Silicon carbide (SiC) is an excellent microelectronic material used to fabricate high frequency, high temperature,high power and non-volatile memory devices.But due to its indirect band gap,SiC based LED cant emit lig...Silicon carbide (SiC) is an excellent microelectronic material used to fabricate high frequency, high temperature,high power and non-volatile memory devices.But due to its indirect band gap,SiC based LED cant emit light so efficiently as GaN based LED, so people are eager to seek effective means to improve its luminescence efficiency. Amorphous SiC, porous crystalline SiC, nanometer SiC produced by CVD methods and porous SiC formed by ion implantation are investigated, and great progresses have been gained during the latest few years,which make SiC a promising material for developing OEIC.展开更多
A parametric study for a series of technological and geometrical parameters affecting rise time of Al/aSiC/c-Si（p）/c-Si（n~＋）/Al thyristor-like switches,is presented here for the first time,using two-dimensional s...A parametric study for a series of technological and geometrical parameters affecting rise time of Al/aSiC/c-Si（p）/c-Si（n~＋）/Al thyristor-like switches,is presented here for the first time,using two-dimensional simulation techniques.By varying anode current values in simulation procedure we achieved very good agreement between simulation and experimental results for the rising time characteristics of the switch.A series of factors affecting the rising time of the switches are studied here.Two factors among all others studied here,exerting most significant influence,of more than one order of magnitude on the rising time,are a-SiC and c-Si（p） region widths,validating our earlier presented model for device operation.The above widths can be easily varied on device manufacture procedure.We also successfully simulated the rising time characteristics of our earlier presented simulated improved switch,with forward breakover voltage V（BF） = 11 V and forward voltage drop VF = 9.5 V at the ON state,exhibiting an ultra low rise time value of less than 10 ps,which in conjunction with its high anode current density values of 12 A/mm^2 and also cheap and easy fabrication techniques,makes this switch appropriate for ESD protection as well as RF MEMS and NEMS applications.展开更多
文摘Silicon carbide (SiC) is an excellent microelectronic material used to fabricate high frequency, high temperature,high power and non-volatile memory devices.But due to its indirect band gap,SiC based LED cant emit light so efficiently as GaN based LED, so people are eager to seek effective means to improve its luminescence efficiency. Amorphous SiC, porous crystalline SiC, nanometer SiC produced by CVD methods and porous SiC formed by ion implantation are investigated, and great progresses have been gained during the latest few years,which make SiC a promising material for developing OEIC.
文摘A parametric study for a series of technological and geometrical parameters affecting rise time of Al/aSiC/c-Si（p）/c-Si（n~＋）/Al thyristor-like switches,is presented here for the first time,using two-dimensional simulation techniques.By varying anode current values in simulation procedure we achieved very good agreement between simulation and experimental results for the rising time characteristics of the switch.A series of factors affecting the rising time of the switches are studied here.Two factors among all others studied here,exerting most significant influence,of more than one order of magnitude on the rising time,are a-SiC and c-Si（p） region widths,validating our earlier presented model for device operation.The above widths can be easily varied on device manufacture procedure.We also successfully simulated the rising time characteristics of our earlier presented simulated improved switch,with forward breakover voltage V（BF） = 11 V and forward voltage drop VF = 9.5 V at the ON state,exhibiting an ultra low rise time value of less than 10 ps,which in conjunction with its high anode current density values of 12 A/mm^2 and also cheap and easy fabrication techniques,makes this switch appropriate for ESD protection as well as RF MEMS and NEMS applications.
