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Study on Interfacial Bonding State of Ag-Cu in Cold Pressure Welding 被引量:1
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作者 李云涛 杜则裕 杨江 《Transactions of Tianjin University》 EI CAS 2003年第3期219-222,共4页
The interfacial bonding of Ag-Cu (they are limited soluble) formed by the technology of cold pressure welding was discussed from the point of metallurgic view in this paper. Meanwhile, tensile test and microscopic tes... The interfacial bonding of Ag-Cu (they are limited soluble) formed by the technology of cold pressure welding was discussed from the point of metallurgic view in this paper. Meanwhile, tensile test and microscopic test were adopted for studying the state of interfacial bonding, suggesting that the joint of Ag-Cu has not only strong welding joint but also atomic diffusion on the interface. For Ag-Cu, the interaction of dislocation caused by plastic deformation will cause the strain and the vibration of microconstructer defects, accompanied by emitting energy. The energy increases the atomic action and the amplitude of atomic vibration, and the result is that the atom can diffuse to several lattice parameters deep from interface to inner metals. Therefore, under the condition of chemical potential gradient, the special technique, cold pressure welding rather than basic requirements of diffusion should be taken into account. During the cold pressure welding, plastic deformation plays an important role for it causes the metals′ displacement, crystal defects, further activates the surface atoms. Finally, the fracture of atomic bonding leads to the atomic exchange and diffusion between the new metals′ surfaces.In other words the metals Ag,Cu can achieve solidate bonding by cold pressure welding accompanied by the atomic diffusion. Moreover, theoretical analysis and calculation on the basis of thermodynamics, crystallogy, so- lid physics,etc, have been applied to calculate the amount of atomic diffusion, which has further proved the testing results that joint Ag-Cu has strong bonding strength through the mechanism of atomic diffusion. 展开更多
关键词 cold pressure welding interface bonding bonding strength atomic diffusion
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The study on interfacial bonding strength of Ag-Ni, Ag-Cu in cold pressure welding
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作者 李云涛 杜则裕 陈丽萍 《China Welding》 EI CAS 2003年第1期20-23,共4页
The area of combination actually is a kind of interfacial phenomena that exist on the surface or thin film. The properties of interface have important effect on the whole welded joint, even decide directly the interfa... The area of combination actually is a kind of interfacial phenomena that exist on the surface or thin film. The properties of interface have important effect on the whole welded joint, even decide directly the interfacial bonding strength. The bonding strength of metals in cold pressure welding such as Ag Ni (they are hardly mutual soluble) and Ag Cu(they are limited soluble) are discussed in this paper. The results of the tensile test suggest that two kinds of welded joints have enough strength to satisfy with the demand for being used. Moreover, thermodynamics, crystal logy, physics and metal electronic microscopic analysis etc are adopted to further calculate the bonding strength. The results of test and theoretical analyses prove that Ag Ni, Ag Cu, especially, for Ag Ni can form strong welded joint which is higher than that of the relative soft base metals in cold pressure welding. 展开更多
关键词 cold pressure welding INTERFACE bonding strength
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