Interfacial Morphology and Bonding Mechanism of Explosive Weld Joints

Interfacial structure greatly affects the mechanical properties of laminated plates.However,the critical material properties that impact the interfacial morphology,appearance,and associated bonding mechanism of explosive welded plates are still unknown.In this paper,the same base plate(AZ31B alloy)and different flyer metals(aluminum alloy,copper,and stainless steel)were used to investigate interfacial morphology and structure.SEM and TEM results showed that typical sine wave,wave-like,and half-wave-like interfaces were found at the bonding interfaces of Al/Mg,Cu/Mg and SS/Mg clad plates,respectively.The different interfacial morphologies were mainly due to the differences in hardness and yield strength between the flyer and base metals.The results of the microstructural distribution at the bonding interface indicated metallurgical bonding,instead of the commonly believed solid-state bonding,in the explosive welded clad plate.In addition,the shear strength of the bonding interface of the explosive welded Al/Mg,Cu/Mg and SS/Mg clad plates can reach up to 201.2 MPa,147.8 MPa,and 128.4 MPa,respectively.The proposed research provides the design basis for laminated composite metal plates fabrication by explosive welding technology.

Mechanism of microweld formation and breakage during Cu-Cu wire bonding investigated by molecular dynamics simulation

Currently,wire bonding is the most popular first-level interconnection technology used between the die and package terminals,but even with its long-term and excessive usage,the mechanism of wire bonding has not been completely evaluated.Therefore,fundamental research is still needed.In this study,the mechanism of microweld formation and breakage during Cu-Cu wire bonding was investigated by using molecular dynamics simulation.The contact model for the nanoindentation process between the wire and substrate was developed to simulate the contact process of the Cu wire and Cu substrate.Elastic contact and plastic instability were investigated through the loading and unloading processes.Moreover,the evolution of the indentation morphology and distributions of the atomic stress were also investigated.It was shown that the loading and unloading curves do not coincide,and the unloading curve exhibited hysteresis.For the substrate,in the loading process,the main force changed from attractive to repulsive.The maximum von Mises stress increased and shifted from the center toward the edge of the contact area.During the unloading process,the main force changed from repulsive to attractive.The Mises stress reduced first and then increased.Stress concentration occurs around dislocations in the middle area of the Cu wire.

Effect of Mechanical Surface Treatment on the Bonding Mechanism and Properties of Cold‑Rolled Cu/Al Clad Plate

In the case of valuable cold-rolled Cu/Al clad plates,billet surface treatment before rolling is a significant process that can affect the bonding efficiency and quality.While the current studies primarily focus on the influence of rolling parameters,insufficient attention has been paid to surface treatment.In this study,the effects of mechanical surface treatment on the bonding mechanism and bonding properties of cold-rolled Cu/Al clad plates were investigated.The results showed that different mechanical surface treatments have significant effects on the surface morphology,roughness,and residual stress.In addition,the effect of surface mechanical treatment on bonding quality was also observed to be critical.When the grinding direction was consistent with the rolling direction(RD),the bonding quality of the Cu/Al clad plates was significantly improved.After surface treatment along the RD for 20 s,the Cu/Al clad plates showed the highest shear strength(78 MPa),approximately four times as high as that of the unpolished samples.Simultaneously,the peel strength of this process was also significantly higher than that achieved via the other processes.Finally,on the basis of the surface morphology,roughness,and residual stress,the effect of surface treatment on the bonding mechanism and bonding properties of Cu/Al clad plates was analyzed.This study proposes a deeper understanding of the bonding behavior and bonding mechanism for cold rolled clad plates processed via mechanical surface treatment.

