Transient liquid phase bonding of DD5 superalloy using a designed interlayer: microstructure and mechanical properties

Nickel based single crystal superalloy is currently widely used as the material for turbine blades in aerospace engines.However,metallurgical defects during the manufacturing process and damage during harsh environmental service are inevitable challenges for turbine blades.Therefore,bonding techniques play a very important role in the manufacturing and repair of turbine blades.The transient liquid phase(TLP)bonding of DD5 Ni-based single crystal superalloy was performed using the designed H1 interlayer.A new third-generation Ni-based superalloy T1 powder was mixed with H1 powder as another interlayer to improve the mechanical properties of the bonded joints.The res-ults show that,such a designed H1 interlayer is beneficial to the improvement of shear strength of DD5 alloy bonded joints by adjusting the bonding temperature and the prolongation of holding time.The maximum shear strength at room temperature of the joint with H1 interlayer reached 681 MPa when bonded at 1260℃for 3 h.The addition of T1 powder can effectively reduce holding time or relatively lower bond-ing temperature,while maintaining relatively high shear strength.When 1 wt.%T1 powder was mixed into H1 interlayer,the maximum room temperature shear strength of the joint bonded at 1260℃reached 641 MPa,which could be obtained for only 1 h.Considering the bonding temperature and the efficiency,the acceptable process parameter of H1+5 wt.%T1 interlayer was 1240℃/2 h,and the room tem-perature shear strength reached 613 MPa.

Hybrid bonding of GaAs and Si wafers at low temperature by Ar plasma activation

High-quality bonding of 4-inch GaAs and Si is achieved using plasma-activated bonding technology.The influence of Ar plasma activation on surface morphology is discussed.When the annealing temperature is 300℃,the bonding strength reaches a maximum of 6.2 MPa.In addition,a thermal stress model for GaAs/Si wafers is established based on finite element analysis to obtain the distribution of equivalent stress and deformation variables at different temperatures.The shape varia-tion of the wafer is directly proportional to the annealing temperature.At an annealing temperature of 400℃,the maximum protrusion of 4 inches GaAs/Si wafers is 3.6 mm.The interface of GaAs/Si wafers is observed to be dense and defect-free using a transmission electron microscope.The characterization of interface elements by X-ray energy dispersion spectroscopy indi-cates that the elements at the interface undergo mutual diffusion,which is beneficial for improving the bonding strength of the interface.There is an amorphous transition layer with a thickness of about 5 nm at the bonding interface.The preparation of Si-based GaAs heterojunctions can enrich the types of materials required for the development of integrated circuits,improve the performance of materials and devices,and promote the development of microelectronics technology.

Achieving Narrowed Bandgaps and Blue-Light Excitability in Zero-Dimensional Hybrid Metal Halide Phosphors via Introducing Cation-Cation Bonding

Zero-dimensional(0D)hybrid metal halides,which consist of organic cations and isolated inorganic metal halide anions,have emerged as phosphors with efficient broadband emissions.However,these materials generally have too wide bandgaps and thus cannot be excited by blue light,which hinders their applications for efficient white light-emitting diodes(WLEDs).The key to achieving a blue-light-excitable 0D hybrid metal halide phosphor is to reduce the fundamental bandgap by rational chemical design.In this work,we report two designed hybrid copper(I)iodides,(Ph_(3)MeP)_(2)Cu_(4)I_(6)and(Cy_(3)MeP)_(2)Cu_(4)I_(6),as blue-light-excitable yellow phosphors with ultrabroadband emission.In these compounds,the[Cu_(4)I_(6)]^(2-)anion forms an I6 octahedron centered on a cationic Cu_(4)tetrahedron.The strong cation-cation bonding within the unique cationic Cu_(4)tetrahedra enables significantly lowered conduction band minimums and thus narrowed bandgaps,as compared to other reported hybrid copper(I)iodides.The ultrabroadband emission is attributed to the coexistence of free and self-trapped excitons.The WLED using the[Cu_(4)I_(6)]^(2-)anion-based single phosphor shows warm white light emission,with a high luminous efficiency of 65 Im W^(-1)and a high color rendering index of 88.This work provides strategies to design narrow-bandgap 0D hybrid metal halides and presents two first examples of blue-light-excitable 0D hybrid metal halide phosphors for efficient WLEDs.

