Hybrid bonding of GaAs and Si wafers at low temperature by Ar plasma activation

High-quality bonding of 4-inch GaAs and Si is achieved using plasma-activated bonding technology.The influence of Ar plasma activation on surface morphology is discussed.When the annealing temperature is 300℃,the bonding strength reaches a maximum of 6.2 MPa.In addition,a thermal stress model for GaAs/Si wafers is established based on finite element analysis to obtain the distribution of equivalent stress and deformation variables at different temperatures.The shape varia-tion of the wafer is directly proportional to the annealing temperature.At an annealing temperature of 400℃,the maximum protrusion of 4 inches GaAs/Si wafers is 3.6 mm.The interface of GaAs/Si wafers is observed to be dense and defect-free using a transmission electron microscope.The characterization of interface elements by X-ray energy dispersion spectroscopy indi-cates that the elements at the interface undergo mutual diffusion,which is beneficial for improving the bonding strength of the interface.There is an amorphous transition layer with a thickness of about 5 nm at the bonding interface.The preparation of Si-based GaAs heterojunctions can enrich the types of materials required for the development of integrated circuits,improve the performance of materials and devices,and promote the development of microelectronics technology.

Effect of neutral polymeric bonding agent on tensile mechanical properties and damage evolution of NEPE propellant

Introducing Neutral Polymeric bonding agents(NPBA) into the Nitrate Ester Plasticized Polyether(NEPE)propellant could improve the adhesion between filler/matrix interface, thereby contributing to the development of new generations of the NEPE propellant with better mechanical properties. Therefore,understanding the effects of NPBA on the deformation and damage evolution of the NEPE propellant is fundamental to material design and applications. This paper studies the uniaxial tensile and stress relaxation responses of the NEPE propellant with different amounts of NPBA. The damage evolution in terms of interface debonding is further investigated using a cohesive-zone model(CZM). Experimental results show that the initial modulus and strength of the NEPE propellant increase with the increasing amount of NPBA while the elongation decreases. Meanwhile, the relaxation rate slows down and a higher long-term equilibrium modulus is reached. Experimental and numerical analyses indicate that interface debonding and crack propagation along filler-matrix interface are the dominant damage mechanism for the samples with a low amount of NPBA, while damage localization and crack advancement through the matrix are predominant for the ones with a high amount of NPBA. Finally, crosslinking density tests and simulation results also show that the effect of the bonding agent is interfacial rather than due to the overall crosslinking density change of the binder.

Mechanical properties and interfacial characteristics of 6061 Al alloy plates fabricated by hot-roll bonding

This work aims to investigate the mechanical properties and interfacial characteristics of 6061 Al alloy plates fabricated by hotroll bonding(HRB)based on friction stir welding.The results showed that ultimate tensile strength and total elongation of the hot-rolled and aged joints increased with the packaging vacuum,and the tensile specimens fractured at the matrix after exceeding 1 Pa.Non-equilibrium grain boundaries were formed at the hot-rolled interface,and a large amount of Mg_(2)Si particles were linearly precipitated along the interfacial grain boundaries(IGBs).During subsequent heat treatment,Mg_(2)Si particles dissolved back into the matrix,and Al_(2)O_(3) film remaining at the interface eventually evolved into MgO.In addition,the local IGBs underwent staged elimination during HRB,which facilitated the interface healing due to the fusion of grains at the interface.This process was achieved by the dissociation,emission,and annihilation of dislocations on the IGBs.

Time-dependent effects in transient liquid phase bonding of 304L and Cp-Ti using an Ag-Cu interlayer

One of the challenges for bimetal manufacturing is the joining process.Hence,transient liquid phase(TLP)bonding was performed between 304L stainless steel and Cp-Ti using an Ag-Cu interlayer with a thickness of 75μm for bonding time of 20,40,60,and 90 min.The bonding temperature of 860℃ was considered,which is under the β transus temperature of Cp-Ti.During TLP bonding,various intermetallic compounds(IMCs),including Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe),Ti_(2)(Cu,Ag),and Ti_(2)Cu from 304L toward Cp-Ti formed in the joint.Also,on the one side,with the increase in time,further diffusion of elements decreases the blocky IMCs such as Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe)in the 304L diffusion-affected zone(DAZ)and reaction zone,and on the other side,Ti_(2)(Cu,Ag)IMC transformed into fine morphology toward Cp-Ti DAZ.The microhardness test also demonstrated that the(Cr,Fe)_(2)Ti+Ti_(5)Cr_(7)Fe_(17) IMCs in the DAZ on the side of 304L have a hardness value of HV 564,making it the hardest phase.The maximum and minimum shear strength values are equal to 78.84 and 29.0 MPa,respectively.The cleavage pattern dominated fracture surfaces due to the formation of brittle phases in dissimilar joints.

