Warpage prediction of the injection-molded strip-like plastic parts

For most strip-like plastic injection molded parts, whose cross section size is much smaller than their length, the traditional Hele-Shaw model and three-dimensional model do not work well in the prediction of the warpage be- cause of their special shape. A new solution was suggested in this work. The strip-like plastic part was regarded as a little-curved beam macrnscopically, and was divided into a few one-dimensional elements. On the section of each elemental node location, two-dimensional thermal finite element analysis was made to obtain the non- uniform thermal stress caused by the time difference of the solidification of the plastic melt in the mold. The stress relaxation, or equivalently, strain creep was dealt with by using a special computing model. On the bases of in-mold elastic stress, the final bending moment to the beam was obtained and the warpage was predict- ed in good a^reement with practical cases.

Effects of process parameters on warpage of rapid heat cycle moulding plastic part

The effects of process parameters in rapid heat cycle moulding （RHCM） on parts warpage were investigated. A vehicle-used blue-tooth front shell （consisting of ABS material） was considered as a part example manufactured by RHCM method. The corresponding rapid heat response mould with an innovational conformal heating/cooling channel system and a dynamic mould temperature control system based on the Jll-W-160 type precise temperature controller was proposed. During heating/cooling process, the mould was able to be heated from room temperature to 160 ~C in 6 s and then cooled to 80 ~C in 22 s. The effects of processing conditions in RHCM on part warpage were investigated based on the single factor experimental method and Taguchi theory. Results reveal that the elevated mould temperature reduces unwanted freezing during the injection stage, thus improving mouldability and enhancing part quality, whereas the overheated of mould temperature will lead to defective product. The feasible mould temperature scope in RHCM should be no higher than 140 ~C, and the efficient mould temperature scope should be around the polymer heat distortion temperature. Melt temperature as well as injection pressure effects on warpage can be divided into two stages The lower stage gives a no explicit effect on warpage whereas the higher stage leads to a quasi-linear downtrend. But others affect the warpage as a V-type fluctuation, reaching to the minimum around the heat distortion temperature. Under the same mould temperature condition, the effects of process parameters on warpage decrease according to the following order, packing time, packing pressure, melt temperature, injection pressure and cooling time, respectively.

Pre-compensation of Warpage for Additive Manufacturing

Additive manufacturing technologies enable the production of parts by successively adding layers. In powder-based technologies, each powder layer is selectively solidified following the respective cross-section of the parts either by the application of high-energy radiation or by the selective deposition of binder. By repeating the steps of layer deposition and selective solidification, parts are fabricated. The layer-wise build-up and the ambient conditions lead to warpage of the parts due to the temporarily and locally uneven distribution of shrinkage throughout the part. This leads to deviations in shape and dimension. The development of these technologies fosters a change fi＇om prototyping to manufacturing applications, As a consequence, higher standards regarding the shape and dimensional accuracy are required. Therefore, new strategies to minimize the resulting deformations are necessary to reduce rejects and widen the range of applications of the described technologies. In this paper, an empirical, a knowledge-based and a simulative approach for warpage compensation are introduced. They are all based on the pre-deformation of the digital 3D part geometry inverse to the expected deformation during manufacturing. The aim of the research is the development of a comprehensive method that enables users to improve their part-quality by supporting the pre-deformation process. Contrary to existing work, this method should not be process-specific but cover a wide range of additive manufacturing techniques. Typical forms of deformation of the processes laser sintering, laser beam melting and 3D printing （powder-binder） are presented and compensation strategies are disenssed. Finally, an outlook on the ongoing research is given.

Effect of warpage on the electronic structure and optical properties of bilayer germanene

The electronic structure and optical properties of bilayer germanene under different warpages are studied by the first-principles method of density functional theory.The effects of warpages on the electronic structure and optical properties of bilayer germanene are analyzed.The results of the electronic structure study show that the bottom of the conduction band of bilayer germanene moves to the lower energy direction with the increase of warpages at the K point,and the top of the valence band stays constant at the K point,and so the band gap decreases with the increase of warpage.When the warpage is 0.075 nm,the top of the valence band of bilayer germanene changes from K point to G point,and the bilayer germanene be-comes an indirect band gap semiconductor.This is an effective means to modulate the conversion of bilayer germanene between direct band gap semiconductor and indirect band gap semiconductor by adjusting the band structure of bilayer ger-manene effectively.The study of optical properties shows that the effect of warpage on the optical properties of bilayer ger-manene is mainly distributed in the ultraviolet and visible regions,and the warpage can effectively regulate the electronic struc-ture and optical properties of bilayer germanene.When the warpage is 0.069 nm,the first peak of dielectric function and extinc-tion coefficient is the largest,and the energy corresponding to the absorption band edge is the smallest.Therefore,the elec-tron utilization rate is the best when the warpage is 0.069 nm.

