Bonding interface characteristic and shear strength of diffusion bonded Ti-17 titanium alloy

The bonding interface characteristic and shear strength of diffusion bonded Ti-17 titanium alloy at different bonding time were investigated. The results show that the average size of voids decreases while the amount of voids decreases after increasing to the maximum value with the increasing bonding time. The irregular void with a scraggly edge tends to an ellipse void with smooth surface and then changes to a tiny void with round shape. The grains across bonding interface occur at bonding time of 60 min. The shear strength of bond increases with increasing bonding time, and the highest shear strength of bond is 887.4 MPa at 60 min. The contribution of plastic deformation on the void closure and the increase of shear strength is significant even though the action time of plastic deformation is short.

Transient liquid phase bonding of DD5 superalloy using a designed interlayer: microstructure and mechanical properties

Nickel based single crystal superalloy is currently widely used as the material for turbine blades in aerospace engines.However,metallurgical defects during the manufacturing process and damage during harsh environmental service are inevitable challenges for turbine blades.Therefore,bonding techniques play a very important role in the manufacturing and repair of turbine blades.The transient liquid phase(TLP)bonding of DD5 Ni-based single crystal superalloy was performed using the designed H1 interlayer.A new third-generation Ni-based superalloy T1 powder was mixed with H1 powder as another interlayer to improve the mechanical properties of the bonded joints.The res-ults show that,such a designed H1 interlayer is beneficial to the improvement of shear strength of DD5 alloy bonded joints by adjusting the bonding temperature and the prolongation of holding time.The maximum shear strength at room temperature of the joint with H1 interlayer reached 681 MPa when bonded at 1260℃for 3 h.The addition of T1 powder can effectively reduce holding time or relatively lower bond-ing temperature,while maintaining relatively high shear strength.When 1 wt.%T1 powder was mixed into H1 interlayer,the maximum room temperature shear strength of the joint bonded at 1260℃reached 641 MPa,which could be obtained for only 1 h.Considering the bonding temperature and the efficiency,the acceptable process parameter of H1+5 wt.%T1 interlayer was 1240℃/2 h,and the room tem-perature shear strength reached 613 MPa.

Bonding strength of Invar/Cu clad strips fabricated by twin-roll casting process

Based on traditional twin-roll casting process,Invar/Cu clad strips were successfully fabricated by using solid Invar alloy strip and molten Cu under conditions of high temperature,high pressure and plastic deformation.A series of tests including tensile test,bending test,T-type peeling test and scanning electron microscope(SEM)and energy dispersive spectrometer(EDS)measurements were carried out to analyze the mechanical properties of Invar/Cu clad strips and the micro-morphology of tensile fracture surfaces and bonding interfaces.The results indicate that no delamination phenomenon occurs during the compatible deformation of Invar/Cu in bending test and only one stress platform exists in the tensile stress-strain curve when the bonding strength is large.On the contrary,different mechanical properties of Invar and Cu lead to delamination phenomenon during the uniaxial tensile test,which determines that two stress platforms occur on the stress-strain curve of Invar/Cu clad strips when two elements experience necking.The average peeling strength can be increased from13.85to42.31N/mm after heat treatment at800℃for1h,and the observation of the Cu side at peeling interface shows that more Fe is adhered on the Cu side after the heat treatment.All above illustrate that heat treatment can improve the strength of the bonding interface of Invar/Cu clad strips.

Hybrid bonding of GaAs and Si wafers at low temperature by Ar plasma activation

High-quality bonding of 4-inch GaAs and Si is achieved using plasma-activated bonding technology.The influence of Ar plasma activation on surface morphology is discussed.When the annealing temperature is 300℃,the bonding strength reaches a maximum of 6.2 MPa.In addition,a thermal stress model for GaAs/Si wafers is established based on finite element analysis to obtain the distribution of equivalent stress and deformation variables at different temperatures.The shape varia-tion of the wafer is directly proportional to the annealing temperature.At an annealing temperature of 400℃,the maximum protrusion of 4 inches GaAs/Si wafers is 3.6 mm.The interface of GaAs/Si wafers is observed to be dense and defect-free using a transmission electron microscope.The characterization of interface elements by X-ray energy dispersion spectroscopy indi-cates that the elements at the interface undergo mutual diffusion,which is beneficial for improving the bonding strength of the interface.There is an amorphous transition layer with a thickness of about 5 nm at the bonding interface.The preparation of Si-based GaAs heterojunctions can enrich the types of materials required for the development of integrated circuits,improve the performance of materials and devices,and promote the development of microelectronics technology.