Bonding Mechanisms of Basic Refractories for RH Snorkels

Magchrome bricks,as the inner lining of RH snorkels,have played a vital role in the operation of RH degassers for a long term.In chrome-free campaigns,resin-bonded,Al-containing magnesia bricks have been an alternative of magchrome bricks with a comparable performance in the last decade.It is important to have found whisker formation in the matrix of Alcontaining magnesia bricks above 1100°C and in the correlation to their high performance of RH snorkels.In this paper,the bonding mechanisms of both refractories are investigated to differentiate from other refractories.In magchrome bricks,the bonding modes of fused magchrome grains are characterized by the reactions between magnesia and chrome ore at different burning temperatures.At 1500°C,liquid forms around chromite grains.It is sucked into surrounding magnesia and a gap forms around chromite grains at 1600°C.Plenty of Fe2O3,Cr2O3 and Al2O3 have diffused from chrome ore into magnesia at 1670°C.A complete dissolution of the chrome ore takes place at 1750°C,with chromite precipitating entirely.In unburnt,Al-containing magnesia bricks,a dense network of whiskers is formed during heating,which is a prevailing bonding feature,instead of traditional particle growing and merging.It is believed that the whiskers are formed by vapoursolid mechanism since there is no liquid droplet observed at the tip of whiskers.In most stringent working conditions of RH snorkels,the bonding mechanisms are emphasized for their application,instead of chromia component.

THEORETICAL ANALYSIS OF HYDROGENATION MECHANISM CATALYZED BY Pd-Fe_2O_3/D_(3520)

The mechanism of catalytic hydrogenation of styrene is analyzed by catalysis theory and frontier molecular orbital theory.

Repairing of exit-hole in friction-stir-spot welded joints for 2024-T4 aluminum alloy by resistance welding

The exit-hole in friction stir spot welded(FSSWed) 2024-T4 aluminum alloy joints was successfully repaired by using a three-phase secondary rectification resistance spot welding machine, which is termed as filling exit-hole based on resistance welding(FEBRW). The filling dynamic behavior of force was recorded by a device monitoring. Optical microscope(OM), electron backscatter diffraction(EBSD), and tensile shear tests and finite element modelling were conducted to investigate the repairing stages and bonding mechanisms of the repaired joints in detail. Results showed that exit-hole was completely filled and repaired experiencing three stages. Metallurgical bonding was achieved between plug and exit-hole wall in two forms, including melting bonding in the middle of the joints and partial diffusion bonding on both the upper and bottom of the joints. The highest tensile shear strength of the repaired joints was 7.43 kN, which was 36.3% higher than that of the as welded joints. Resistance welding paves an efficient way to repair the exit-hole in FSSWed joints.

Structural,magnetic and electronic properties of FeF_2 by first-principle calculation

First-principle calculation was used to investigate the magnetic properties, electronic structure and bonding mechanism of FeF2. By calculating the lattice parameters and magnetic moment as a function of effective interaction parameter （Ueff）, it is found that the optimum value of Uefr is equal to 4 eV, the magnetic moment is 3.752 μB and the value of c/a is 0.704, which are in good agreement with the experiment results. Simultaneously, on the basis of GGA＋U method, the electronic structure and bonding mechanism of FeF2 were investigated by the analysis of electron localization function, Bader charge and total charge density. The results show that the bonding behavior between Fe and F atoms is a combination of ionic and covalent bond.

Interfacial microstructure and mechanical behavior of Mg/Cu bimetal composites fabricated by compound casting process

Mg/Cu bimetal composites were prepared by compound casting method, and the microstructure evolution, phase constitution and bonding strength at the interface were investigated.It is found that a good metallurgical bonding can be achieved at the interface of Mg and Cu,which consists of two sub-layers,i.e.,layer I with 30μm on the copper side composed of Mg2Cu matrix phase, on which a small amount of dendritic MgCu2 phase was randomly distributed;layerⅡ with 140μm on the magnesium side made up of the lamellar nano-eutectic network Mg2Cu+(Mg) and a small amount of detached Mg2Cu phase. The average interfacial shear strength of the bimetal composite is measured to be 13 MPa.This study provides a new fabrication process for the application of Mg/Cu bimetal composites as the hydrogen storage materials.

