系统级封装(System in Package,SiP)电路包含多个功能的裸芯片,具有尺寸小、功耗低、性能高等优点,应用广泛,但结构、功能复杂,如何进行可靠性评价越来越得到关注。针对SiP电路的可靠性评价问题,设计了一套SiP电路测试系统。该测试系统...系统级封装(System in Package,SiP)电路包含多个功能的裸芯片,具有尺寸小、功耗低、性能高等优点,应用广泛,但结构、功能复杂,如何进行可靠性评价越来越得到关注。针对SiP电路的可靠性评价问题,设计了一套SiP电路测试系统。该测试系统包含相应的软件和硬件,主要实现对SiP电路的实装测试、ATE(Automatic Test Equipment)测试和老化测试,使用该测试系统能够筛选出故障电路,实现电路的可靠性评价。展开更多
A systematic, accurate and robust evaluating method for fine pitch printed circuit board (PCB) positioning assessment in testing fixture is developed. Targeting reliability of bed-of-nails tester is successfully eva...A systematic, accurate and robust evaluating method for fine pitch printed circuit board (PCB) positioning assessment in testing fixture is developed. Targeting reliability of bed-of-nails tester is successfully evaluated by the 2D pattern transform. Probe offset vector with its Weibull and Gaussian distribution estimates are obtained for further investigation about the causes of misalignment on the basis of a batch tests for same kind of PCBs.展开更多
文摘系统级封装(System in Package,SiP)电路包含多个功能的裸芯片,具有尺寸小、功耗低、性能高等优点,应用广泛,但结构、功能复杂,如何进行可靠性评价越来越得到关注。针对SiP电路的可靠性评价问题,设计了一套SiP电路测试系统。该测试系统包含相应的软件和硬件,主要实现对SiP电路的实装测试、ATE(Automatic Test Equipment)测试和老化测试,使用该测试系统能够筛选出故障电路,实现电路的可靠性评价。
基金This project is supported by US Pennsylvania Dept. of Community & Economic Development(No.20-906-0015)National Natural Science Foundation of China(No.50390064, No.50575230)National Basic Research Program of China(973 Program, No.2003CB716202).
文摘A systematic, accurate and robust evaluating method for fine pitch printed circuit board (PCB) positioning assessment in testing fixture is developed. Targeting reliability of bed-of-nails tester is successfully evaluated by the 2D pattern transform. Probe offset vector with its Weibull and Gaussian distribution estimates are obtained for further investigation about the causes of misalignment on the basis of a batch tests for same kind of PCBs.