Traditional variation analysis methods are not applicable to non-rigid assemblies due to possible part deformation during the assembly process. This paper presents the use of finite element methods to simulate assembl...Traditional variation analysis methods are not applicable to non-rigid assemblies due to possible part deformation during the assembly process. This paper presents the use of finite element methods to simulate assembly deformation. The relationship between the parts’ variation and the variation of the key points in final assembly for quality control is set up by calculating the spring back deformation after assembly. Moreover, the optimization method for non-rigid assembly variations based on finite element analysis is presented. The optimal objective is to reduce the manufacturing cost. The approach is implemented by using ANSYS and MATLAB. The test example shows that the proposed method is effective and applicable.展开更多
An effective constraint release based approach to realize concurrent optimization for an assembly sequence is proposed. To quantify the measurement of assembly efficiency, a mathematical model of concurrency evaluatio...An effective constraint release based approach to realize concurrent optimization for an assembly sequence is proposed. To quantify the measurement of assembly efficiency, a mathematical model of concurrency evaluation index was put forward at first, and then a technology to quantify assembly constraints was developed by application of some fuzzy logic algorithms. In the process of concurrent optimization of the assembly sequence, two kinds of constraints were involved. One was self-constraints of components, which was used to evaluate the assemble capability of components under the condition of full-freedom. Another was an assembly constraint between components represented by geometric constraints between points, lines and planes under physical restriction conditions. The concept of connection strength degree (CSD) was introduced as one efficient indicator and the value of it was evaluated by the intersection of the two constraints mentioned above. The equivalent constraints describing the connection weights between components were realized by a well designed constraints reduction, and then the connection weights based complete assembly liaison graph was applied to release virtual connections between components. Under a given threshold value, a decomposition and reconstituting strategy for the graph with the focus on high assembly concurrency was used to realize an optimized assembly concurrency evaluation index. Finally, the availability of the approach was illustrated in an example to optimize the assembly of a shift pump.展开更多
The finite element method(FEM) is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum simulation for QFP devices is also researched. The results indicate that when t...The finite element method(FEM) is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum simulation for QFP devices is also researched. The results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths, while the reliability of the soldered joints reduces. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn't decrease completely with the increasing of lead pitches, a minimum value of the maximum equivalent stress values exists in all the curves. Under this condition the maximum equivalent stress of the soldewed joints is relatively the least, the reliability of soldered joints is high and the assembly is excellent. The simulating results indicate the best parameter: The lead width is 0.2 mm and lead pitch is 0.3 mm (the distance between two leads is 0.1 mm), which are benefited for the micromation of QFP devices now. The minimum value of the maximum equivalent stress of soldered joints exists while lead width is 0.25 mm and lead pitch is 0.35 mm (the distance between two leads is 0.1 mm), the devices can serve for a long time and the reliability is the highest, the assembly is excellent. The simulating results also indicate the fact that the lead width is 0.15 mm and lead pitch is 0.2 mm maybe the limit of QFP, which is significant for the high lead count and micromation of assembly.展开更多
Reconfigurable products and manufacturing systems have enabled manufacturers to provide "cost effective" variety to the market. In spite of these new technologies, the expense of manufacturing makes it infeasible to...Reconfigurable products and manufacturing systems have enabled manufacturers to provide "cost effective" variety to the market. In spite of these new technologies, the expense of manufacturing makes it infeasible to supply all the possible variants to the market for some industries. Therefore, the determination of the right number of product variantsto offer in the product portfolios becomes an important consideration. The product portfolio planning problem had been independently well studied from marketing and engineering perspectives. However, advantages can be gained from using a concurrent marketing and engineering approach. Concurrent product development strategies specifically for reconfigurable products and manufacturing systems can allow manufacturers to select best product portfolios from marketing, product design and manufacturing perspectives. A methodology for the concurrent design of a product portfolio and assembly system is presented. The objective of the concurrent product portfolio planning and assembly system design problem is to obtain the product variants that will make up the product portfolio such that oversupply of optional modules is minimized and the assembly line efficiency is maximized. Explicit design of the assembly system is obtained during the solution of the problem. It is assumed that the demand for optional modules and the assembly times for these modules are known a priori. A genetic algorithm is used in the solution of the problem. The basic premise of this methodology is that the selected product portfolio has a significant impact on the solution of the assembly line balancing problem. An example is used to validate this hypothesis. The example is then further developed to demonstrate how the methodology can be used to obtain the optimal product portfolio. This approach is intended for use by manufacturers during the early design stages of product family design.展开更多