Ab Initio Study on The Influence of Spin State upon Bonding and Interaction in FeCO*

Four FeCO states with 3d4s and 3d3d electrons spinpaired or spinunpaired were examined to investigate the influences of pairing versus unpairing mechanisms upon the bonding and interaction in FeCO.The calculation results show that the FeCO bonding and interaction are determined by a balance between the bonding stabilization and the exchange stabilization with 3d4s electron spinpairing or without it.The 3d3d electron spinpairing versus unpairing has a surprised effect on the FeCO bonding properties even though the 3d orbitals are usually considered as non bonding ones.

Study of New Way about Si/Si Bonding

A new set of technique was adopted in bonding Si-Si by using Ge (Ⅳ element),which is used as the substitute for the common hydrophilic method. The bond layer has no holes, and the edge bond-rate amounts to above 98%, and the bond strength is above 2156 Pa. By doping the same kind of dopant with low-resistance in Ge, the stress compensation was realized.

The preparation and performance analysis of zirconium-modified aluminum phosphate-based high-temperature(RT-1500℃)resistant adhesive for joining alumina in extreme environment

High-temperature-resistant adhesives are critical materials in the aerospace field.The zirconium-modified aluminum phosphate-based adhesives developed in this work had the advantage of adjustable thermal expansibility,achieving a high matching of coefficient of thermal expansion(CTE)with alumina.The introduction of zirconium can significantly improve the thermal stability of the adhesive matrix,and the Zr/Al ratio substantially affects the various reaction processes inside the adhesive,especially the types of zirconium-containing compounds.Most of the zirconium-containing compounds in the A7Z3 adhesive were ZrO2 only when the mass ratio of zirconium hydroxide to aluminum hydroxide was 3:7,which was the key reason why it had the highest CTE.The room-temperature bonding strength of A7Z3 after heat treatment at 1500℃reached 67.2 MPa.After pretreatment at 1500℃,the high-temperature bonding strength of A7Z3 was greater than 50 MPa in the range of(room temperature)RT-1000℃.After 40 thermal cycles between RT and 1500℃,the bonding strength still reached 10 MPa.Physical bonding occurred at temperatures below 1000℃,while chemical bonding dominated above 1000℃based on the generation of Al5BO9 and mullite at the interfaces.

Correlation of interfacial bonding mechanism and equilibrium conductance of molecular junctions

We report theoretical investigations oil tile role of interracial bonding mechanism and its resulting structures to quantum transport in molecular wires. Two bonding mechanisms for the Au-S bond in an Au（111） / 1,4-benzenedithiol（BDT）/Au（111） junction were identified by ab initio calculation, con- firmed by a recent experiment, which, we showed, critically control charge conduction. It was found, for Au/BDT/Aujunctions, the hydrogen atom, bound by a dative bond to the Sulfur, is energetically non-dissociativeafter the interface formation. The calculated conductance and junction breakdown forces of H-non-dissociative Au/BDT/Au devices are consistent with the experimental values, while the H-dissociated devices, with the interface governed by typical covalent bonding, give conduc- tance more than an order of magnitude larger. By examining the scattering states that traverse the junctions, we have revealed that mechanical and electric properties of a junction have strong corre- lation with the bonding configuration. This work clearly demonstrates that the interracial details. rather than previously believed ninny-body effects, is of vital importance for correctly predicting equilibrium conductance of molecular junctions; and manifests that the interfaeial contact must be carefully understood for investigating quantum transport properties of molecular nanoelectronics.

Active vibration control of piezoelectric bonded smart structures using PID algorithm

Thin-walled structures are sensitive to vibrate under even very small disturbances. In order to design a suitable controller for vibration suppression of thin-walled smart structures, an electro-mechanically coupled finite element（FE） model of smart structures is developed based on first-order shear deformation（FOSD） hypothesis. Considering the vibrations generated by various disturbances, which include free and forced vibrations, a PID control is implemented to damp both the free and forced vibrations. Additionally, an LQR optimal control is applied for comparison.The implemented control strategies are validated by a piezoelectric layered smart plate under various excitations.