3D reconstruction and defect pattern recognition of bonding wire based on stereo vision

Non-destructive detection of wire bonding defects in integrated circuits(IC)is critical for ensuring product quality after packaging.Image-processing-based methods do not provide a detailed evaluation of the three-dimensional defects of the bonding wire.Therefore,a method of 3D reconstruction and pattern recognition of wire defects based on stereo vision,which can achieve non-destructive detection of bonding wire defects is proposed.The contour features of bonding wires and other electronic components in the depth image is analysed to complete the 3D reconstruction of the bonding wires.Especially to filter the noisy point cloud and obtain an accurate point cloud of the bonding wire surface,a point cloud segmentation method based on spatial surface feature detection(SFD)was proposed.SFD can extract more distinct features from the bonding wire surface during the point cloud segmentation process.Furthermore,in the defect detection process,a directional discretisation descriptor with multiple local normal vectors is designed for defect pattern recognition of bonding wires.The descriptor combines local and global features of wire and can describe the spatial variation trends and structural features of wires.The experimental results show that the method can complete the 3D reconstruction and defect pattern recognition of bonding wires,and the average accuracy of defect recognition is 96.47%,which meets the production requirements of bonding wire defect detection.

Mechanical properties and interfacial characteristics of 6061 Al alloy plates fabricated by hot-roll bonding

This work aims to investigate the mechanical properties and interfacial characteristics of 6061 Al alloy plates fabricated by hotroll bonding(HRB)based on friction stir welding.The results showed that ultimate tensile strength and total elongation of the hot-rolled and aged joints increased with the packaging vacuum,and the tensile specimens fractured at the matrix after exceeding 1 Pa.Non-equilibrium grain boundaries were formed at the hot-rolled interface,and a large amount of Mg_(2)Si particles were linearly precipitated along the interfacial grain boundaries(IGBs).During subsequent heat treatment,Mg_(2)Si particles dissolved back into the matrix,and Al_(2)O_(3) film remaining at the interface eventually evolved into MgO.In addition,the local IGBs underwent staged elimination during HRB,which facilitated the interface healing due to the fusion of grains at the interface.This process was achieved by the dissociation,emission,and annihilation of dislocations on the IGBs.

Effect of neutral polymeric bonding agent on tensile mechanical properties and damage evolution of NEPE propellant

Introducing Neutral Polymeric bonding agents(NPBA) into the Nitrate Ester Plasticized Polyether(NEPE)propellant could improve the adhesion between filler/matrix interface, thereby contributing to the development of new generations of the NEPE propellant with better mechanical properties. Therefore,understanding the effects of NPBA on the deformation and damage evolution of the NEPE propellant is fundamental to material design and applications. This paper studies the uniaxial tensile and stress relaxation responses of the NEPE propellant with different amounts of NPBA. The damage evolution in terms of interface debonding is further investigated using a cohesive-zone model(CZM). Experimental results show that the initial modulus and strength of the NEPE propellant increase with the increasing amount of NPBA while the elongation decreases. Meanwhile, the relaxation rate slows down and a higher long-term equilibrium modulus is reached. Experimental and numerical analyses indicate that interface debonding and crack propagation along filler-matrix interface are the dominant damage mechanism for the samples with a low amount of NPBA, while damage localization and crack advancement through the matrix are predominant for the ones with a high amount of NPBA. Finally, crosslinking density tests and simulation results also show that the effect of the bonding agent is interfacial rather than due to the overall crosslinking density change of the binder.

Structure Regulation of Electric Double Layer via Hydrogen Bonding Effect to Realize High-Stability Lithium-Metal Batteries

The interfacial chemistry of solid electrolyte interphases(SEI)on lithium(Li)electrode is directly determined by the structural chemistry of the electric double layer(EDL)at the interface.Herein,a strategy for regulating the structural chemistry of EDL via the introduction of intermolecular hydrogen bonds has been proposed(p-hydroxybenzoic acid(pHA)is selected as proof-of-concept).According to the molecular dynamics(MD)simulation and density functional theory(DFT)calculation results,the existence of hydrogen bonds realizes the anion structural rearrangement in the EDL,reduces the lowest unoccupied molecular orbital(LUMO)energy level of anions in the EDL,and the number of free solvent molecules,which promotes the formation of inorganic species-enriched SEI and eventually achieves the dendrite-free Li deposition.Based on this strategy,Li‖Cu cells can stably run over 185 cycles with an accumulated active Li loss of only 2.27 mAh cm^(-2),and the long-term cycle stability of Li‖Li cells is increased to 1200 h.In addition,the full cell pairing with the commercial LiFePO_(4)(LFP)cathodes exhibits stable cycling performance at 1C,with a capacity retention close to 90%after 200 cycles.