Challenges still remain in carrying out assembly modeling efficiently in virtual assembly (VA) fields. One of the root causes is the apparent weakness in effective description of assembly knowledge and information. ...Challenges still remain in carrying out assembly modeling efficiently in virtual assembly (VA) fields. One of the root causes is the apparent weakness in effective description of assembly knowledge and information. The assembly modeling, disassembly modeling, assembly interference inspection, assembly sequence planning and optimization, and assembly simulation display for key techniques is studied theoretically in this paper. An example of product assembly modeling is provided to illustrate the effectiveness of the proposed approach. On the basis of re- search, using assembly simulation techniques and multimedia techniques to finish structure design in linkage design of a large size wind-drive generator. The application of the modeling method has shortened the lead time dramatically.展开更多
Zero defection manufacturing (ZDM) is the pursuit of the manufacturing industry. However, there is a lack of the implementation method of ZDM in the multi-stage manufacturing process (MMP). Implementing ZDM and contro...Zero defection manufacturing (ZDM) is the pursuit of the manufacturing industry. However, there is a lack of the implementation method of ZDM in the multi-stage manufacturing process (MMP). Implementing ZDM and controlling product quality in MMP remains an urgent problem in intelligent manufacturing. A novel predict-prevention quality control method in MMP towards ZDM is proposed, including quality characteristics monitoring, key quality characteristics prediction, and assembly quality optimization. The stability of the quality characteristics is detected by analyzing the distribution of quality characteristics. By considering the correlations between different quality characteristics, a deep supervised long-short term memory (SLSTM) prediction network is built for time series prediction of quality characteristics. A long-short term memory-genetic algorithm (LSTM-GA) network is proposed to optimize the assembly quality. By utilizing the proposed quality control method in MMP, unqualified products can be avoided, and ZDM of MMP is implemented. Extensive empirical evaluations on the MMP of compressors validate the applicability and practicability of the proposed method.展开更多
基金Supported by the Natural Science Foundation of China (No. 50205028) and the Natural Science Foundation of Chongqing City (No. 2005BB2022 ).
文摘Traditional variation analysis methods are not applicable to non-rigid assemblies due to possible part deformation during the assembly process. This paper presents the use of finite element methods to simulate assembly deformation. The relationship between the parts’ variation and the variation of the key points in final assembly for quality control is set up by calculating the spring back deformation after assembly. Moreover, the optimization method for non-rigid assembly variations based on finite element analysis is presented. The optimal objective is to reduce the manufacturing cost. The approach is implemented by using ANSYS and MATLAB. The test example shows that the proposed method is effective and applicable.
文摘An effective constraint release based approach to realize concurrent optimization for an assembly sequence is proposed. To quantify the measurement of assembly efficiency, a mathematical model of concurrency evaluation index was put forward at first, and then a technology to quantify assembly constraints was developed by application of some fuzzy logic algorithms. In the process of concurrent optimization of the assembly sequence, two kinds of constraints were involved. One was self-constraints of components, which was used to evaluate the assemble capability of components under the condition of full-freedom. Another was an assembly constraint between components represented by geometric constraints between points, lines and planes under physical restriction conditions. The concept of connection strength degree (CSD) was introduced as one efficient indicator and the value of it was evaluated by the intersection of the two constraints mentioned above. The equivalent constraints describing the connection weights between components were realized by a well designed constraints reduction, and then the connection weights based complete assembly liaison graph was applied to release virtual connections between components. Under a given threshold value, a decomposition and reconstituting strategy for the graph with the focus on high assembly concurrency was used to realize an optimized assembly concurrency evaluation index. Finally, the availability of the approach was illustrated in an example to optimize the assembly of a shift pump.