Flash Lamp Annealing Method for Improving Adhesion Strength on the Dielectric Material and Reducing Substrate Warpage

Today’s electronic devices have required higher performance properties for 5G and artificial intelligence(AI).High-performance system on chip(SOC),graphic processing unit(GPU),and central processing unit(CPU)requires advanced packages to meet demands for performance,size,and high-speed transmission.To respond to these demands,integration approaches such as 3D IC chip stacking,package on package(PoP),2.5D interposer integration,system-in-package(SiP),and fan-out packaging technologies have emerged[6,8,11,12].Therefore,the package substrate for high-performance device will require low transmission loss and the small package warpage.Low loss materials have limitation of seed layer formation with electroless Cu plating.Also,heat treatment has major impact on substrate warpage in order for growth of plated Cu metal and curing for epoxy mold compound(EMC)process.In this paper,we believe it is possible to create a seed layer on the low-loss material by combining electroless Cu plating and flash lamp annealing(FLA)method instead of sputtering process.In terms of warpage control and metal growth,the flash lamp treatment,not the conventional convection or hot plate type heat treatment,could improve electro-migration between metal line and line through improving large number of(111)slip directions.In addition,flash lamp not only provides alternative to conventional heat treatment process but also significantly reduces substrate warpage.Through result of this study,by using FLA method for advanced package,it is possible to provide solutions in improving adhesion strength between dielectric materials and deposited metal film,and to reduce the warpage of the substrate.

Large Format Encapsulation

This paper will review the challenges on large format encapsulation with respect to the control of mold cap thickness, and the encapsulant impact on moldability such as flow mark on final product. Control of mold co-planarity is best performed dynamically during molding, otherwise it would be challenging to obtain good co-planarity within 20 μm. Moldability demand such as encapsulant coverage with highly viscous material, flowability and flow mark will be discussed. Warpage control depends heavily on the formulation of the encapsulant and the form of encapsulant, i.e., granular/powder, liquid and sheet.

Single gate optimization for plastic injection mold

This paper deals with a methodology for single gate location optimization for plastic injection mold. The objective of the gate optimization is to minimize the warpage of injection molded parts, because warpage is a crucial quality issue for most injection molded parts while it is influenced greatly by the gate location. Feature warpage is defined as the ratio of maximum displacement on the feature surface to the projected length of the feature surface to describe part warpage. The optimization is combined with the numerical simulation technology to find the optimal gate location, in which the simulated annealing algorithm is used to search for the optimum. Finally, an example is discussed in the paper and it can be concluded that the proposed method is effective.

Optimization of Injection Molding Process of Bearing Stand Based on BP Network Method

The quality of injection plastic molded parts relates to precise geometry,smooth surface,strength,durability,and other indicators that are associated with the mold,materials,injection process,and service environment.The warpage is one of main defects of injection products,which cost much time and materials.In order to minimize warpage to ensure the precise shape of molded parts,it needs to combine design,service conditions,process parameters,material properties,and other factors in the design and manufacturing.Finite element tools and material database are used to analyze the occurrence of warpage,and analysis results contribute to the improvement and optimization of injection molding process of typical parts.To find the optimal process parameters in the solution space,experimental data are used to establish backpropagation(BP)network for predicting warpage of a bearing stand based on analysis with Moldflow.With a proper transfer function and the BP network architecture,results from the BP network method satisfiy the criteria of accuracy.The optimal solutions are searched in the BP network by the genetic algorithm with the finding that the optimization method based on the BP network is efficient.

Optimization of Processing Parameters for Minimizing Warpage of Large Thin-walled Parts in Whole Stages of Injection Molding

This study investigated total warpage of a type of motorcycle seat support made of polypropylene（PP） during the entire process of injection molding and free-cooling after demolding. Finite element modeling（FEM） analysis for injection molding and its associated thermal deformation was carried out in the study. The effects of processing parameters on warpage occurring in different stages were analyzed by Taguchi optimization method. It was found that packing pressure is the major factor that affects warpage in the injection stage, whereas cooling time is the major factor in free-cooling stage. From an overall evaluation, melt temperature affects the total warpage most, followed by cooling time, packing pressure, packing time and mold temperature. The result proved that optimum parameters for minimizing final warpage of the injected parts can be obtained only when the deformation in the entire manufacturing process is addressed in both molding and demolding stages.