Influence of basicity and temperature on bonding phase strength,microstructure,and mineralogy of high-chromium vanadium–titanium magnetite

To develop a smelting process for the comprehensive utilization of high-chromium vanadium-titanium magnetite(HCVTM),the micro-sinter test was applied to investigate the influence of basicity and temperature on the HCVTM sinters.The bonding phase strength(BS) was tested via an electronic universal testing machine.The phase transformations of the HCVTM sinters were detected via X-ray diffraction(XRD),whereas the structure and mineralogy of the HCVTM sinters under different temperatures and basicities were detected via scanning electron microscopy in combination with energy-dispersive spectroscopy(SEM–EDS).Our results demonstrate that the BS of the HCVTM sinters exhibits a slightly increasing tendency with an increase in temperature when the basicity is 2.4 and within the range of 2.8–4.0.Many cracks,small size crystals,and dependent phase structures are generated by increasing the sinter basicity.The BS is lower than 4000 N when the basicity is 2.2 and 2.8.When the temperature is in the range of 1280–1300?C,the BS exceeds 4000 N with the basicity of 2.0,2.4,and 3.4–4.0.The pore size of the HCVTM sinters increases with the increase of the temperature.The perovskite decreases,whereas the silicate phase increases with basicity higher than 3.2.This study provides theoretical and technical foundations for the effective production of HCVTM sinters.

Strength prediction of multi-layered copper-based composites fabricated by accumulative roll bonding

This work aims to evaluate the feasibility of the fabrication of nanostructured Cu/Al/Ag multi-layered composites by accumulative roll bonding(ARB),and to analyze the tensile properties and electrical conductivity of the produced composites.A theoretical model using strengthening mechanisms and some structural parameters extracted from X-ray diffraction is also developed to predict the tensile strength of the composites.It was found that by progression of ARB,the experimental and calculated tensile strengths are enhanced,reach a maximum of about 450 and 510 MPa at the fifth cycle of ARB,respectively and then are reduced.The electrical conductivity decreased slightly by increasing the number of ARB cycles at initial ARB cycles,but the decrease was intensified at the final ARB cycles.In conclusion,the merit of ARB to fabricate this type of multi-layered nanocomposites and the accuracy of the developed model to predict tensile strength were realized.

Bonding strength in carbon steel sandwich panels under condition of diffusion-rolling with small reduction

One of the key problems by diffusion-rolling bonding with small reduction for carbon steel plates is the bonding assistant coat. Abonding assitant coat used below 850℃ was developed. It contained copper as basic element and zinc as main alloy element. Other small elements and rear metals were added to decrease the melting point and to obtain a better clouding and bigh plasticity. Based on the theory of brazing and transient liquid diffusion welding, two carbon steel plates were rolled with small reduction by using self-made bonding assistant coat. Temperature, pressure and holding time are the main technology parameters for controlling the process of diffusion-rolling. The results show that the bonding strength is the greatest when the bonding temperature is 830℃, holding time is 3 min and the reduction rate is 9%.

Bonding strength of graded anti-corrosive coatings of fluoroethylenepropylene (FEP)/polyphenylene sulfide (PPS)

Fluororesin-based anti-corrosive coatings including graded FEP/PPS were prepared on carbon steel by melt powder coating, the bonding strength of all coating systems was determined by the pull-off test. It is found that the poor adhesion of fluororesin coatings to metallic substrates is improved obviously by the graded coating structure of FEP/PPS, and the bonding strength reaches up to 11.8 MPa for the five-layer system. Examination by electron probe microanalysis （EPMA） verifies that the distribution of main components is graded in the five-layer system, which is responsible for the enhancement of the interfacial bonding.

