Product family modeling technology for customized cosmetic packaging design based on basic-element theory

Background:As the market demands change,SMEs(small and medium-sized enterprises)have long faced many design issues,including high costs,lengthy cycles,and insufficient innovation.These issues are especially noticeable in the domain of cosmetic packaging design.Objective:To explore innovative product family modeling methods and configuration design processes to improve the efficiency of enterprise cosmetic packaging design and develop the design for mass customization.Methods:To accomplish this objective,the basic-element theory has been introduced and applied to the design and development system of the product family.Results:By examining the mapping relationships between the demand domain,functional domain,technology domain,and structure domain,four interrelated models have been developed,including the demand model,functional model,technology model,and structure model.Together,these models form the mechanism and methodology of product family modeling,specifically for cosmetic packaging design.Through an analysis of a case study on men’s cosmetic packaging design,the feasibility of the proposed product family modeling technology has been demonstrated in terms of customized cosmetic packaging design,and the design efficiency has been enhanced.Conclusion:The product family modeling technology employs a formalized element as a module configuration design language,permeating throughout the entire development cycle of cosmetic packaging design,thus facilitating a structured and modularized configuration design process for the product family system.The application of the basic-element principle in product family modeling technology contributes to the enrichment of the research field surrounding cosmetic packaging product family configuration design,while also providing valuable methods and references for enterprises aiming to elevate the efficiency of cosmetic packaging design for the mass customization product model.

Modified Atmospheric Packaging and Its Effect on Postharvest Cannabis Quality

Cannabis sativa L. is used as fiber, food, and medicine in several countries. Though it is illegal for recreational use in most of the world, there are some countries that have legalized production and sale. There is a lot of research on production of cannabis, but less so on storage technologies. Cannabis contains several high value compounds, such as cannabinoids and terpenoids, that are susceptible to degradation via light, temperature, and oxygen. Several studies have explored temperature and light, and industry has adjusted accordingly. However, less is known about oxygen-induced degradation. Biochemical studies have demonstrated oxidative degradation of high value compounds, and many producers use some form of modified atmospheric packaging (MAP) for storage. However, the efficacy of MAP is unclear. The objective of this paper is to review our current understanding of MAP in postharvest cannabis storage and identify avenues where additional research is needed.

Luminescence regulation of Sb^(3+)in 0D hybrid metal halides by hydrogen bond network for optical anti-counterfeiting

The Sb^(3+) doping strategy has been proven to be an effective way to regulate the band gap and improve the photophysical properties of organic-inorganic hybrid metal halides(OIHMHs).However,the emission of Sb^(3+) ions in OIHMHs is primarily confined to the low energy region,resulting in yellow or red emissions.To date,there are few reports about green emission of Sb^(3+)-doped OIHMHs.Here,we present a novel approach for regulating the luminescence of Sb^(3+) ions in 0D C_(10)H_(2)_(2)N_(6)InCl_(7)·H_(2)O via hydrogen bond network,in which water molecules act as agents for hydrogen bonding.Sb^(3+)-doped C_(10)H_(2)2N_(6)InCl_(7)·H_(2)O shows a broadband green emission peaking at 540 nm and a high photoluminescence quantum yield(PLQY)of 80%.It is found that the intense green emission stems from the radiative recombination of the self-trapped excitons(STEs).Upon removal of water molecules with heat,C_(10)H_(2)_(2)N_(6)In_(1-x)Sb_(x)Cl_(7) generates yellow emis-sion,attributed to the breaking of the hydrogen bond network and large structural distortions of excited state.Once water molecules are adsorbed by C_(10)H_(2)_(2)N_(6)In_(1-x)Sb_(x)Cl_(7),it can subsequently emit green light.This water-induced reversible emission switching is successfully used for optical security and information encryption.Our findings expand the under-standing of how the local coordination structure influences the photophysical mechanism in Sb^(3+)-doped metal halides and provide a novel method to control the STEs emission.