Achieving Narrowed Bandgaps and Blue-Light Excitability in Zero-Dimensional Hybrid Metal Halide Phosphors via Introducing Cation-Cation Bonding

Zero-dimensional(0D)hybrid metal halides,which consist of organic cations and isolated inorganic metal halide anions,have emerged as phosphors with efficient broadband emissions.However,these materials generally have too wide bandgaps and thus cannot be excited by blue light,which hinders their applications for efficient white light-emitting diodes(WLEDs).The key to achieving a blue-light-excitable 0D hybrid metal halide phosphor is to reduce the fundamental bandgap by rational chemical design.In this work,we report two designed hybrid copper(I)iodides,(Ph_(3)MeP)_(2)Cu_(4)I_(6)and(Cy_(3)MeP)_(2)Cu_(4)I_(6),as blue-light-excitable yellow phosphors with ultrabroadband emission.In these compounds,the[Cu_(4)I_(6)]^(2-)anion forms an I6 octahedron centered on a cationic Cu_(4)tetrahedron.The strong cation-cation bonding within the unique cationic Cu_(4)tetrahedra enables significantly lowered conduction band minimums and thus narrowed bandgaps,as compared to other reported hybrid copper(I)iodides.The ultrabroadband emission is attributed to the coexistence of free and self-trapped excitons.The WLED using the[Cu_(4)I_(6)]^(2-)anion-based single phosphor shows warm white light emission,with a high luminous efficiency of 65 Im W^(-1)and a high color rendering index of 88.This work provides strategies to design narrow-bandgap 0D hybrid metal halides and presents two first examples of blue-light-excitable 0D hybrid metal halide phosphors for efficient WLEDs.

Carbon Fiber Breakage Mechanism in Aluminum(Al)/Carbon Fibers(CFs) Composite Sheet during Accumulative Roll Bonding(ARB) Process

We put forward a method of fabricating Aluminum(Al)/carbon fibers(CFs) composite sheets by the accumulative roll bonding(ARB) method. The finished Al/CFs composite sheet has CFs and pure Al sheets as sandwich and surface layers. After cross-section observation of the Al/CFs composite sheet, we found that the CFs discretely distributed within the sandwich layer. Besides, the tensile test showed that the contribution of the sandwich CFs layer to tensile strength was less than 11% compared with annealed pure Al sheet. With ex-situ observation of the CFs breakage evolution with-16%,-32%, and-45% rolling reduction during the ARB process, the plastic instability of the Al layer was found to bring shear damages to the CFs. At last, the bridging strengthening mechanism introduced by CFs was sacrificed. We provide new insight into and instruction on Al/CFs composite sheet preparation method and processing parameters.

3D reconstruction and defect pattern recognition of bonding wire based on stereo vision

Non-destructive detection of wire bonding defects in integrated circuits(IC)is critical for ensuring product quality after packaging.Image-processing-based methods do not provide a detailed evaluation of the three-dimensional defects of the bonding wire.Therefore,a method of 3D reconstruction and pattern recognition of wire defects based on stereo vision,which can achieve non-destructive detection of bonding wire defects is proposed.The contour features of bonding wires and other electronic components in the depth image is analysed to complete the 3D reconstruction of the bonding wires.Especially to filter the noisy point cloud and obtain an accurate point cloud of the bonding wire surface,a point cloud segmentation method based on spatial surface feature detection(SFD)was proposed.SFD can extract more distinct features from the bonding wire surface during the point cloud segmentation process.Furthermore,in the defect detection process,a directional discretisation descriptor with multiple local normal vectors is designed for defect pattern recognition of bonding wires.The descriptor combines local and global features of wire and can describe the spatial variation trends and structural features of wires.The experimental results show that the method can complete the 3D reconstruction and defect pattern recognition of bonding wires,and the average accuracy of defect recognition is 96.47%,which meets the production requirements of bonding wire defect detection.