Carbon Fiber Breakage Mechanism in Aluminum(Al)/Carbon Fibers(CFs) Composite Sheet during Accumulative Roll Bonding(ARB) Process

We put forward a method of fabricating Aluminum(Al)/carbon fibers(CFs) composite sheets by the accumulative roll bonding(ARB) method. The finished Al/CFs composite sheet has CFs and pure Al sheets as sandwich and surface layers. After cross-section observation of the Al/CFs composite sheet, we found that the CFs discretely distributed within the sandwich layer. Besides, the tensile test showed that the contribution of the sandwich CFs layer to tensile strength was less than 11% compared with annealed pure Al sheet. With ex-situ observation of the CFs breakage evolution with-16%,-32%, and-45% rolling reduction during the ARB process, the plastic instability of the Al layer was found to bring shear damages to the CFs. At last, the bridging strengthening mechanism introduced by CFs was sacrificed. We provide new insight into and instruction on Al/CFs composite sheet preparation method and processing parameters.

Time-dependent effects in transient liquid phase bonding of 304L and Cp-Ti using an Ag-Cu interlayer

One of the challenges for bimetal manufacturing is the joining process.Hence,transient liquid phase(TLP)bonding was performed between 304L stainless steel and Cp-Ti using an Ag-Cu interlayer with a thickness of 75μm for bonding time of 20,40,60,and 90 min.The bonding temperature of 860℃ was considered,which is under the β transus temperature of Cp-Ti.During TLP bonding,various intermetallic compounds(IMCs),including Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe),Ti_(2)(Cu,Ag),and Ti_(2)Cu from 304L toward Cp-Ti formed in the joint.Also,on the one side,with the increase in time,further diffusion of elements decreases the blocky IMCs such as Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe)in the 304L diffusion-affected zone(DAZ)and reaction zone,and on the other side,Ti_(2)(Cu,Ag)IMC transformed into fine morphology toward Cp-Ti DAZ.The microhardness test also demonstrated that the(Cr,Fe)_(2)Ti+Ti_(5)Cr_(7)Fe_(17) IMCs in the DAZ on the side of 304L have a hardness value of HV 564,making it the hardest phase.The maximum and minimum shear strength values are equal to 78.84 and 29.0 MPa,respectively.The cleavage pattern dominated fracture surfaces due to the formation of brittle phases in dissimilar joints.

Bonding enhancement of cold rolling TA1 P-Ti/AA6061 composite plates via surface oxidation treatment

TA1 P-Ti/AA6061 composite plate was produced by oxidizing the surface of the titanium plate and adopting a cold roll bonding process.The results revealed that the oxide film(Ti6O)prepared on the surface of TA1 pure titanium was easy to crack during the cold roll bonding,thereby promoting the formation of an effective mechanical interlock at the interface,which can effectively reduce the minimum reduction rate of the composite plates produced by cold rolling of titanium and aluminium plates.Moreover,the composite plate subjected to oxidation treatment exhibited high shear strength,particularly at a 43%reduction rate,achieving a commendable value of 117 MPa.Based on oxidation treatment and different reduction rates,the annealed composite plates at temperatures of 400,450,and 500°C displayed favorable resistance to interface delamination,highlighting their remarkable strength-plasticity compatibility as evidenced by a maximum elongation of 31.845%.

FOG Bonding 电阻降低方案及机理探究

近年来,中小尺寸产品客户端上线TP问题频发,其中有一类TP不良由FOG Bonding电阻异常偏大导致,但二次因未知。FOG堆叠结构为PNL+ACF(异方性导电胶)+FPC,但PNL、FPC为走线电阻,本身电阻较小(<1Ω),故不考虑此影响。基于此,重点研究FOG Bonding接触电阻。首先建立机理模型并进行探究,然后通过调整FOG Bonding参数,使ACF导电粒子的爆破状态和胶体的固化状态达到最优,最终降低电阻。

Toray develops hybrid bonding insulating resin and revolutionary polymer membrane

This year,Toray Industries,Inc.,announced that it has developed an insulating resin material for hybrid bonding(micro bonding).The material is based on Semicofine™and Photoneece™.These are high-heat-resistant polyimide coatings for semiconductor and display devices.The new material combines a conventional polyimide coating agent with the company’s processing and bonding technologies.It can enhance the yields and reliability of semiconductor devices in the hybrid bonding process,which entails bonding semiconductor chips with metal electrodes.Toray will push ahead with prototyping and providing samples to customers.It aims to obtain materials certification in 2025 and start mass production by 2028.