Experimental evaluation and simulation of volumetric shrinkage and warpage on polymeric composite reinforced with short natural fibers

A polymeric natural fiber-reinforced composite is developed by extrusion and injection molding process. The shrinkage and warpage of high-density polyethylene reinforced with short natural fibers of Guadua angustifolia Kunth are analyzed by experimental measure- ments and computer simulations. Autodesk Moldflow and Solid Works are employed to simulate both volumetric shrinkage and warpage of injected parts at different configurations： 0wt.%, 20wt.%, 30wt.% and 40 wt.% reinforcing on shrinkage and warpage behavior of polymer composite. Become evident the restrictive effect of reinforcing on the volumetric shrinkage and warpage of injected parts. The results indicate that volumetric shrinkage of natural composite is reduced up to 58% with fiber increasing, whereas the warpage shows a reduction form 79% to 86% with major fiber content. These results suggest that it is a highly beneficial use of natural fibers to improve the assembly properties of polymeric natural fiber-reinforced composites.

Analysis of longitude profiled rolling process of Cu/Al cladded sheet and evaluation of outlet warpage

Longitude profiled cladded sheet is obtained by rolling bimetal cladded sheet with variable gauge rolling technology.The longitude profiled rolling process of Cu/Al cladded sheets was studied by finite element method and experiments.The rolling force rises with the increase in reduction,and a sudden change appears at the end of the thickness variation zone.The thickness ratio of copper layer is enlarged after rolling owing to its relatively large deformation resistance and continues to rise with the increase in reduction rate.Lower elongation of copper side leads to the warpage of exit metal to copper side,which further hinders the deformation of copper.The influence of asymmetric rolling parameters indicates that increasing the work roll diameter ratio,speed radio,and friction coefficient on Al side can reduce the warpage when the reduction rate is below a certain value depending on the thickness ratio and other rolling parameters.Comparison of experiments and simulation results showed good agreement and verified the finite element model.

Analytical investigation on thermal-induced warpage behavior of ultrathin chip-on-flex(UTCOF) assembly

The serious warpage issues of ultrathin chip-on-flex(UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technology. Currently, a theoretical prediction as a convenient and straightforward approach is still lacked for describing effectively the thermal-mechanical behavior of UTCOF during the adhesive curing and cooling process. In consideration of the adhesive thickness approximating to ultrathin chip and flexible substrate thickness, we develop a layerwise-model of ultrathin chip-adhesive-flex structure under plain strain condition, where the behavior of thick adhesive bonding can be described precisely through increasing the subdivided mathematical plies. Further, the analytical results show that the concave and convex forms of ultrathin chip warpage yield at the end of the curing and cooling process respectively. Meanwhile, the effects of its structure dimensions and material properties are also revealed for discussing a way to relieve the extent of ultrathin chip warpage. Additionally, in order to verify the validity of the theoretical prediction, we also introduce the corresponding numerical technique and experimental method. These results suggest that a kind of rigid and ultrathin flexible substrate such as metal foil should be adopted for small warpage of ultrathin assembly.

Numerical investigation of a novel pattern for reducing residual stress in metal additive manufacturing

Deposition patterns can significantly affect residual stress distribution in additive manufacturing processes.In this paper,a novel pattern,the S-pattern,is proposed for the metal additive manufacturing process.The finite element method is used to study the temperature field and the stress field of a cuboid structure under the S-pattern and five other representative patterns:zig-zag,raster,alternate-line,in-out spiral,and out-in spiral.The results show that the S-pattern achieves the lowest values of both equivalent residual stress and maximum principal residual stress,and the warpage of the S-pattern is close to that of counterparts.By analyzing the temperature and stress fields under all patterns,it is found that the residual stress distribution is determined by the uniformity of temperature distribution which is correlated with the peak temperatures of corners.The equivalent residual stress and the maximum principal residual stress are inversely correlated with the average peak temperature and the minimum peak temperature of corners,respectively.These correlations between temperature and residual stress provide an effective approach to evaluate the residual stress of different patterns and guide the deposition process in practice.