Relative Irradiance Measurement and Bonding Configurations of Amorphous Fluorinated Carbon Films Deposited by Electron Cyclotron Resonance Plasma

a-C:F films are deposited by microwave electron cyclotron resonance (ECR)plasma chemical vapor deposition (CVD) using trifluoromethane (CHF3) and benzene (C6H6) as source gases at different microwave powers. The radicals in plasma originating from source gases dissociation are analyzed by relative irradiance measurement. The bonding configurations and binding state of a-C:F films are measured with Fourier-transformed infrared spectrometer (FTIR) and x-ray photoelectron spectroscopy (XPS). The results show that a-C:F films are mainly composed of CF radical at lower powers but of CF2 radical at higher powers. The deposition of films is related to the radicals generated in plasma and the main bonding configurations are dependent on the ratio of CF to CF2 radicals in films.

Interface states study of intrinsic amorphous silicon for crystalline silicon surface passivation in HIT solar cell

Intrinsic hydrogenated amorphous silicon（a-Si：H） film is deposited on n-type crystalline silicon（c-Si） wafer by hotwire chemical vapor deposition（HWCVD） to analyze the amorphous/crystalline heterointerface passivation properties.The minority carrier lifetime of symmetric heterostructure is measured by using Sinton Consulting WCT-120 lifetime tester system,and a simple method of determining the interface state density（D_（it）） from lifetime measurement is proposed.The interface state density（D_（it）） measurement is also performed by using deep-level transient spectroscopy（DLTS） to prove the validity of the simple method.The microstructures and hydrogen bonding configurations of a-Si：H films with different hydrogen dilutions are investigated by using spectroscopic ellipsometry（SE） and Fourier transform infrared spectroscopy（FTIR） respectively.Lower values of interface state density（D_（it）） are obtained by using a-Si：H film with more uniform,compact microstructures and fewer bulk defects on crystalline silicon deposited by HWCVD.

Anodic bonding using a hybrid electrode with a two-step bonding process

A two-step bonding process using a novel hybrid electrode is presented.The effects of different electrodes on bonding time,bond strength and the bonded interface are analyzed.The anodic bonding is studied using a domestic bonding system,which carries out a detailed analysis of the integrity of the bonded interface and the bond strength measurement.With the aid of the hybrid electrode,a bubble-free anodic bonding process could be accomplished within 15-20 min,with a shear strength in excess of 10 MPa.These results show that the proposed method has a high degree of application value,including in most wafer-level MEMS packaging.

Effects of ion bombardment on microcrystalline silicon growth by inductively coupled plasma assistant magnetron sputtering

Hydrogenated microcrystalline silicon （mc-Si：H） thin films were deposited by inductively coupled plasma assistant magnetron sputtering （ICP-MS） in an Ar-H2 gas mixture. The role of ion bombardment in the growth of mc-Si：H films was studied with increasing negative bias voltages on the substrate holder from 0 to -100 V. Raman scattering, X-ray diffraction （XRD）, Fourier transform infrared （FTIR） spectroscopy and transmission electron microscopy （TEM） were performed to investigate the microstructure changes of deposited Si films. Raman scattering showed that the high energy ion bombardment resulted in crystalline degradation of Si films. The XRD results showed the decrease and even elimination of preferential growth orientation of crystalline Si films with ion bombardment energy increase. The SiH bonding configuration changes and the increase of bonded hydrogen concentration were determined with the analysis of FTIR spectra. Furthermore, the dramatic evolution of cross-sectional morphology of Si thin films was detected by TEM observation.