Microstructure and hardness of W-25Re alloy processed by high-pressure torsion

The evolution of microstructure and microhardness was studied in a commercial tungsten-25%rhenium(mass fraction)(W-25Re)alloy processed by the high pressure torsion(HPT)procedure under a pressure of7.7GPa up to10revolutions at different temperatures.The results show that the samples processed by10revolutions at room temperature could have the smallest grain size at around0.209μm.High saturation hardness(HV^1200)could be achieved after the rapid strengthening stage for samples processed by10revolutions both at room temperature and at573K.Microstructural observation and analysis from Hall-Patch relationship could reveal that grain refinement and grain boundaries strengthening are the main factors of hardening mechanism in W-25Re alloy.It is also demonstrated that sintered W-25Re sample may have brittle phase separation phenomenon after HPT processing.

Influence of high magnetic field on as-cast structure of Cu-25wt.%Ag alloys

To investigate the influence of high magnetic field (HMF) on the solidification microstructure of Cu-25wt.%Ag alloy, the Cu-25wt.%Ag alloy was prepared under HMF of 12 T, and for comparison, the alloy solidified without HMF was also fabricated. Macro and microstructures of the alloys were observed using the stereomicroscope, and scanning electron microscope, field emission scanning electron microscopy. The weight percentages of the pro-eutectic and eutectic, Cu phase and Ag phase in eutectic, and precipitates of Ag phase in pro-eutectic were analyzed by using of IPP software. Results show that the morphology of the column dendrites changes into cellular dendrites and the grains are refined under HMF of 12 T. Meanwhile, the thickness of the eutectic wall increases, but the sizes of Cu phase and Ag phase and the eutectic lamellar spacings are decreased. The Ag precipitates in the Cu matrix become coarser and sparser. The weight percentage variation of the phases in the microstructure and the Cu-Ag binary phase diagram reveals that the eutectic point moves to the left of the eutectic point in the equilibrium condition and the supersaturated solid solubility of Ag decreases under HMF.

Microstructure and Properties of W-15Cu Alloys Prepared by Mechanical Alloying and Spark Plasma Sintering Process

W-15Cu composite powders prepared by mechanical alloying （MA） of raw powders were consolidated by spark plasma sintering （SPS） process at temperature ranged 1 230-1 300 ℃ for 10 min and under a pressure of 30 MPa. By using high energy milling, particles containing very fine tungsten grains embedded in copper, called composite particles, could be produced. The W grains were homogeneously dispersed in copper phase, which was very important to obtain W-Cu alloy with high mechanical properties, fine and homogeneous microstructure. The microstructure and properties of W-15Cu alloys prepared by SPS processes at different temperature were researched. The results show that W-15Cu alloys consolidated by SPS can reach 99.6 % relative density, and transverse rupture strength （TRS） is 1 400.9 MPa, Rockwell C hardness （HRC） is 45.2, the thermal conductivity is 196 W/m-K at room temperature, the average grain size is less than 2 μm, and W-15Cu alloy with excellent properties, homogeneous and fine microstructure is obtained.

Effects of Pressure on the Solidification Microstructure of Mg65Cu25Y10 Alloy

The Mg65Cu25Y10 melts were quenched at a temperature of 973 K under various pressures in the range of 2-5 GPa and ambient pressure. The microstructure of the solidified specimens has been investigated by X-ray diffraction, transmission electron microscope and electron probe microanalysis. Experimental results show that the pressure has a great influence on the solidification microstructure of the Mg65Cu25Y10. At ambient pressure, the solidification products are Mg2(Cu,Y) and a very small amount of Y2O3 inclusion. As the pressure is above 2 GPa, a new Cu2(Y,Mg) phase appears, while Y2O3 is not observed at the pressure of 3, 4 and 5 GPa. When the pressure increases from 2 GPa to 5 GPa, the grain sizes of Mg2(Cu,Y) and Cu2(Y,Mg) decrease from 125, 96 nm to 80, 7 nm, respectively. The mechanisms for the effects of the pressure on the phase evolution and microstructure during solidification process of Mg65Cu25Y10 alloy have been discussed.

