Censored Composite Conditional Quantile Screening for High-Dimensional Survival Data

In this paper,we introduce the censored composite conditional quantile coefficient(cC-CQC)to rank the relative importance of each predictor in high-dimensional censored regression.The cCCQC takes advantage of all useful information across quantiles and can detect nonlinear effects including interactions and heterogeneity,effectively.Furthermore,the proposed screening method based on cCCQC is robust to the existence of outliers and enjoys the sure screening property.Simulation results demonstrate that the proposed method performs competitively on survival datasets of high-dimensional predictors,particularly when the variables are highly correlated.

Distribution of Expenditures for Research and Development-Dynamic Analysis Based on Composite Concentration Coefficients

The dynamic analysis of distribution of expenditures for research and development aims to identify concentration tendencies in this domain.The analysis is performed by calculating composite concentration coefficients,as these coefficients allow simultaneous(synthesized)expression of existing concentrations in cases where multiple criteria for expressing concentration exist.In this work,the observation was made on a respectable sample of 52 countries in the period from 1997 to 2021.The following variables are included in the analysis:population,gross domestic product,gross domestic product per capita,gross domestic expenditure on research and development absolutely and per capita and human development index.Composite concentration coefficients were derived based on previously calculated concentration coefficients according to the criteria of population size and gross domestic product,gross domestic product per inhabitant and social development index.Calculation of composite concentration coefficients was performed by extrapolation based on standardized regression coefficients from the corresponding regression models.Based on the conducted analysis and obtained results,it can be concluded that a relatively high concentration of gross expenditures for research and development is evident,which has been significantly reduced in the observed time period.

Thermotics Study of the Semimetallic Nylon1010 Composite

Thermal expansion characteristics of semimetal nylon composites (nylon 1010 incorporated with metal oxides) were analyzed with thermal expansion instrument. The changes of composite weight after being heated and the heat absorption and release of the composites were analyzed by carrying out TG-DSC experiments. Experimental results show that the average thermal expansion coefficient of the composites rises as the average diameter of the metal oxides decrease from room temperature to 160 ℃. Thermal dynamics and physical properties of the nylon composites change with the addition of the oxides; the crystallization temperature rises from 180 ℃ of pure nylon to 190 ℃ (maximum) and the melting point of the oxide composites also increases continuously with the addition of the oxides. The water content of the oxide/nylon composite is related to the kind and content of the oxide. The water content reaches its maximum when the content of oxide is 10%, and the 10% Al2O3/nylon composite has a water absorption ratio up to 1%.

Thermal Expansion and Mechanical Properties of Middle Reinforcement Content SiCp/Al Composites Fabricated by PM Technology

Middle reinforcement content SiCp/Al composites（Vp=30%, 35% and 40%） for precision optical systems applications were fabricated by powder metallurgy technology. The composites were free of porosity and SiC particles distributed uniformly in the composites. The mean linear coefficients of thermal expansion（20-100 ℃） of SiCp/Al composites ranged from 11.6×10-6 to 13.3×10-6 K-1 and decreased with an increase in volume fraction of SiC content. The experimental coeffi cients of thermal expansion agreed well with predicted values based on Kerner＇s model. The Brinell hardness increased from 116 to 147, and the modulus increased from 99 to 112 GPa for the corresponding composites. The tensile strengths were higher than 320 MPa, but no signifi cant increasing trend between tensile strength and SiC content was observed.