Bonding enhancement of cold rolling TA1 P-Ti/AA6061 composite plates via surface oxidation treatment

TA1 P-Ti/AA6061 composite plate was produced by oxidizing the surface of the titanium plate and adopting a cold roll bonding process.The results revealed that the oxide film(Ti6O)prepared on the surface of TA1 pure titanium was easy to crack during the cold roll bonding,thereby promoting the formation of an effective mechanical interlock at the interface,which can effectively reduce the minimum reduction rate of the composite plates produced by cold rolling of titanium and aluminium plates.Moreover,the composite plate subjected to oxidation treatment exhibited high shear strength,particularly at a 43%reduction rate,achieving a commendable value of 117 MPa.Based on oxidation treatment and different reduction rates,the annealed composite plates at temperatures of 400,450,and 500°C displayed favorable resistance to interface delamination,highlighting their remarkable strength-plasticity compatibility as evidenced by a maximum elongation of 31.845%.

Analysis of Bonding Properties of Corroded Reinforcement Concrete

In order to investigate the degradation of bonding properties between corroded steel bars and concrete,this study employs the half-beam method to conduct bond-slip tests between corroded steel bars and concrete after impressed-current accelerated corrosion of the steel bars in concrete.The effects of steel corrosion rate,steel bar diameter,steel bar strength grade,and concrete strength grade on the bonding properties between concrete and corroded steel bars were analyzed.The influence of different corrosion rates on specimens’bonding strength and bond-slip curves was determined,and a constitutive relationship for bond-slip between corroded steel bars and concrete was proposed.The results indicate that the ultimate bonding strength of corroded reinforced concrete specimens decreases with increasing corrosion rate.Additionally,an increase in corrosive crack width leads to a linear decrease in bonding strength.Evaluating the decline in adhesive properties through rust expansion crack width in engineering applications is feasible.Furthermore,a bond-slip constitutive relationship between corroded steel bars and concrete was established using relative bond stress and relative slip values,which aligned well with the experimental findings.

FOG Bonding 电阻降低方案及机理探究

近年来,中小尺寸产品客户端上线TP问题频发,其中有一类TP不良由FOG Bonding电阻异常偏大导致,但二次因未知。FOG堆叠结构为PNL+ACF(异方性导电胶)+FPC,但PNL、FPC为走线电阻,本身电阻较小(<1Ω),故不考虑此影响。基于此,重点研究FOG Bonding接触电阻。首先建立机理模型并进行探究,然后通过调整FOG Bonding参数,使ACF导电粒子的爆破状态和胶体的固化状态达到最优,最终降低电阻。

Toray develops hybrid bonding insulating resin and revolutionary polymer membrane

This year,Toray Industries,Inc.,announced that it has developed an insulating resin material for hybrid bonding(micro bonding).The material is based on Semicofine™and Photoneece™.These are high-heat-resistant polyimide coatings for semiconductor and display devices.The new material combines a conventional polyimide coating agent with the company’s processing and bonding technologies.It can enhance the yields and reliability of semiconductor devices in the hybrid bonding process,which entails bonding semiconductor chips with metal electrodes.Toray will push ahead with prototyping and providing samples to customers.It aims to obtain materials certification in 2025 and start mass production by 2028.

Transient liquid phase bonding of DD5 superalloy using a designed interlayer: microstructure and mechanical properties

Nickel based single crystal superalloy is currently widely used as the material for turbine blades in aerospace engines.However,metallurgical defects during the manufacturing process and damage during harsh environmental service are inevitable challenges for turbine blades.Therefore,bonding techniques play a very important role in the manufacturing and repair of turbine blades.The transient liquid phase(TLP)bonding of DD5 Ni-based single crystal superalloy was performed using the designed H1 interlayer.A new third-generation Ni-based superalloy T1 powder was mixed with H1 powder as another interlayer to improve the mechanical properties of the bonded joints.The res-ults show that,such a designed H1 interlayer is beneficial to the improvement of shear strength of DD5 alloy bonded joints by adjusting the bonding temperature and the prolongation of holding time.The maximum shear strength at room temperature of the joint with H1 interlayer reached 681 MPa when bonded at 1260℃for 3 h.The addition of T1 powder can effectively reduce holding time or relatively lower bond-ing temperature,while maintaining relatively high shear strength.When 1 wt.%T1 powder was mixed into H1 interlayer,the maximum room temperature shear strength of the joint bonded at 1260℃reached 641 MPa,which could be obtained for only 1 h.Considering the bonding temperature and the efficiency,the acceptable process parameter of H1+5 wt.%T1 interlayer was 1240℃/2 h,and the room tem-perature shear strength reached 613 MPa.