Detailed Evolution Mechanism of Interfacial Void Morphology in Diffusion Bonding

Similar diffusion bonding of 1Cr11Ni2W2MoV stainless steel was conducted at different bonding tem- peratures. The interface characteristics and mechanical properties of joints were examined, and the evolution of interracial void morphology was analyzed in detail The results showed that there were four typical interfacial void shapes generating sequentially： the large scraggly voids, penny-shaped voids, ellipse voids and rounded voids. The variation of interracial void shape was dominated by surface diffusion, while the reduction of void volume was ascribed to the combined effects of plastic flow of materials around voids, interface diffusion and volume diffusion. Owing to the elimination of void from the bonding interface, the sound joint obtained could exhibit nearly full interracial contact, and present excellent mechanical properties, in which the microhardness and shear strength of joint matched those of base material.

Mechanism and rate constants for complete series reactions of 19 fluorophenols with atomic H

Fluorine-containing halogenated fluorophenol may have effect as intermediate species involved in the formation of polyfluorinated dibenzo-p-dioxin/dibenzofurans （PFDDs/Fs）. The mechanism for the atomic H initiated reactions with complete series of nineteen fluorophenol congeners was studies using the density functional theory. At the MPWB1K,/6-31＋G（d,p） level, the geometries and frequencies of reactants, transition states, and products were obtained, and the accurate energetic values were acquired at the MPWB 1K/6-311 ＋G（3df,2p） level. The rate constants were evaluated by the canonical variational transition-state theory with the small curvature tunneling contribution over a wide temperature range of 600-1000 K. The study shows that the intramolecular hydrogen-bond in the ortho-substituted FPs as well as the inductive effect of the electron-withdrawing fluorine and steric repulsion of multiple substitutions may ultimately be responsible for the relative strength of the O-H bonds in FPs. The results can be used for further studies on PFDD/Fs formation mechanism.

Fluorinated [2]rotaxanes as sensitive ^(19)F MRI agents: Threading for higher sensitivity

As a promising imaging technology,the low sensitivity of fluorine-19 magnetic resonance imaging(^(19)F MRI)severely hinders its biomedical applications.Herein,we have developed an unprecedented rotaxanebased strategy to improve the sensitivity of^(19)F MRI agents.By threading the fluorinated macrocycle into2-blade pinwheel[2]rotaxanes,the^(19)F longitudinal relaxation rate R1was dramatically increased,resulting in a significant^(19)F MRI signal intensity enhancement of up to 79%.Through comparative molecular dynamics studies using a series of solution and solid-state^(1)H/^(19)F nuclear magnetic resonance(^(1)H/^(19)F NMR)and molecular dynamics simulations,it was found that the formation of mechanical bonds dramatically restricts the motion of the wheel fluorines and thus increasing the R1for higher^(19)F MRI sensitivity.Besides a novel strategy for improving^(19)F MRI sensitivity,this study has established^(19)F NMR/MRI as a valuable technology for monitoring the molecular dynamics of rotaxanes,which may shed new light on high-performance^(19)F MRI agents and molecular devices.

Recent advances and trends in roll bonding process and bonding model:A review

This review presents a thorough survey of the roll bonding process with a focus on the bimetallic bars/tubes as well as the bonding models and criteria.The review aims to provide insight into cold,hot and cryogenic bonding mechanisms at the micro and atomic scale and act as a guide for researchers working on roll bonding,other joining processes and bonding simulation.Mean-while,the shortcomings of roll bonding processes are presented from the aspect of formable shapes,while bonding models are shown from the aspect of calculation time,convergence,interface behav-ior of dissimilar materials as well as hot bonding status prediction.Two well-accepted numerical methodologies of bonding models,namely the contact algorithm and cohesive zone model(CZM)of bonding models and in simulations of the bonding process are highlighted.Particularly,recent advances and trends in the application of the combination of mechanical interlocking and metallurgical bonding,special energy fields,gradient structure,novel materials,green technology and soft computing method in the roll bonding process are also discussed.The challenges for advancing and prospects of the roll bonding process and bonding model are presented in an attempt to shed some light on the future research direction.

