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The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading 被引量:1
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作者 蔡艳红 陈浩然 +2 位作者 唐立强 闫澄 江莞 《Applied Mathematics and Mechanics(English Edition)》 SCIE EI 2008年第11期1517-1526,共10页
This paper studies the dynamic stress intensity factor (DSIF) at the interface in an adhesive joint under shear loading. Material damage is considered. By introducing the dislocation density function and using the i... This paper studies the dynamic stress intensity factor (DSIF) at the interface in an adhesive joint under shear loading. Material damage is considered. By introducing the dislocation density function and using the integral transform, the problem is reduced to algebraic equations and can be solved with the collocation dots method in the Laplace domain. Time response of DSIF is calculated with the inverse Laplace integral transform. The results show that the mode Ⅱ DSIF increases with the shear relaxation parameter, shear module and Poisson ratio, while decreases with the swell relaxation parameter. Damage shielding only occurs at the initial stage of crack propagation. The singular index of crack tip is -0.5 and independent on the material parameters, damage conditions of materials, and time. The oscillatory index is controlled by viscoelastic material parameters. 展开更多
关键词 dynamic stress intensity factor interface crack adhesively bonded material DAMAGE singular integral eouation
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Interlaminar Bonding Performance of UHPC/SMA Based on Diagonal Shear Test 被引量:1
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作者 丁庆军 LEI Yuxiang +3 位作者 张高展 CHENG Huaqiang ZHAO Mingyu GUO Kaizheng 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS CSCD 2023年第1期97-108,共12页
To evaluate various interlaminar bonding reinforcement techniques used for steel bridge decks,the UHPC surface was roughened with shot blasting(SB),transverse grooving(TG)and surface embedded stone(S),epoxy resin(E),e... To evaluate various interlaminar bonding reinforcement techniques used for steel bridge decks,the UHPC surface was roughened with shot blasting(SB),transverse grooving(TG)and surface embedded stone(S),epoxy resin(E),epoxy asphalt(EA)and high viscosity high elasticity asphalt(HV)as interlayer bonding materials.In addition,a diagonal shear test was conducted using a self-designed diagonal shear jig.The effects of adhesive layer materials type,surface texture type,and different loading rates on the interlaminar bonding performance of UHPC/SMA combination specimens were investigated.The experimental study showed that the peak shear strength and shear modulus of the combined specimen decreased gradually with the decrease of thermosetting of the adhesive layer materials.The peak shear fracture energy of E was greater than that of HV and EA.The synergistic effect of the contact force generated by the roughing of the UHPC surface,the friction force,and the bonding force provided by the adhesive layer material can significantly improve the interlaminar shear performance of the assemblies.The power-law function of shear strength and shear modulus was proposed.The power-law model of peak shear strength and loading rate was verified.The shear strength and predicted shear strength satisfy the positive proportional functions with scale factors of 0.985,1.015,0.961,and 1.028,respectively. 展开更多
关键词 UHPC SMA bonding materials surface textures loading rate bonding performance
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Dynamic fracture analysis of adhesive bonded material under normal loading
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作者 Yanhong Cai Haoran Chen Xiaozhi Hu 《Acta Mechanica Sinica》 SCIE EI CAS CSCD 2010年第1期107-112,共6页
Dynamic fracture behavior of a Griffith crack along the interface of an adhesive bonded material under normal loading is studied. The singular integral equations are obtained by employing integral transformation and i... Dynamic fracture behavior of a Griffith crack along the interface of an adhesive bonded material under normal loading is studied. The singular integral equations are obtained by employing integral transformation and introducing dislocation density functions. By adopting Gauss-Jacobi integration formula, the problem is reduced to the solution of algebraic equations, and by collocation dots method. their solutions can be obtained Based on the parametric discussions presented in the paper, the following conclusions can be drawn: (1) Mode I dynamic stress intensity factor (DSIF) increases with increasing initial crack length and decreasing visco-elastic layer thickness, revealing distinct size effect; (2) The influence of the visco-elastic adhesive relaxation time on the DSIF should not be ignored. 展开更多