High-resolution imaging of magnetic fields of banknote anti-counterfeiting strip using fiber diamond probe

Counterfeiting of modern banknotes poses a significant challenge,prompting the use of various preventive measures.One such measure is the magnetic anti-counterfeiting strip.However,due to its inherent weak magnetic properties,visualizing its magnetic distribution has been a longstanding challenge.In this work,we introduce an innovative method by using a fiber optic diamond probe,a highly sensitive quantum sensor designed specifically for detecting extremely weak magnetic fields.We employ this probe to achieve high-resolution imaging of the magnetic fields associated with the RMB 50denomination anti-counterfeiting strip.Additionally,we conduct computer simulations by using COMSOL Multiphysics software to deduce the potential geometric characteristics and material composition of the magnetic region within the anti-counterfeiting strip.The findings and method presented in this study hold broader significance,extending the RMB 50 denomination to various denominations of the Chinese currency and other items that employ magnetic anti-counterfeiting strips.These advances have the potential to significantly improve and promote security measures in order to prevent the banknotes from being counterfeited.

Sustainable, thermoplastic and hydrophobic coating from natural cellulose and cinnamon to fabricate eco-friendly catering packaging

Non-degradable polymers cause serious environmental pollution problem,such as the widely-used while unrecyclable coatings which significantly affect the overall degradation performance of products.It is imperative and attractive to develop biodegradable functional coatings.Herein,we proposed a novel strategy to successfully prepare biodegradable,thermoplastic and hydrophobic coatings with high transparence and biosafety by weakening the interchain interactions between cellulose chain.The natural cellulose and cinnamic acid were as raw materials.Via reducing the degree of polymerization(DP)of cellulose and regulating the degree of substitution(DS)of cinnamate moiety,the obtained cellulose cinnamate(CC)exhibited not only the thermalflow behavior but also good biodegradability,which solves the conflict between the thermoplasticity and biodegradability in cellulose-based materials.The glass transition temperature(T_(g))and thermalflow temperature(T_(f))of the CC could be adjusted in a range of 150–200℃ and 180–210℃,respectively.The CC with DS<1.2 and DP≤100 degraded more than 60%after an enzyme treatment for 7 days,and degraded more than 80%after a composting treatment for 42 days.Furthermore,CC had no toxicity to human epidermal cells even at a high concentration(0.5 mg mL^(-1)).In addition,CC could be easily fabricated into multifunctional coating with high hydrophobicity,thermal adhesion and high transparence.Therefore,after combining with cellophane and paperboard,CC coating with low DP and DS could be used to prepare fully-biodegradable heat-sealing packaging,art paper,paper cups,paper straws and food packaging boxes.

Synergism of Zinc Oxide/Organoclay-Loaded Poly(lactic acid) Hybrid Nanocomposite Plasticized by Triacetin for Sustainable Active Food Packaging

The synergistic effect of organoclay(OC)and zinc oxide(ZnO)nanoparticles on the crucial properties of poly(lactic acid)(PLA)nanocompositefilms was systematically investigated herein.After their incorporation into PLA via the solvent casting technique,the water vapor barrier property of the PLA/OC/ZnOfilm improved by a maximum of 86%compared to the neat PLAfilm without the deterioration of Young’s modulus or the tensile strength.Moreover,thefilm’s self-antibacterial activity against foodborne pathogens,including gram-negative(Escherichia coli,E.coli)and gram-positive(Staphylococcus aureus,S.aureus)bacteria,was enhanced by a max-imum of approximately 98–99%compared to the neat PLAfilm.Furthermore,SEM images revealed the homo-geneous dispersion of both nano-fillers in the PLA matrix.However,the thermal stability of thefilm decreased slightly after the addition of the OC and ZnO.Thefilm exhibited notable light barrier properties in the UV-Vis range.Moreover,the incorporation of a suitable biodegradable plasticizer significantly decreased the Tg and notably enhanced theflexibility of the nanocompositefilm by increasing the elongation at break approxi-mately 1.5-fold compared to that of the neat PLAfilm.This contributes to its feasibility as an active food packa-ging material.

Analysis of quality-related proteins in golden pompano(Trachinotus ovatus)fillets with modified atmosphere packaging under superchilling storage