基金This project is supported by Provincial Six Kind Skilled Personnel Project of Jiangsu,China(No.06-E-020).
文摘The finite element method(FEM) is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum simulation for QFP devices is also researched. The results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths, while the reliability of the soldered joints reduces. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn't decrease completely with the increasing of lead pitches, a minimum value of the maximum equivalent stress values exists in all the curves. Under this condition the maximum equivalent stress of the soldewed joints is relatively the least, the reliability of soldered joints is high and the assembly is excellent. The simulating results indicate the best parameter: The lead width is 0.2 mm and lead pitch is 0.3 mm (the distance between two leads is 0.1 mm), which are benefited for the micromation of QFP devices now. The minimum value of the maximum equivalent stress of soldered joints exists while lead width is 0.25 mm and lead pitch is 0.35 mm (the distance between two leads is 0.1 mm), the devices can serve for a long time and the reliability is the highest, the assembly is excellent. The simulating results also indicate the fact that the lead width is 0.15 mm and lead pitch is 0.2 mm maybe the limit of QFP, which is significant for the high lead count and micromation of assembly.
文摘Reconfigurable products and manufacturing systems have enabled manufacturers to provide "cost effective" variety to the market. In spite of these new technologies, the expense of manufacturing makes it infeasible to supply all the possible variants to the market for some industries. Therefore, the determination of the right number of product variantsto offer in the product portfolios becomes an important consideration. The product portfolio planning problem had been independently well studied from marketing and engineering perspectives. However, advantages can be gained from using a concurrent marketing and engineering approach. Concurrent product development strategies specifically for reconfigurable products and manufacturing systems can allow manufacturers to select best product portfolios from marketing, product design and manufacturing perspectives. A methodology for the concurrent design of a product portfolio and assembly system is presented. The objective of the concurrent product portfolio planning and assembly system design problem is to obtain the product variants that will make up the product portfolio such that oversupply of optional modules is minimized and the assembly line efficiency is maximized. Explicit design of the assembly system is obtained during the solution of the problem. It is assumed that the demand for optional modules and the assembly times for these modules are known a priori. A genetic algorithm is used in the solution of the problem. The basic premise of this methodology is that the selected product portfolio has a significant impact on the solution of the assembly line balancing problem. An example is used to validate this hypothesis. The example is then further developed to demonstrate how the methodology can be used to obtain the optimal product portfolio. This approach is intended for use by manufacturers during the early design stages of product family design.
基金supported by the Foundation of Jiangsu Province for Talented Personnel and the Self-determined Research Program of Jiangnan University
文摘Challenges still remain in carrying out assembly modeling efficiently in virtual assembly (VA) fields. One of the root causes is the apparent weakness in effective description of assembly knowledge and information. The assembly modeling, disassembly modeling, assembly interference inspection, assembly sequence planning and optimization, and assembly simulation display for key techniques is studied theoretically in this paper. An example of product assembly modeling is provided to illustrate the effectiveness of the proposed approach. On the basis of re- search, using assembly simulation techniques and multimedia techniques to finish structure design in linkage design of a large size wind-drive generator. The application of the modeling method has shortened the lead time dramatically.
基金The research work presented in this paper is supported by the National Natural Science Foundation of China(Grant No.51675418).
文摘Zero defection manufacturing (ZDM) is the pursuit of the manufacturing industry. However, there is a lack of the implementation method of ZDM in the multi-stage manufacturing process (MMP). Implementing ZDM and controlling product quality in MMP remains an urgent problem in intelligent manufacturing. A novel predict-prevention quality control method in MMP towards ZDM is proposed, including quality characteristics monitoring, key quality characteristics prediction, and assembly quality optimization. The stability of the quality characteristics is detected by analyzing the distribution of quality characteristics. By considering the correlations between different quality characteristics, a deep supervised long-short term memory (SLSTM) prediction network is built for time series prediction of quality characteristics. A long-short term memory-genetic algorithm (LSTM-GA) network is proposed to optimize the assembly quality. By utilizing the proposed quality control method in MMP, unqualified products can be avoided, and ZDM of MMP is implemented. Extensive empirical evaluations on the MMP of compressors validate the applicability and practicability of the proposed method.