High mechanical strength Si anode synthesis with interlayer bonded expanded graphite structure for lithium-ion batteries

Despite advancements in silicon-based anodes for high-capacity lithium-ion batteries,their widespread commercial adoption is still hindered by significant volume expansion during cycling,especially at high active mass loadings crucial for practical use.The root of these challenges lies in the mechanical instability of the material,which subsequently leads to the structural failure of the electrode.Here,we present a novel synthesis of a composite combining expanded graphite and silicon nanoparticles.This composite features a unique interlayer-bonded graphite structure,achieved through the application of a modified spark plasma sintering method.Notably,this innovative structure not only facilitates efficient ion and electron transport but also provides exceptional mechanical strength(Vickers hardness:up to658 MPa,Young's modulus:11.6 GPa).This strength effectively accommodates silicon expansion,resulting in an impressive areal capacity of 2.9 mA h cm^(-2)(736 mA h g^(-1)) and a steady cycle life(93% after 100cycles).Such outsta nding performance is paired with features appropriate for large-scale industrial production of silicon batteries,such as active mass loading of at least 3.9 mg cm^(-2),a high-tap density electrode material of 1.68 g cm^(-3)(secondary clusters:1.12 g cm^(-3)),and a production yield of up to 1 kg per day.

Interfacial bonding strength of Al-Pb bearing alloy strips and hot dip aluminized steel sheets by hot rolling

Al Pb alloy strips and hot dip aluminized steel sheets were successfully bonded together by hot rolling, and the interfacial bonding strengths after rolling was evaluated by a new method. The bonding modes were studied by optical and scanning electron microscope and energy dispersive X ray analysis, and the effects of the thickness of the intermetallic layers and the Si content in hot dip aluminized layers on the interfacial bonding strength were also investigated respectively. It is found that the hot dipped steel and Al Pb alloy are bonded through blank interface bonding and block interface bonding, and the total bonding strength mainly depends on that of blank interfaces and the fraction of blank interfaces. There is a linear relationship between the total bonding strength F and the fraction of blank interfaces K b. The bonding strength varies with the Si content in the hot dipped aluminized layers on the surface of steel sheets, the fraction of blank interfaces and the rotation of the intermetallic blocks. [

Carbon Fiber Breakage Mechanism in Aluminum(Al)/Carbon Fibers(CFs) Composite Sheet during Accumulative Roll Bonding(ARB) Process

We put forward a method of fabricating Aluminum(Al)/carbon fibers(CFs) composite sheets by the accumulative roll bonding(ARB) method. The finished Al/CFs composite sheet has CFs and pure Al sheets as sandwich and surface layers. After cross-section observation of the Al/CFs composite sheet, we found that the CFs discretely distributed within the sandwich layer. Besides, the tensile test showed that the contribution of the sandwich CFs layer to tensile strength was less than 11% compared with annealed pure Al sheet. With ex-situ observation of the CFs breakage evolution with-16%,-32%, and-45% rolling reduction during the ARB process, the plastic instability of the Al layer was found to bring shear damages to the CFs. At last, the bridging strengthening mechanism introduced by CFs was sacrificed. We provide new insight into and instruction on Al/CFs composite sheet preparation method and processing parameters.

Microstructure and mechanical properties of SiC-particle-strengthening tri-metal Al/Cu/Ni composite produced by accumulative roll bonding process

In this study, a multilayer Al/Ni/Cu composite reinforced with Si C particles was produced using an accumulative roll bonding(ARB) process with different cycles. The microstructure and mechanical properties of this composite were investigated using optical and scanning microscopy and hardness and tensile testing. The results show that by increasing the applied strain, the Al/Ni/Cu multilayer composite converted from layer features to near a particle-strengthening characteristic. After the fifth ARB cycle, a composite with a uniform distribution of reinforcements(Cu, Ni, and SiC) was fabricated. The tensile strength of the composite increased from the initial sandwich structure to the first ARB cycle and then decreased from the first to the third ARB cycle. Upon reaching five ARB cycles, the tensile strength of the composite increased again. The variation in the elongation of the composite exhibited a tendency similar to that of its tensile strength. It is observed that with increasing strain, the microhardness values of the Al, Cu, and Ni layers increased, and that the dominant fracture mechanisms of Al and Cu were dimple formation and ductile fracture. In contrast, brittle fracture in specific plains was the main characteristic of Ni fractures.