Here,we aimed to study the changes in proteome of golden pompano fillets during post-mortem storage.Tandem mass tags(TMT)-labeled quantitative proteomic strategy was applied to investigate the relationships between protein changes and quality characteristics of modified atmosphere packaging(MAP)fillets during superchilling(-3°C)storage.Scanning electron microscopy was used to show that the muscle histology microstructure of fillets was damaged to varying degrees,and low-field nuclear magnetic resonance was used to find that the immobilized water and free water in the muscle of fillets changed significantly.Total sulfhydryl content,TCA-soluble peptides and Ca2+-ATPase activity also showed that the fillet protein had a deterioration by oxidation and denaturation.The Fresh(FS),MAP,and air packaging(AP)groups were set.Total of 150 proteins were identified as differential abundant proteins(DAPs)in MAP/FS,while 209 DAPs were in AP/FS group.The KEGG pathway analysis indicated that most DAPs were involved in binding proteins and protein turnover.Correlation analysis found that 52 DAPs were correlated with quality traits.Among them,8 highly correlated DAPs are expected to be used as potential quality markers for protein oxidation and water-holding capacity.These results provide a further understanding of the muscle deterioration mechanism of packaging golden pompano fillets during superchilling.

Study on the Influence of Food Packaging on the Psychology of Different Groups of Consumers

With the vigorous development of consumer culture in today’s society,various types of food packaging also appear in front of consumers in different forms.There are very big differences in food packaging in terms of shape,color,style and other aspects of information transmission,which have the most direct impact on the audience’s food consumption needs.Driven by the consumption-oriented society,food packaging has shown very obvious comprehensive characteristics,is significantly interdisciplinary,and has close connections with other disciplines.This article will analyze and sort out the impact of food packaging on consumer psychology from different perspectives.

Research on Silicon Carbide Dispersion-Reinforced Hypereutectic Aluminum-Silicon Electronic Packaging Materials

The objective of this study is to improve the mechanical properties and machining performance of high thermal conductivity and low expansion silicon carbide dispersion-strengthened hypereutectic aluminum-silicon electronic packaging materials to meet the needs of aviation,aerospace,and electronic packaging fields.We used the powder metallurgy method and high-temperature hot pressing technology to prepare SiC/Al-Si composite materials with different SiC contents(5vol%,10vol%,15vol%,and 20vol%).The results showed that as the SiC content increased,the tensile strength of the composite material first increased and then decreased.The tensile strength was the highest when the SiC content was 15%;the sintering temperature significantly affected the composite material’s structural density and mechanical properties.Findings indicated 700℃was the optimal sintering and the optimal SiC content of SiC/Al-Si composite materials was between 10%and 15%.Besides,the sintering temperature should be strictly controlled to improve the material’s structural density and mechanical properties.

Microstructure and properties of electronic packaging box with high silicon aluminum-base alloy by semi-solid thixoforming

The electronic packaging box with high silicon aluminum-base alloy was prepared by semi-solid thixoforming technique.The flow characteristic of the Si phase was analyzed.The microstructures of different parts of the box were observed by optical microscopy and scanning electron microscopy,and the thermophysical and mechanical properties of the box were tested.The results show that there exists the segregation phenomenon between the primary Si phase and the liquid phase during thixoforming,the liquid phase flows from the box,and the primary Si phase accumulates at the bottom of the box.The volume fraction of primary Si phase decreases gradually from the bottom to the walls.Accordingly,the thermal conductivities of bottom center and walls are 107.6 and 131.5 W/（m·K）,the coefficients of thermal expansion（CTE） are 7.9×10-6 and 10.6×10-6 K-1,respectively.The flexural strength increases slightly from 167 to 180 MPa.The microstructures and properties of the box show gradient distribution overall.

Microstructure characterization and thermal properties of hypereutectic Si-Al alloy for electronic packaging applications

The rapid solidified process and hot press method were performed to produce three hypereutectic 55%Si-Al, 70%Si-Al and 90%Si-Al alloys for heat dissipation materials. The results show that the atomization is an effective rapid solidified method to produce the Si-Al alloy and the size of atomized Si-Al alloy powder is less than 50 μm. The rapid solidified Si-Al alloy powder were hot pressed at 550 ℃ with the pressure of 700 MPa to obtain the relative densities of 99.4%, 99.2% and 94.4% for 55%Si-Al, 70%Si-Al and 90%Si-Al alloys, respectively. The typical physical properties, such as the thermal conductivity, coefficient of thermal expansion （CTE） and electrical conductivity of rapid solidified Si-Al alloys are acceptable as a heat dissipation material for many semiconductor devices. The 55%Si-Al alloy changes greatly （CTE） with the increase of temperature but obtains a good thermal conductivity. The CTE of 90%Si-Al alloy matches with the silicon very well but its thermal conductivity value is less than 100 W/（m.K）. Therefore, the 70%Si-Al alloy possesses the best comprehensive properties of CTE and thermal conductivity for using as the heat sink materials.

