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Cookie Baking Process Optimization and Quality Analysis Based on Food 3D Printing
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作者 Liu Chenghai Li Jingyi +2 位作者 Wu Chunsheng Zhao Xinglong Zheng Xianzhe 《Journal of Northeast Agricultural University(English Edition)》 CAS 2024年第1期61-73,共13页
In order to obtain better quality cookies, food 3D printing technology was employed to prepare cookies. The texture, color, deformation, moisture content, and temperature of the cookie as evaluation indicators, the in... In order to obtain better quality cookies, food 3D printing technology was employed to prepare cookies. The texture, color, deformation, moisture content, and temperature of the cookie as evaluation indicators, the influences of baking process parameters, such as baking time, surface heating temperature and bottom heating temperature, on the quality of the cookie were studied to optimize the baking process parameters. The results showed that the baking process parameters had obvious effects on the texture, color, deformation, moisture content, and temperature of the cookie. All of the roasting surface heating temperature, bottom heating temperature and baking time had positive influences on the hardness, crunchiness, crispiness, and the total color difference(ΔE) of the cookie. When the heating temperatures of the surfac and bottom increased, the diameter and thickness deformation rate of the cookie increased. However,with the extension of baking time, the diameter and thickness deformation rate of the cookie first increased and then decreased. With the surface heating temperature of 180 ℃, the bottom heating temperature of 150 ℃, and baking time of 15 min, the cookie was crisp and moderate with moderate deformation and uniform color. There was no burnt phenomenon with the desired quality. Research results provided a theoretical basis for cookie manufactory based on food 3D printing technology. 展开更多
关键词 food 3D printing baking process COOKIE quality analysis optimization of process parameter
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Effect of Baking Process on Microstructures and Mechanical Properties of Low Silicon TRIP Steel Sheet With Niobium 被引量:6
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作者 TANG Zheng-you DING Hua +2 位作者 DING Hao CAI Ming-hui DULin-xiu 《Journal of Iron and Steel Research(International)》 SCIE EI CAS CSCD 2010年第7期68-74,共7页
After 2% predeformation,the baking treatment with different schedule was carried out for low silicon TRIP steel sheet with niobium.The effects of baking temperature and time on microstructures and mechanical propertie... After 2% predeformation,the baking treatment with different schedule was carried out for low silicon TRIP steel sheet with niobium.The effects of baking temperature and time on microstructures and mechanical properties were investigated.The results showed that with increasing the baking temperature and time,the volume fraction of retained austenite decreases,and the volume fraction of tempered martensite increases; as baking temperature ranges from 80 ℃ to 170 ℃,the bake-hardening(BH)value increases obviously,while from 170 ℃ to 230 ℃,the variation of BH value is very slight; as baking time ranges from 2 min to 20 min,the BH value increases significantly,while the BH value decreases when baking time exceeds 20 min.So that when the baking temperature is 170 ℃ and the baking time is 20 min,the low silicon TRIP steel sheet exhibits good bake-hardening behavior,and the highest BH value is above 70 MPa. 展开更多
关键词 TRIP steel sheet baking process MICROSTRUCTURE mechanical property bake-hardening
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