The Zr coating was deposited on titanium surface using the magnetron sputtering technique. Effects of Zr coating on microstructure and mechanical properties of porcelain fired to titanium have been investigated. The r...The Zr coating was deposited on titanium surface using the magnetron sputtering technique. Effects of Zr coating on microstructure and mechanical properties of porcelain fired to titanium have been investigated. The results show that interdiffusion of elements occurs during porcelain firing, and the Zr coating can effectively protect titanium surface from excess oxidation. The strength of bond zone with Zr coating deposited for 1 hour reaches 29. 7 MPa, which has increased by 26.4% as compared with that of bond zone without coating （23.5 MPa）.展开更多
Partial transient liquid-phase bonding （PTLP bonding） of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure an...Partial transient liquid-phase bonding （PTLP bonding） of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure and joint strength was discussed. The joint interface structures are investigated by scanning electron microscope （SEM） and energy dispersion spectroscopy（EDS）. The results show that the maximum joint strength of 210 MPa is obtained at room temperature in the experiments. When joining temperature and time are not changed and the process of isothermal solidification is sufficient , interface structure, reaction layer thickness and isothermal solidification thickness change with the thickness of Ti foil.展开更多
The bond strength of the Sn based ternary active solders,Sn-5Ti with various contents of Ag,Cu,In, Ni or AI on sialon ceramic was investigated by the ceramic/ceramic joint joining.The bond strength of Sn-STi (about 80...The bond strength of the Sn based ternary active solders,Sn-5Ti with various contents of Ag,Cu,In, Ni or AI on sialon ceramic was investigated by the ceramic/ceramic joint joining.The bond strength of Sn-STi (about 80 MPa) may increase to 90-100 MPa by small addition of Ag or Cu (about 5-10%).A little Ni (about 1-3%) in the solder is slightly beneficial,but too more Ni (more than 5%) is harmful.Small addition of In is trivial,but too more In is detrimental.On the other hand,small addi- tion of AI in the active solder decreases greatly the bond strength of the solder,therefore it is very harmful.In discussion,three suggestions for selection of the third element to increase the bond strength of the soft solders on ceramic,i.e.with a high surface energy,benefiting to wetting on ce- ramic and strengthening the soft solder itself,have been made.展开更多
文摘The Zr coating was deposited on titanium surface using the magnetron sputtering technique. Effects of Zr coating on microstructure and mechanical properties of porcelain fired to titanium have been investigated. The results show that interdiffusion of elements occurs during porcelain firing, and the Zr coating can effectively protect titanium surface from excess oxidation. The strength of bond zone with Zr coating deposited for 1 hour reaches 29. 7 MPa, which has increased by 26.4% as compared with that of bond zone without coating （23.5 MPa）.
文摘Partial transient liquid-phase bonding （PTLP bonding） of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure and joint strength was discussed. The joint interface structures are investigated by scanning electron microscope （SEM） and energy dispersion spectroscopy（EDS）. The results show that the maximum joint strength of 210 MPa is obtained at room temperature in the experiments. When joining temperature and time are not changed and the process of isothermal solidification is sufficient , interface structure, reaction layer thickness and isothermal solidification thickness change with the thickness of Ti foil.
文摘The bond strength of the Sn based ternary active solders,Sn-5Ti with various contents of Ag,Cu,In, Ni or AI on sialon ceramic was investigated by the ceramic/ceramic joint joining.The bond strength of Sn-STi (about 80 MPa) may increase to 90-100 MPa by small addition of Ag or Cu (about 5-10%).A little Ni (about 1-3%) in the solder is slightly beneficial,but too more Ni (more than 5%) is harmful.Small addition of In is trivial,but too more In is detrimental.On the other hand,small addi- tion of AI in the active solder decreases greatly the bond strength of the solder,therefore it is very harmful.In discussion,three suggestions for selection of the third element to increase the bond strength of the soft solders on ceramic,i.e.with a high surface energy,benefiting to wetting on ce- ramic and strengthening the soft solder itself,have been made.