Crystallization kinetics of amorphous Zr_(65)Cu_(25)Al_(10) alloy

Crystallization behavior of amorphous Zr 65 Cu 25 Al 10 alloy under isothermal annealing condition was investigated by DSC and XRD. It is found that two exothermic peaks appear in the DSC curve of amorphous Zr 65 Cu 25 Al 10 alloy, indicating that the crystallization proceeds through double stage mode. The crystallization process of amorphous Zr 65 Cu 25 Al 10 alloy under isothermal annealing condition is mainly controlled by nucleation and one dimensional growth with the crystallized volume fraction smaller than 70%. With the crystallized volume fraction ranging from 70% to 90%, crystallization process is mainly dominated by the growth of three dimensional pre existing quench in nuclei. And when the crystallized volume fraction reaches above 90%, transient nucleation becomes the master of the crystallization process.

Effects of Activated Sintering Process on Properties and Microstructure of W-15Cu Alloy

The effects of activated sintering technology of H2 atmosphere sintering on the microstructure and properties of W-15Cu alloy using ultrafine W-15Cu composite powder fabricated by spray drying calcining-continuous reduction technology were investigated.The experimental results showed that W-15Cu alloy,consolidated by activated sintering technology of H2 atmosphere sintering for 1 h at 1300 ℃,with 98.5 % relative density,transverse rupture strength 1218 MPa,Vickers hardness HV0.5 378,average grain size about 1.2 μm and thermal conductivity 192 W/m·K,was obtained.In comparison to the normal sintering process,activated sintering process to W-15Cu alloy could be achieved at lower sintering temperature.Furthermore,better properties in activated sintered compacts were obtained,and activated sintering process resulted in finer microstructure and excellent properties.

Ti600和Ni-25%Si合金钎焊接头性能及失效机理分析

采用Ti-Zr-Ni-Cu非晶钎料对高温钛合金Ti600和Ni-25%Si(原子分数,%)合金进行钎焊试验,重点研究了钎焊温度对镍硅与钛合金接头组织及性能的影响,结合接头组织特征及断口结构分析阐明了Ti600和Ni-25%Si合金钎焊接头的失效机理.结果表明,钎缝内部包含多个区域,随着连接温度从900℃上升至980℃,包含(Ti,Zr)2Si和Ti2Ni相的区域逐渐消失,包含Ti5Si3和Ti2Ni相的区域逐渐变厚,最终占据全部钎缝.力学性能分析表明,随着钎焊温度的升高,接头抗剪强度先增大后降低.当钎焊温度为960℃时,接头的抗剪强度能够达到峰值177 MPa.在脆性Ti2Ni相基体上弥散分布的Ti5Si3相颗粒破坏了Ti2Ni相的连续性,阻碍了裂纹在钎缝内部的扩展是钎焊接头抗剪强度提升的根本原因.

光伏电力开关用W-25Cu复合材料的微观组织和抗电弧侵蚀性研究

通过水热-共还原法制备细晶W-25Cu复合材料,并分析其微观组织和电弧侵蚀后组织形态的变化。结果表明:W-25Cu复合材料的显微组织具有明显的全致密化特点,Cu相将细小W颗粒全部包围,Cu相与W相的分布状态非常均匀,W相的晶粒尺寸为1~3μm,断口区域表现出明显的韧窝断裂特征,断裂阶段还生成了众多弯曲的细密撕裂棱,形成了许多稠密的细小断口韧窝。经电弧侵蚀后,表面物相构成以Cu、W两相为主,表面形貌较为平整,未出现明显的孔洞与裂纹结构。在断裂闭合阶段,材料转移过程基本表现为电弧转移、熔桥转移及喷溅蒸发这几种类型。

共还原工艺对W-25Cu纳米复合粉体及其挤压组织与性能的影响

以钨酸钠（Na2WO4·2H2O）和硝酸铜（Cu（NO3）2·3H2O）为原料,采用水热-共还原工艺制备W-25Cu纳米复合粉末,包套热挤压工艺制备细晶W-25Cu合金。利用X射线衍射仪（XRD）、扫描电镜（SEM）和透射电镜（TEM）等分析测试手段研究了共还原工艺对W-25Cu复合粉体及其挤压组织与性能的影响。研究结果表明：相比于一段还原工艺,两段还原过程中先还原出的Cu相能够通过增加异相形核细化晶粒,对后续W相的还原具有催化与细化作用。两段还原得到的W-Cu复合粉体微观组织呈典型的钨包铜结构,粒度达到纳米级,分散性良好。烧结热挤压后,制备的合金具有细密组织与良好性能,致密度达到99.52%,硬度提高到HB 272,导电率提高到52.8%IACS,抗拉强度达到282 MPa。