Effect of Laser Processing Pattern on the Mechanical Properties of Aluminum Alloy Adhesive Joints

Adhesive bonding is a promising joining technology for joining lightweight aluminum structures,offering advantages such as the absence of additional heat input,connection damage,and environmental pollution.To further enhance the strength of aluminum adhesive joints,this study investigates the influence of laser surface treatment on their mechanical properties.Specifically,the effect of laser processing patterns and their geometric parameters on aluminum alloy adhesive joints is examined.A fiber laser is used to process crater array and multi-groove pattern on A6061 aluminum surface.The impact of crater overlap ratio and groove distance on various aspects,including aluminum surface morphology,roughness(Sa),adhesive joints shear,tensile strength,and failure modes is discussed.Laser confocal microscope tests,water contact angle tests,lap shear tests,and cross tensile tests are employed to analyze these parameters.The results indicate that as the crater overlap ratio increases,the S_(a) value of the aluminum surface increases.Moreover,the shear strength of adhesive joints initially increases and then decreases,while the tensile strength consistently increases.On the other hand,an increase in groove distance leads to a decrease in S_(a),as well as a reduction in both shear and tensile strength of adhesive joints.For shear loading conditions,mechanical interlocking is identified as one of the bonding mechanisms in aluminum adhesive joints featuring crater array and multi-groove patterns.The formation of interlocking structures is found to be influenced by the aluminum surface pattern and its associated parameters,as revealed through failure surface analysis.Specifically,adhesive and crater or groove interactions contribute to the formation of interlocking structures in specimens with a crater overlap ratio of -60% or groove distances of 120,180,300,and 400μm.Conversely,specimens with overlap ratios of 0%,40%,and 60% exhibit interlocking structures formed by the adhesive and crater edge.

Advanced cold spray technology:Deposition characteristics and potential applications

Cold spray technology,originated from the Institute of Theoretical and Applied Mechanics Siberian branch of the Russian Academy of Sciences,is a rapidly emerging industrial coating technology.Cold sprayed particles with high-velocity impact onto a substrate so as to induce severe plastic deformation and then create a deposit.For its low temperature and high velocity compared with thermal spraying,the cold spraying process is increasingly used in the industries for protective coating.The deposition characteristics of the particles,coating formation and bonding mechanism of the cold spraying process are different from thermal spraying.Many theory investigations of the cold spraying process contribute to the development of the high performance coatings,which makes the cold spraying process as a popular research field.Presently,the deposition characteristics,bonding mechanism,process optimization as well as classical applications of the cold spraying technology in the past are reviewed,and the interesting points for the further development,optimization and applications of this technology are also recommended.

Fabrication and Characterization of High-Bonding-Strength Al/Ti/Al-Laminated Composites via Cryorolling

Sandwich-like Al/Ti/Al-laminated composites have many advantages such as low density and high specific strength with value in mechanical manufacturing and aerospace engineering. Here, Al/Ti/Al-laminated composites were fabricated by hot roll bonding and subsequent processes: cryorolling(-190 ℃ and-100 ℃), cold rolling(25 ℃), and hot rolling(300 ℃). Their bonding strength and mechanical properties were then studied by an Autograph AGS-X universal electronic testing machine. The results show that cryorolling can improve the interface bonding strength and tensile strength of Al/Ti/Allaminated composites. For the Al/Ti/Al-laminated composites subjected to cryorolling at-100 ℃, they have the highest strength near 260 MPa—this is 48 MPa and 41 MPa higher than the laminated composites subjected to cold and hot rolling, respectively. These results also show the strongest peeling strength. Finally, the mechanisms of the enhancement of bonding strength and mechanical properties of Al/Ti/Al-laminated composites subjected to cryorolling were mainly discussed.