Microstructure and properties of Al/Si/SiC composites for electronic packaging

The Al/Si/SiC composites with medium volume fraction for electronic packaging were fabricated by gas pressure infiltration.On the premise of keeping the machinability of the composites,the silicon carbide particles,which have the similar size with silicon particles（average 13 μm）,were added to replace silicon particles of same volume fraction,and microstructure and properties of the composites were investigated.The results show that reinforcing particles are distributed uniformly and no apparent pores are observed in the composites.It is also observed that higher thermal conductivity（TC） and flexural strength will be obtained with the addition of SiC particles.Meanwhile,coefficient of thermal expansion（CTE） changes smaller than TC.Models for predicting thermal properties were also discussed.Equivalent effective conductivity（EEC） was proposed to make H-J model suitable for hybrid particles and multimodal particle size distribution.

Microstructure and properties of SiC_p/Al electronic packaging shell produced by liquid-solid separation

The electronic packaging shell of high silicon carbide （54%SiC, volume fraction） aluminum-based composites was produced by liquid-solid separation technique. The characteristics of distribution and morphology of SiC as well as the shell’s fracture surface were examined by optical microscopy and scanning electron microscopy, and the thermo-physical and mechanical properties of the shell were also tested. The results show that Al matrix has a net-like structure while SiC is uniformly distributed in the Al matrix. The SiCp/Al composites have a low density of 2.93 g/cm^3, and its relative density is 98.7%. Thermal conductivity of the composites is 175 W/（·K）, coefficient of thermal expansion （CTE） is 10.3×10^-6 K-1 （25-400 ℃）, compressive strength is 496 MPa, bending strength is 404.5 MPa, and the main fracture mode is brittle fracture of SiC particles accompanied by ductile fracture of Al matrix.Its thermal conductivity is higher than that of Si/Al alloy, and its CTE matches with that of the chip material.

Study on Vigor of Kenaf Seeds Stored with Different Packaging Methods for 31 Years

This study was conducted to investigate the effects of different packaging methods on seed germination and vigor under a long-term bank storage condition, selecting suitable packaging materials and methods, and comprehensively estimate changes in seed vigor of seeds stored with different packaging materials. Hibiscus cannabinus L. seeds were stored in aluminium box, seed box, glass bottle, POlyethylene film bag, sack and kraft paper bag as packaging materials in a, long-term bank and tested for their seeds germinability, electrical conductivity and field seedling rate after 31 years. The results showed that the kenaf seeds with an initial germination rate of 88% exhibited the germination rates over 79.7% after being stored in the 6 packaging materials for 31 years, the germination rates of seeds packaged with paper bag and sack and of those sealed in film bag and aluminium box showed significantly decreased germination rates, while the seeds sealed in seed boxes and glass bottles exhibited non-significant decreases in seed germination rate, and their germination rates were still above 85%. Seed box and glass bottle were the packaging materials most suitable for long-term safe storage of kenaf seeds with a safe storage period long than 31 years.

Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy

The Cu/Invar composites of 40% Cu were prepared by powder metallurgy, and the composites were rolled with 70% reduction and subsequently annealed at 750 ℃. Phases, microstructures and properties of the composites were then studied. After that, the amount of a-Fe（Ni,Co） in the composites is reduced, because a-Fe（Ni,Co） partly transfers into y-Fe（Ni,Co） through the diffusion of the Ni atoms into a-Fe（Ni,Co） from Cu. When the rolling reduction is less than 40%, the deformation of Cu takes place, resulting in the movement of the Invar particles and the seaming of the pores. When the rolling reduction is in the range from 40% to 60%, the deformations of Invar and Cu occur simultaneously to form a streamline structure. After rolling till 70% and subsequent annealing, the Cu/Invar composites have fine comprehensive properties with a relative density of 98.6%, a tensile strength of 360 MPa, an elongation rate of 50%, a thermal conductivity of 25.42 W/（m.K） （as-tested） and a CTE of 10.79× 10-6/K （20-100 ℃）.