Improvement of Bonding Strength of AZ31B Magnesium Alloy by Anodizing and Chromium-free Conversion Treatments

The influences of chromium-free chemical conversion treatment and anodizing treatment on bonding strength of AZ31 magnesium alloy were studied by lap-shear test, SEM and electrochemical methods. Both chemical conversion treatment and anodizing can increase the bonding strength. The anodizing treatment gives higher bonding strength and better corrosion resistance than chemical conversion treatment. The increase of bonding strength by the treatmetlts may be attributed to the uneven surface structures with micro-pores, resulting in increased bonding areas and the embedding effect.

Effect of ultrasonic power and bonding force on the bonding strength of copper ball bonds

Copper wire, serving as a cost-saving alternative to gold wire, has been used in many high-end thermosonic ball bonding applications. In this paper, the bond shear force, bond shear strength, and the ball bond diameter are adopted to evaluate the bonding quality. It is concluded that the ef/~cient ultrasonic power is needed to soften the ball to form the copper bonds with high bonding strength. However, excessive ultrasonic power would serve as a fatigue loading to weaken the bonding. Excessive or less bonding force would cause cratering in the silicon.

Effect of ultrasonic power on wedge bonding strength and interface microstructure

During the aluminum wire wedge bonding, the ultrasonic power and bonding strength were obtained. Based on those data, the relationship between ultrasonic power and bonding strength was studied. The results show that: 1) ultrasonic power is affected by ultrasonic power ratio and other uncontrolled factors such as asymmetric substrate quality, unstable restriction on the interface between wedge tool and aluminum wire; 2) when ultrasonic power is less than 1.0 W, increasing ultrasonic power leads to increasing bonding strength and decreasing failure bonding; on the contrary, when ultrasonic power is greater than 1.6 W, increasing power leads to decreasing bonding strength and increasing failure bonding; 3) only when ultrasonic power is between 1.0 W and 1.6 W, can stable and high yield bonding be reached. Finally, the microstructure of bonding interface was observed, and a ring-shaped bond pattern is founded in the center and friction scrape besides the ring area.

Influence of Rolling Treatment on Interfacial Shear Strength of Steel-mushy Al-7graphite Bonding Plate

At room temperature, the rolling treatment of steel-mushy Al-7graphite bonding plate was carried out under different relative reduction. The influence of rolling on interfacial mechanical property of this bonding plate was studied. The results show that, for steel-mushy Al-7graphite bonding plate which is made up of 1.2 mm in thickness 08AI steel plate and 2.0 mm in thickness Al-7graphite layer, there is a nonlinear relationship between interfacial shear strength of bonding plate and relative reduction of rolling. When relative reduction of rolling is smaller than 2.59%, with the increasing of relative reduction, interfacial shear strength of bonding plate increases gradually. When relative reduction of rolling is bigger than 2.59%, with the increasing of relative reduction, interfacial shear strength of bonding plate decreases continuously. When relative reduction of rolling is 2.59%, the largest interfacial shear strength 77.0 MPa can be obtained.

Semi-solid Pressing Bonding Strength between Steel and Cu-graphite Composite

The pressing bonding of steel plate with QTi3.5-3.5graphite slurry was studied. The relationship among preheating temperature of steel plate, preheating temperature of dies, solid fraction of QTi3.5-3.5graphite slurry, and interfacial shear strength of bonding plate could be established with artificial neural networks perfectly. This model could be optimized with a genetic algorithm. The results show that the optimum bonding parameters are: 618℃ for preheating temperature of steel plate, 526℃ for preheating temperature of dies and 46.2% for solid fraction of QTi3.5-3.5graphite slurry, and the largest interfacial shear strength of bonding plate is 128.3 MPa.