Analysis of Bonding Properties of Corroded Reinforcement Concrete

In order to investigate the degradation of bonding properties between corroded steel bars and concrete,this study employs the half-beam method to conduct bond-slip tests between corroded steel bars and concrete after impressed-current accelerated corrosion of the steel bars in concrete.The effects of steel corrosion rate,steel bar diameter,steel bar strength grade,and concrete strength grade on the bonding properties between concrete and corroded steel bars were analyzed.The influence of different corrosion rates on specimens’bonding strength and bond-slip curves was determined,and a constitutive relationship for bond-slip between corroded steel bars and concrete was proposed.The results indicate that the ultimate bonding strength of corroded reinforced concrete specimens decreases with increasing corrosion rate.Additionally,an increase in corrosive crack width leads to a linear decrease in bonding strength.Evaluating the decline in adhesive properties through rust expansion crack width in engineering applications is feasible.Furthermore,a bond-slip constitutive relationship between corroded steel bars and concrete was established using relative bond stress and relative slip values,which aligned well with the experimental findings.

Interfacial reactions and diffusion path in partial transient liquid-phase bonding of Si_3N_4/Ti/Ni/Ti/Si_3N_4

The interfacial reactions in partial transient liquid-phase bonding of Si3N4 ceramics with Ti/Ni/Ti interlayers were studied by means of scanning electron microscopy （SEM）, energy dispersive spectrometry （EDS） and X-ray diffractometry （XRD）. It was shown that the interfacial structure of Si3N4/TiN/Ti5Si3+Ti5Si4 + Ni3Si/ （NiTi ） /Ni3Ti/ Ni was formed after bonding. The activation energies for TiN layer and the mixed reaction layer of Ti5Si3 + Ti5Si4 + Ni3Si are 546. 8 kJ/mol and 543. 9 kJ/mol, respectively. The formation and transition processes of interface layer sequence in the joint were clarified by diffusion path. An important characteristic, which is different from the conventional brazing and soid-state diffusion bonding, has been found, i. e., during the partial transient liquid-phase bonding, not only the reaction layers which have formed grow, but also the diffusion path in the subsequent reaction changes because of the remarkable variation of the concentration on the metal side.

Microstructural developments and precipitate transformation during transient liquid-phase bonding of a duplex stainless steel

Effect of holding time on microstructural developments and transformation of precipitates formed at the interface during transient liquid-phase bonding of a duplex stainless steel using a Ni-based amorphous insert alloy was studied. The experimental results reveal that the microstructure of the adjacent base metal varies clearly as a function of holding time. The migration of Cr and Ni elements and the → transformation seem to play relevant roles in this microstructure evolution. The scanning electron microscopy (SEM) and electron prob X-ray microanalysis (EPMA) results indicate the transformation of BN→BN and (N, Mo) boride→BN at the interface with the holding time of 60-1 800 s. N content changes with holding time increasing at locations at the interface might be a controlling factor contributing to this transformation.

Bonding mechanisms of SiO_(2) glass and 1060 Al by ultrasonic assisted active metal soldering process

In this work,the ultrasonic assisted active metal soldering of SiO_(2) glass and Al was successfully achieved using Sn-2Ti solder filler at a low soldering temperature of 250℃in ambient atmosphere.A nano-crystallineα-Al2O3 layer with the average thickness of 13.9 nm and a nano-crystalline R-TiO_(2) layer with the average thickness of 16.2 nm are formed at the interface of Al/Sn and SiO_(2)/Sn respectively because Al elements did not diffuse from Al alloy side to SiO_(2) side,which verified that a sono-oxidation reaction had occurred during the ultrasonic assisted active metal soldering process.The soldered butt joints exhibited an average tensile strength of 25.31 MPa.

Interlaminar Bonding Performance of UHPC/SMA Based on Diagonal Shear Test

To evaluate various interlaminar bonding reinforcement techniques used for steel bridge decks,the UHPC surface was roughened with shot blasting(SB),transverse grooving(TG)and surface embedded stone(S),epoxy resin(E),epoxy asphalt(EA)and high viscosity high elasticity asphalt(HV)as interlayer bonding materials.In addition,a diagonal shear test was conducted using a self-designed diagonal shear jig.The effects of adhesive layer materials type,surface texture type,and different loading rates on the interlaminar bonding performance of UHPC/SMA combination specimens were investigated.The experimental study showed that the peak shear strength and shear modulus of the combined specimen decreased gradually with the decrease of thermosetting of the adhesive layer materials.The peak shear fracture energy of E was greater than that of HV and EA.The synergistic effect of the contact force generated by the roughing of the UHPC surface,the friction force,and the bonding force provided by the adhesive layer material can significantly improve the interlaminar shear performance of the assemblies.The power-law function of shear strength and shear modulus was proposed.The power-law model of peak shear strength and loading rate was verified.The shear strength and predicted shear strength satisfy the positive proportional functions with scale factors of 0.985,1.015,0.961,and 1.028,respectively.

