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A novel cleaner for colloidal silica abrasive removal in post-Cu CMP cleaning 被引量:6
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作者 邓海文 檀柏梅 +3 位作者 高宝红 王辰伟 顾张冰 张燕 《Journal of Semiconductors》 EI CAS CSCD 2015年第10期161-165,共5页
A novel cleaning solution, named FA/O alkaline cleaner, was proposed and demonstrated in the removal of colloidal silica abrasives. In order to remove both the chemical and physical absorbed colloidal silica abrasives... A novel cleaning solution, named FA/O alkaline cleaner, was proposed and demonstrated in the removal of colloidal silica abrasives. In order to remove both the chemical and physical absorbed colloidal silica abrasives, an FA/OII chelating agent and non-ionic surfactant were added into the cleaner. By varying the concentration of chelating agent and non-ionic surfactant, a series of experiments were performed to determine the best cleaning results. This paper discusses the mechanism of the removal of colloidal silica abrasives with a FA/O alkaline cleaner. Based on the experiment results, it is concluded that both the FA/OII chelating and non-ionic surfactant could benefit the removal of colloidal silica abrasives. When the concentration of FAJOII chelating agent and FA/O non-ionic surfactant reached the optima value, it was demonstrated that silica abrasives could be removed efficiently by this novel cleaning solution. 展开更多
关键词 colloidal silica abrasives removal FA/O alkaline cleaner non-ionic surfactant surface roughness
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