Structure Regulation of Electric Double Layer via Hydrogen Bonding Effect to Realize High-Stability Lithium-Metal Batteries

The interfacial chemistry of solid electrolyte interphases(SEI)on lithium(Li)electrode is directly determined by the structural chemistry of the electric double layer(EDL)at the interface.Herein,a strategy for regulating the structural chemistry of EDL via the introduction of intermolecular hydrogen bonds has been proposed(p-hydroxybenzoic acid(pHA)is selected as proof-of-concept).According to the molecular dynamics(MD)simulation and density functional theory(DFT)calculation results,the existence of hydrogen bonds realizes the anion structural rearrangement in the EDL,reduces the lowest unoccupied molecular orbital(LUMO)energy level of anions in the EDL,and the number of free solvent molecules,which promotes the formation of inorganic species-enriched SEI and eventually achieves the dendrite-free Li deposition.Based on this strategy,Li‖Cu cells can stably run over 185 cycles with an accumulated active Li loss of only 2.27 mAh cm^(-2),and the long-term cycle stability of Li‖Li cells is increased to 1200 h.In addition,the full cell pairing with the commercial LiFePO_(4)(LFP)cathodes exhibits stable cycling performance at 1C,with a capacity retention close to 90%after 200 cycles.

Interlaminar Bonding Performance of UHPC/SMA Based on Diagonal Shear Test

To evaluate various interlaminar bonding reinforcement techniques used for steel bridge decks,the UHPC surface was roughened with shot blasting(SB),transverse grooving(TG)and surface embedded stone(S),epoxy resin(E),epoxy asphalt(EA)and high viscosity high elasticity asphalt(HV)as interlayer bonding materials.In addition,a diagonal shear test was conducted using a self-designed diagonal shear jig.The effects of adhesive layer materials type,surface texture type,and different loading rates on the interlaminar bonding performance of UHPC/SMA combination specimens were investigated.The experimental study showed that the peak shear strength and shear modulus of the combined specimen decreased gradually with the decrease of thermosetting of the adhesive layer materials.The peak shear fracture energy of E was greater than that of HV and EA.The synergistic effect of the contact force generated by the roughing of the UHPC surface,the friction force,and the bonding force provided by the adhesive layer material can significantly improve the interlaminar shear performance of the assemblies.The power-law function of shear strength and shear modulus was proposed.The power-law model of peak shear strength and loading rate was verified.The shear strength and predicted shear strength satisfy the positive proportional functions with scale factors of 0.985,1.015,0.961,and 1.028,respectively.

Factor Structure and Measurement Invariance of the Japanese Version of the Mother-to-Infant Bonding Scale

Background: Bonding disorders affect the growth and development of infants. In Japan, the Japanese version of the Mother-to-Infant Bonding Scale (MIBS-J) is widely used for early detection of bonding disorders. Repeated use of a questionnaire has problems of reduced validity. In order to correctly detect bonding disorders at multiple time points, it is necessary to confirm the measurement invariance of the scale. Baba et al. reported that invariance of the MIBS-J factor structure could only be obtained by abridging the scale into three items. Purpose: The aim of this study was to 1) confirm the factor structure and measurement invariance of the MIBS-J between two measurement times and 2) to examine factors that can be used without being affected by measurement time in order to identify item that contribute to measure met invariance. Methods: We analysed the data of 1049 and 878 mothers with a neonate collected in two waves: 5 days (Wave 1) and 1 month postpartum (Wave 2). Exploratory and confirmatory factor analyses were conducted on the data randomly divided into two groups in each wave. Results: The three-item model (MIBS-J items 1, 6, and 8) was most accepted. Measurement invariance and structural invariance were confirmed in the model. This was consistent with Baba et al.’s model. Conclusion: The three MIBS-J items showed measurement invariance and structural invariance in Japanese mothers during 1 month postpartum.

Bonding mechanisms of SiO_(2) glass and 1060 Al by ultrasonic assisted active metal soldering process

In this work,the ultrasonic assisted active metal soldering of SiO_(2) glass and Al was successfully achieved using Sn-2Ti solder filler at a low soldering temperature of 250℃in ambient atmosphere.A nano-crystallineα-Al2O3 layer with the average thickness of 13.9 nm and a nano-crystalline R-TiO_(2) layer with the average thickness of 16.2 nm are formed at the interface of Al/Sn and SiO_(2)/Sn respectively because Al elements did not diffuse from Al alloy side to SiO_(2) side,which verified that a sono-oxidation reaction had occurred during the ultrasonic assisted active metal soldering process.The soldered butt joints exhibited an average tensile strength of 25.31 MPa.