High-performance liquid-phase catalytic purification of phosphine in tail gas using Pd(Ⅱ)/Cu(Ⅱ)composite

Pd/Cu liquid-phase composite was utilized as the catalyst in this study to remove PH_(3) at low temperatures.The anti-heterotoxicity of catalysts in the PH_(3) catalytic oxidation purification process was carefully explored and pioneered.The catalytic performance,thermodynamics,kinetics,and catalytic oxidation mechanism of Pd/Cu liquid-phase catalyst catalytic oxidation of PH_(3) were thoroughly investigated.The results showed that Pd/Cu has a superior catalytic effect on the removal of PH_(3) in the gas mixture under low temperature.With CO as the carrier gas,the removal efficiency of PH_(3) could be maintained at 100%for nearly 450 min,indicating that the Pd/Cu liquid phase catalyst has good resistance to heterotoxicity.According to the thermodynamic,kinetic,and related characterization results of the PH_(3) purification process,the kinetic region of the gas–liquid reaction of PH_(3) absorption by Pd/Cu solution was an interfacial reaction.Pd was the primary catalyst and Cu was the secondary catalyst,and the adsorption of PH_(3)was a primary reaction.PH_(3) was spontaneously oxidized to H_(3)PO_(4) in the Pd/Cu catalytic system during the removal process.Pd was regenerated by O_(2) and Cu,increasing the activity and stability of the Pd/Cu catalyst in the sustain and efficient purification of PH_(3) in tail gas.

基于JK落重和Bond球磨功指数试验的铁矿石碎磨特性及流程模拟计算

弓长岭选厂目前采用传统的“三段一闭路破碎”、“阶段磨矿”的碎磨工艺流程,存在生产工艺流程长且磨矿能耗偏高等问题。因此拟在粗碎后增加(半)自磨作业,降低进入球磨物料的粒度,以期降低磨矿作业能耗,优化碎磨作业工艺流程,提高选厂的作业生产能力,降低磨矿作业生产成本。试验原料铁矿石品位为28.27%,其中铁主要以磁铁矿的形式存在,脉石主要为SiO2,含量为48.61%。以鞍钢弓长岭选厂作业流程中粗碎产品进行JK落重试验,细碎产品进行Bond球磨功指数试验,对矿石的碎磨特性参数进行深入研究。研究结果表明,矿石的冲击破碎模型t10=70.099×(1-exp-0.647×Ecs),其中A为冲击粉碎参数,其值为70.099,b为0.647,A×b为45.354,矿石的抗冲击破碎能力属于中等级别,且随着颗粒粒度的减小而增大;矿石磨蚀系数ta为0.361,抗磨蚀能力为中等级别;矿石的相对密度为3.26。Bond球磨功指数试验获得的功指数Wib=11.7665kWh/t,属于中硬矿石,可以采用(半)自磨工艺。半自磨机设计给矿粒度为F80=160mm,最终产品粒度P80=86μm,JKsimMet软件模拟结果表明,需要2台Φ8.8m×5.1m半自磨机(装机功率7000kW)可满足生产要求。该试验结果对后续选厂工艺流程的优化具有重要意义。

When insulating polymers meet conjugated polymers:the noncovalent bonding does matter

Insulating polymers are characterized by a predominantlyσ-covalent structure,which localize electrons in the atoms and exhibit dielectricity.Insulating polymers typically adopt a more linear and extended conformation,as the repeating units are connected by single covalent bonds,resulting in a relatively straight and extended chain structure.For most insulating polymers,the contour length(L_(c))is significantly larger than their persistence length(Lp)due to the rotation of C−C single bonds(Fig.1(a)).Consequently,this leads to a flexible,random-coil chain conformation.This structural feature contributes to the great mechanical durability and resistance to crack initiation during stretching or bending processes.In contrast,conjugated polymers possess aπ-conjugated molecular structure,allowing electron mobility along the main chain,called delocalization,which imparts semiconducting properties[1,2].The presence of rigid,alternating single and multiple bonds results in comparable Lc and Lp,thereby yielding a stiff or semi-flexible conformation(Fig.1(b))[3,4].As a consequence,most conjugated polymers are prone to fracture under low strain levels(<10%)[5−7].