Laser-weldable Si_p-SiC_p/Al hybrid composites with bilayer structure for electronic packaging

Laser-weldable Sip-SiCp/Al hybrid composites with high volume fraction （60%-65%） of SiC reinforcement were fabricated by compression moulding and vacuum gas pressure infiltration technology. Microscopic observation displayed that the Sip-SiCp/Al hybrid composites with bilayer structure were compact without gas pores and the intergradation between Sip/Al layer and SiCp/Al layer was homogeneous and continuous. Further investigation revealed that the Sip-SiCp/Al hybrid composites possessed low density （2.96 g/cm^3）, high gas tightness （1.0 mPa·cm^3）/s）, excellent thermal management function as a result of high thermal conductivity （194 W/（m·K） and low coefficient of thermal expansion （7.0×10^-6 K-1）. Additionally, Sip-SiCp/Al hybrid composites had outstanding laser welding adaptability, which is significantly important for electronic packaging applications. The gas tightness of components after laser welding （48 mPa·cm^3）/s） can well match the requirement of advanced electronic packaging. Several kinds of these precision components passed tests and were put into production.

A Study of Information-packaging Constructions in the News and Sports Sections of The Guardian

The paper studies the use of information-packaging structures in newspaper from a pragmatic point of view. It is based on the 800 corpus examples randomly chosen from the news and sports sections of Guardian. The paper studies the structures preposing, postposing, inversion, extraposition, and dislocation, as well as existential, cleft and passive constructions. It shows that that the news and sports sections of The Guardian are not extensively marked by the use of information-packaging structures.

Study on Graphene Oxide Modified Inorganic Phase Change Materials and Their Packaging Behavior

We prepared the nano-inorganic phase-change ＂alloy＂ materials through the modification of Na2SO4·10H2O using Na2HPO4·12H2O and GO nano-nucleating agent, and further investigated their thermophysical properties such as melting/solidification temperatures and enthalpies via differential scanning calorimetry. When the weight ratio of Na2SO4·10H2O and Na2HPO4·12H2O was 8：2 and the weight ratio of graphene oxide was 0.5% of phase change material, the phase change ＂alloy＂ material showed excellent performances, specifically, the melting temperature and latent heat were found to be 22 ℃ and 190 J/g with a degree of subcooling decreased from 8.6℃ to 2.1℃. In order to extend the application of the phase change ＂alloy＂ material to building energy saving field, it was adsorbed on expanded glass beads under vacuum and further covered with diatomite. When the adsorption rate of EGB（volume） and PCAM（weight） was 2.5：1, the particle size of diatomaceous earth was found to be 3.6μm, while the best packaging result was obtained with the melting temperature and latent heat being 21℃ and 135 J/g, and no leakage was observed.

Effects of Active Modified Atmosphere Packaging on Postharvest Quality of Shiitake Mushrooms (Lentinula edodes) Stored at Cold Storage

The effects of active modified atmosphere packaging （MAP） on the postharvest quality of shiitake mushrooms stored at cold temperature （4°C） were investigated.The gas components were 2% O2 ＋7% CO2 （MAP1）,2% O2 ＋10% CO2 （MAP2） and 2% O2 ＋13% CO2 （MAP3）,respectively.The results showed that active MAP could extend the shelf-life of shiitake mushrooms to 17 d and the concentration of carbon dioxide could influence the postharvest quality of shiitake mushrooms.MAP2 treatment inhibited the increase in respiration rate and malondinaldehyde （MDA） contents,delayed the decrease in firmness,soluble sugar and vitamin C,and obviously reduced the activity of polyphenol oxidase （PPO） and the degree of browning,therefore maintaining better quality.

Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications

Diamond/Cu-xCr composites were fabricated by pressure infiltration process.The thermal conductivities of diamond/Cu-xCr（x = 0.1,0.5,0.8） composites were above 650 W/mK,higher than that of diamond/Cu composites.The tensile strengths ranged from 186 to 225 MPa,and the bonding strengths ranged from 400 to 525 MPa.Influences of Cr element on the thermo-physical properties and interface structures were analyzed.The intermediate layer was confirmed as Cr3C2 and the amount of Cr3C2 increased with the increase of Cr concentration in Cu-xCr alloys.When the Cr concentration was up to 0.5 wt.%,the content of the Cr3C2 layer was constant.As the thickness of the Cr3C2 layer became larger,the composites showed a lower thermal conductivity but higher mechanical properties.The coefficients of thermal expansion（CTE） of diamond/Cu-xCr（x = 0.1,0.5,0.8） composites were in good agreement with the predictions of the Kerner＇ model.