The glass forming ability of Gd-Co-Al ternary alloy systems with a composition ranging from 50% to 70% (molar fraction) for Gd and from 5% to 40% (molar fraction) for Al were investigated by copper mold casting and Gd...The glass forming ability of Gd-Co-Al ternary alloy systems with a composition ranging from 50% to 70% (molar fraction) for Gd and from 5% to 40% (molar fraction) for Al were investigated by copper mold casting and Gd60Co25Al15 bulk glass alloy cylinders with the maximum diameter of 5 mm were obtained. The reduced glass transformation temperature (Tg/Tm) and the distance of supercooling region △Tx are 0.616 and 45 K, respectively for this Gd-Co-Al alloy. The compressive fracture strength (σf) and elastic modulus (E) of Gd-Co-Al glassy alloys are 1 170-1 380 MPa and 59-70 GPa, respectively. The Gd-Al-Co bulk glassy alloys with high glass forming ability and good mechanical properties are promising for the future development as a new type function materials.展开更多
Co68.15Fe4.35Si12.25B15.25 （at%） amorphous microwires with a smooth surface and a circular cross-section were fabricated by the glass-coated melt spinning method. Their mechanical properties were evaluated through t...Co68.15Fe4.35Si12.25B15.25 （at%） amorphous microwires with a smooth surface and a circular cross-section were fabricated by the glass-coated melt spinning method. Their mechanical properties were evaluated through tensile tests of the glass-coated amorphous mi-crowires, and their fracture reliability was estimated using two-and three-parameter Weibull analysis. X-ray diffraction and transmission electron microscopy results showed that these glass-coated Co-based microwires were mostly amorphous. The coated Co-based microwires exhibit a tensile strength of 1145 to 2457 MPa, with a mean value of 1727 MPa and a variance of 445 MPa. Weibull statistical analysis showed that the tensile two-parameter Weibull modulus of the amorphous microwires is 4.16 and the three-parameter Weibull modulus is 1.61 with a threshold value as high as 942 MPa. These results indicate that the fabricated microwires exhibit good tensile properties and fracture reliability, and thus appear to be good candidates for electronics reliability engineering applications.展开更多
文摘The glass forming ability of Gd-Co-Al ternary alloy systems with a composition ranging from 50% to 70% (molar fraction) for Gd and from 5% to 40% (molar fraction) for Al were investigated by copper mold casting and Gd60Co25Al15 bulk glass alloy cylinders with the maximum diameter of 5 mm were obtained. The reduced glass transformation temperature (Tg/Tm) and the distance of supercooling region △Tx are 0.616 and 45 K, respectively for this Gd-Co-Al alloy. The compressive fracture strength (σf) and elastic modulus (E) of Gd-Co-Al glassy alloys are 1 170-1 380 MPa and 59-70 GPa, respectively. The Gd-Al-Co bulk glassy alloys with high glass forming ability and good mechanical properties are promising for the future development as a new type function materials.
基金financially supported by the National Natural Science Foundation of China(No.51371067)supported by the Japan Society for the Promotion of Science(JSPS) fellowship and Grants-in-Aid for Scientific Research(No.25-03205)
文摘Co68.15Fe4.35Si12.25B15.25 （at%） amorphous microwires with a smooth surface and a circular cross-section were fabricated by the glass-coated melt spinning method. Their mechanical properties were evaluated through tensile tests of the glass-coated amorphous mi-crowires, and their fracture reliability was estimated using two-and three-parameter Weibull analysis. X-ray diffraction and transmission electron microscopy results showed that these glass-coated Co-based microwires were mostly amorphous. The coated Co-based microwires exhibit a tensile strength of 1145 to 2457 MPa, with a mean value of 1727 MPa and a variance of 445 MPa. Weibull statistical analysis showed that the tensile two-parameter Weibull modulus of the amorphous microwires is 4.16 and the three-parameter Weibull modulus is 1.61 with a threshold value as high as 942 MPa. These results indicate that the fabricated microwires exhibit good tensile properties and fracture reliability, and thus appear to be good candidates for electronics reliability engineering applications.
