIFICATION PROCESSING

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Formation and growth of Cu-Al IMCs and their effect on electrical property of electroplated Cu/Al laminar composites

Cu/Al laminar composite was prepared by dipping Zn layer and then electroplating Cu thick layer on pure Al sheet.During annealing the Cu/Al composites at temperature from 473 to 673 K, the Cu/Al interfacial diffusion and reaction and itskinetics and also the electrical resistivity of the composites were studied. The results show that no Cu?Al IMC layer is observable asthe composites are annealed at 473 K for time till 360 h, indicating that the Zn intermediate layer can effectively suppress the Cu/Alinterfacial diffusion. However, as the composites are annealed at 573 K and above, Zn atoms in the Zn layer dissolve into the Culayer. Tri-layered reaction product of CuAl2/CuAl/Cu9Al4 then forms from the Al side to the Cu side. The IMC layer follows thediffusion-controlled growth kinetics. Electrical resistivity of the Cu/Al composites increases with the increase of the annealingtemperature and time.

Higher alcohol synthesis over Cu-Fe composite oxides with high selectivity to C_(2+)OH

Cu-Fe composite oxides were prepared by co-precipitation method and tested for higher alcohol synthesis from syngas. The selectivity to C2＋OH and C6＋OH in alcohol distribution was very high while the methane product fraction in hydrocarbon distribution was rather low, demonstrating a promising potential in higher alcohols synthesis from syngas. The distribution of alcohols and hydrocarbons approximately obeyed Anderson-Schulz-Flory distribution with similar chain growth probability, indicating alcohols and hydrocarbons derived from the same intermediates. The effects of Cu/Fe molar ratio, reaction temperature and gas hourly space velocity （GHSV） on catalytic performance were studied in detail. The sample with a Cu/Fe molar ratio of 10/1 exhibited the best catalytic performance. Higher reaction temperature accelerated water-gas-shift reaction and led to lower total alcohols selectivity. GHSV showed great effect on catalytic performance and higher GHSV increased the total alcohol selectivity, indicating there existed visible dehydration reaction of alcohol into hydrocarbon.

Structures,properties and responses to heat treatment of deformation processed Cu-15%Cr composite powders prepared by mechanical milling

Cu-15%Cr composite powders were produced from elemental powders by mechanical milling technique. The structures, properties and thermal stability of the composite powders were characterized by scanning and transmission electron microscopy (SEM and TEM, respectively), electron probe microanalysis(EPMA), X-ray diffractometry and microhardness testing. The results show that powders are first flattened into thin discs at the initial stage of milling and then evolved into spheroid on further milling. Lamellar structure in powders is produced after intermediate milling. The Cr laminas degenerate into particles uniformizing in Cu matrix with excessive milling. The microhardness values and internal strain sharply increase with increasing milling time. Nano-sized Cu grains were found by TEM analysis. The microstructural observations suggested that the composite powders have high thermal stability and both spherodisation and thermal grooving contribute to the instability of Cr