关键词 Adhesive bonded material Interface crackDynamic stress intensity factor Integral transformationSingular integral equation
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New Type Gold Bonding Wire
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作者 高瑞 江轩 +1 位作者 吕保国 班立志 《Rare Metals》 SCIE EI CAS CSCD 1995年第3期203-208,共6页
The influences of additive elements on properties of gold wire and the technology of homogeneously adding those elements to gold matrix were studied. A BJ-type gold bonding wire for automatic bonders was developed, wh... The influences of additive elements on properties of gold wire and the technology of homogeneously adding those elements to gold matrix were studied. A BJ-type gold bonding wire for automatic bonders was developed, which has high bond strength and stable uniform mechanical properties and is capable of forming good spherical shape of melting-ball observed by SEM. The bonding wire is fully suitable to the requirements of the automatic bonding technology and satisfies the performance requirement of IC products. 展开更多
关键词 ADDITIVES bond strength (materials) bondING Doping (additives) WIRE
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Improvement of a Dicing Blade Using Direction Controlled Whisker by Electric Field
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作者 PENG Wei, XU Xue-feng (Department of Mechanical Engineering, Zhejiang University of Technol ogy, Hangzhou 310014, China) 《厦门大学学报(自然科学版)》 CAS CSCD 北大核心 2002年第S1期128-,共1页
In the recent years, the light sensitive resin has be en greatly improved. Its application includes rapid prototyping, bonding, protec tive coating and sealing. A new application to using light sensitive resin inste a... In the recent years, the light sensitive resin has be en greatly improved. Its application includes rapid prototyping, bonding, protec tive coating and sealing. A new application to using light sensitive resin inste ad of heat sensitive resin as bonding material in dicing blade is being progress ed by authors. This paper discusses the way in which the mechanical feature of t he new kinds of dicing blades had been greatly improved via adding whisker into light sensitive resin. Considering the enhancing function of whisker in length d irection is greater than that in diameter direction, an electric field was appli ed to make the direction of whisker in resin along with the direction of the load of dicing blade. In the electric field, a whisker in the resin is swerved to the direction of the electric force before the resin is solidified by ultravi olet radiation. The result shows that controlling the direction of whisker in th e resin by applying an electric field can finally greatly improve the mechanical property of dicing blade that can be used in processing the semi-conduct. 展开更多
关键词 dicing blade RESIN bonding material
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Maintaining nano-lamellar microstructure in friction stir welding (FSW) of accumulative roll bonded (ARB) Cu-Nb nano-lamellar composites (NLC) 被引量:1
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作者 Judy Schneider Josef Cobb +1 位作者 John S.Carpenter Nathan A.Mara 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2018年第1期92-101,共10页
Accumulative roll bonded (ARB) Copper Niobium (Cu-Nb) nano-lamellar composite (NLC) panels were friction stir welded (FSWed) to evaluate the ability to join panels while retaining the nano-lamellar structure. ... Accumulative roll bonded (ARB) Copper Niobium (Cu-Nb) nano-lamellar composite (NLC) panels were friction stir welded (FSWed) to evaluate the ability to join panels while retaining the nano-lamellar structure. During a single pass of the friction stir welding (FSW) process, the nano-lamellar structure of the parent material (PM) was retained but was observed to fragment into equiaxed grains during the second pass. FSW has been modeled as a severe deformation process in which the material is subjected to an instantaneous high shear strain rate followed by extreme shear strains. The loss of the nano-lamellar layers was attributed to the increased strain and longer time at temperature resulting from the second pass of the FSW process. Kinematic modeling was used to predict the global average shear strain and shear strain rates experienced by the ARB material during the FSW process. The results of this study indicate that through careful selection of FSW parameters, the nano-lamellar structure and its associated higher strength can be maintained using FSW to join ARB NLC panels. 展开更多
关键词 Nano-lamellar materials Accumulative roll bonded Cu-Nb FSW Solid state joining
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