Achieving Narrowed Bandgaps and Blue-Light Excitability in Zero-Dimensional Hybrid Metal Halide Phosphors via Introducing Cation-Cation Bonding

Zero-dimensional(0D)hybrid metal halides,which consist of organic cations and isolated inorganic metal halide anions,have emerged as phosphors with efficient broadband emissions.However,these materials generally have too wide bandgaps and thus cannot be excited by blue light,which hinders their applications for efficient white light-emitting diodes(WLEDs).The key to achieving a blue-light-excitable 0D hybrid metal halide phosphor is to reduce the fundamental bandgap by rational chemical design.In this work,we report two designed hybrid copper(I)iodides,(Ph_(3)MeP)_(2)Cu_(4)I_(6)and(Cy_(3)MeP)_(2)Cu_(4)I_(6),as blue-light-excitable yellow phosphors with ultrabroadband emission.In these compounds,the[Cu_(4)I_(6)]^(2-)anion forms an I6 octahedron centered on a cationic Cu_(4)tetrahedron.The strong cation-cation bonding within the unique cationic Cu_(4)tetrahedra enables significantly lowered conduction band minimums and thus narrowed bandgaps,as compared to other reported hybrid copper(I)iodides.The ultrabroadband emission is attributed to the coexistence of free and self-trapped excitons.The WLED using the[Cu_(4)I_(6)]^(2-)anion-based single phosphor shows warm white light emission,with a high luminous efficiency of 65 Im W^(-1)and a high color rendering index of 88.This work provides strategies to design narrow-bandgap 0D hybrid metal halides and presents two first examples of blue-light-excitable 0D hybrid metal halide phosphors for efficient WLEDs.

Effect of Dietary Components on the Shear Bond Strength of Orthodontics Brackets after Thermal Aging

Introduction: The stability of orthodontic brackets throughout orthodontic treatment plays a critical role in the treatment’s effectiveness. The present in vitro study was designed to assess the impact of various dietary components on the performance of orthodontic brackets. Methods: Metal orthodontic brackets were bonded to 66 extracted anterior teeth divided into groups based on the solution type: Milk, Gatorade, Cold Coffee, and a control group using water. Each group consisted of 20 teeth except for the control group, which included six teeth. The bracketed teeth were submerged in their respective solutions for 15 minutes three times daily at different intervals to mimic an in vivo environment and were stored in artificial saliva at room temperature (23?C). The specimens underwent artificial aging through 10,000 cycles of thermocycling (representing one clinical year) between 5?C and 55?C. Shade measurements were taken using a VITA Easy Shade device, capturing the classic shade and L*, a*, and b* values. Delta E values were calculated immediately post-bonding and after 7 days, 1 month, 1, and 2 clinical years. The shear bond strength of each bracket was measured using an ultra-tester machine. Results: After two clinical years, significant differences in ΔE color values were observed across all groups, with the most substantial change noted in teeth immersed in cold coffee. Brackets submerged in milk demonstrated lower shear bond strength than other solutions, whereas the control group exhibited the highest shear bond strength (P = 0.01). Conclusion: The study indicates that dietary components significantly influence tooth color stability and the shear bond strength of orthodontic brackets, underscoring the importance of considering these factors in orthodontic treatment planning.

3D reconstruction and defect pattern recognition of bonding wire based on stereo vision

Non-destructive detection of wire bonding defects in integrated circuits(IC)is critical for ensuring product quality after packaging.Image-processing-based methods do not provide a detailed evaluation of the three-dimensional defects of the bonding wire.Therefore,a method of 3D reconstruction and pattern recognition of wire defects based on stereo vision,which can achieve non-destructive detection of bonding wire defects is proposed.The contour features of bonding wires and other electronic components in the depth image is analysed to complete the 3D reconstruction of the bonding wires.Especially to filter the noisy point cloud and obtain an accurate point cloud of the bonding wire surface,a point cloud segmentation method based on spatial surface feature detection(SFD)was proposed.SFD can extract more distinct features from the bonding wire surface during the point cloud segmentation process.Furthermore,in the defect detection process,a directional discretisation descriptor with multiple local normal vectors is designed for defect pattern recognition of bonding wires.The descriptor combines local and global features of wire and can describe the spatial variation trends and structural features of wires.The experimental results show that the method can complete the 3D reconstruction and defect pattern recognition of bonding wires,and the average accuracy of defect recognition is 96.47%,which meets the production requirements of bonding wire defect detection.