Strength-ductility balance of AZ31 magnesium alloy via accumulated extrusion bonding combined with two-stage artificial cooling Author links open overlay panel

AZ31 Mg alloy with heterogeneous bimodal grain structure(smaller grain size of 5-20µm and coarser grain size of 100-200µm)was subjected to accumulated extrusion bonding(AEB)at 250℃combined with two-stage artificial cooling in this work,viz.local water cooling and artificial cooling.The microstructure developed consecutively as a result of discontinuous dynamic recrystallization(DDRX)for the AEBed samples.{10-12}tensile twinning also played an important role for the AEB with local water cooling at the initial extrusion stage in the container.Local water cooling could further reduce the DRXed grain size to~2.1µm comparing that without water cooling.And the grain growth rate was reduced by artificial cooling out of extrusion die.Under the combination of two-stage cooling,the fine DRXed grains at sizing band were almost retained with average grain size of~2.3µm after the sheet out of extrusion die,and the unDRXed grains with high residual dislocation density accumulation were also reserved.The tensile tests results indicated that a good strength-ductility balance with a high ultimate tensile strength(319 MPa vs.412 MPa)and fracture elongation(19.9%vs.30.3%)were obtained.The strength enhancement was mainly owing to the grain refinement and local residual plastic strain reserved by the artificial cooling.The excellent ductility originated from fine DRXed microstructure and ED-tilt double peak texture.

Characterization of Curing and Bonding of Wood with Adhesive Mixtures of Liquefied Wood and Hexamethylenediamine

Various crosslinking agents can be added to the formulations of natural-based adhesives for wood bonding in order to achieve better durability and higher strength of the formed joints.In the present study,the effect of hexamethylenediamine(HMDA)addition on the performance of liquefied wood(LW)adhesive for wood bonding is investigated.Differential scanning calorimetry showed the improved thermal stability and crosslinking of the LW adhesive with HMDA.The intensified presence of amide linkages(C–N bonds)was found in LW+HMDA with attenuated total reflection Fourier transform infrared spectroscopy.Analysis of the bonded joints using an automated bonding evaluation system showed that a higher press temperature resulted in stronger bonds for both types of adhesives.Moreover,the addition of HMDA to LW adhesive improved the bond strength of the joints and accelerated the crosslinking of the adhesive.However,with a tensile shear strength of(6.76±2.16)N×mm^(−2)(for LW)and(6.89±2.10)N×mm^(−2)(for LW+HMDA),both adhesives were found to be unsuitable for interior non-structural use.In addition,the acidity of LW resulted in relatively high wood failure(70%)in the adhesive joints tested.Improved crosslinking of LW with HMDA was reflected in improved resistance of LW+HMDA adhesive joints to water degradation.In conclusion,HMDA is a promising additive for improving the adhesive performance of LW adhesives.

Fluxless bonding with silver nanowires aerogel in die-attached interconnection

The electronic product has gravitated towards component miniaturization and integration, employment of lead-free materials, and low-temperature soldering processes. Noble-metal aerogels have drawn increasing attention for high conduction and low density. However,the noble metal aerogels with outstanding solderability were rarely studied. This work has successfully synthesized an aerogel derived from silver nanowires(AgNWs) using a liquid phase reduction method. It is found that the noble metal aerogels can be made into diverse aerogel preformed soldering sheets. The influence of bonding temperature(150-300 ℃), time(2-20 min), and pressure(5-20 MPa) on the joint strength of the AgNWs aerogel affixed to electroless nickel/silver copper plates were investigated. Additionally, the AgNWs aerogel displays almost the same shear strength for substrates of various sizes. In a word, this study presents a flux-free, high-strength, and adaptable soldering structural material.

Bonding interface characteristic and shear strength of diffusion bonded Ti-17 titanium alloy

The bonding interface characteristic and shear strength of diffusion bonded Ti-17 titanium alloy at different bonding time were investigated. The results show that the average size of voids decreases while the amount of voids decreases after increasing to the maximum value with the increasing bonding time. The irregular void with a scraggly edge tends to an ellipse void with smooth surface and then changes to a tiny void with round shape. The grains across bonding interface occur at bonding time of 60 min. The shear strength of bond increases with increasing bonding time, and the highest shear strength of bond is 887.4 MPa at 60 min. The contribution of plastic deformation on the void closure and the increase of shear strength is significant even though the action time of plastic deformation is short.