Mechanical, electrical, and thermal expansion properties of carbon nanotube-based silver and silver–palladium alloy composites

The mechanical, electrical, and thermal expansion properties of carbon nanotube（CNT）-based silver and silver–palladium（10：1, w/w） alloy nanocomposites are reported. To tailor the properties of silver, CNTs were incorporated into a silver matrix by a modified molecular level-mixing process. CNTs interact weakly with silver because of their non-reactive nature and lack of mutual solubility. Therefore, palladium was utilized as an alloying element to improve interfacial adhesion. Comparative microstructural characterizations and property evaluations of the nanocomposites were performed. The structural characterizations revealed that decorated type-CNTs were dispersed, embedded, and anchored into the silver matrix. The experimental results indicated that the modification of the silver and silver–palladium nanocomposite with CNT resulted in increases in the hardness and Young＇s modulus along with concomitant decreases in the electrical conductivity and the coefficient of thermal expansion（CTE）. The hardness and Young＇s modulus of the nanocomposites were increased by 30%？40% whereas the CTE was decreased to 50%-60% of the CTE of silver. The significantly improved CTE and the mechanical properties of the CNT-reinforced silver and silver–palladium nanocomposites are correlated with the intriguing properties of CNTs and with good interfacial adhesion between the CNTs and silver as a result of the fabrication process and the contact action of palladium as an alloying element.

Microstructure and properties of electronic packaging shell with high silicon carbide aluminum-base composites by semi-solid thixoforming

The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of different parts of the shell were observed by scanning electron microscopy and optical microscopy, and the thermophysical and mechanical properties of the shell were tested. The results show that there exists the segregation phenomenon between the Si C particulate and the liquid phase during thixoforming, the liquid phase flows from the shell, and the Si C particles accumulate at the bottom of the shell. The volume fraction of Si C decreases gradually from the bottom to the walls. Accordingly, the thermal conductivities of bottom center and walls are 178 and 164 W·m-1·K-1, the coefficients of thermal expansion(CTE) are 8.2×10-6 and 12.6×10-6 K-1, respectively. The flexural strength decreases slightly from 437 to 347 MPa. The microstructures and properties of the shell show gradient distribution.

Determination of thermal expansion coefficients for unidirectional fiber-reinforced composites

In the present work, the coefficients of thermal expansion（CTEs） of unidirectional（UD）fiber-reinforced composites are studied. First, an attempt is made to propose a model to predict both longitudinal and transverse CTEs of UD composites by means of thermo-elastic mechanics analysis. The proposed model is supposed to be a concentric cylinder with a transversely isotropic fiber embedded in an isotropic matrix, and it is subjected to a uniform temperature change. Then a concise and explicit formula is offered for each CTE. Finally, some finite element（FE） models are created by a finite element program MSC. Patran according to different material systems and fiber volume fractions. In addition, the available experimental data and results of other analytical solutions of CTEs are presented. Comparisons are made among the results of the cylinder model,the finite element method（FEM）, experiments, and other solutions, which show that the predicted CTEs by the new model are in good agreement with the experimental data. In particular, transverse CTEs generally offer better agreements than those predicted by most of other solutions.

Thermal properties of diamond/Al composites by pressure infiltration:comparison between methods of coating Ti onto diamond surfaces and adding Si into Al matrix

This study was pertained to the effects of Ti coating on diamond surfaces and Si addition into Al matrix on the thermal conductivity（TC） and the coefficient of thermal expansion（CTE） of diamond/Al composites by pressure infiltration.The fracture surfaces,interface microstructures by metal electro-etching and interfacial thermal conductance of the composites prepared by two methods were compared.The results reveal that Ti coating on diamond surfaces and only12.2 wt% Si addition into Al matrix could both improve the interfacial bonding and increase the TCs of the composites.But the Ti coating layer introduces more interfacial thermal barrier at the diamond/Al interface compared to adding 12.2 wt% Si into Al matrix.The diamond/Al composite with 12.2 wt% Si addition exhibits maximum TC of 534 W·m^-1·K^-1and a very low CTE of 8.9×10^-6K^-1,while the coating Ti-diamond/Al composite has a TC of 514 W·m^-1·K^-1 and a CTE of 11.0×10^-6K^-1.

Enhancement of Magnetoelectric Properties in A Surface-Mount Magnetoelectric Device

The fabrication and properties of a novel double layered surface-mount magnetoelectric（ME） device are investigated and reported. This ME device is made up of two opposite polarized piezoelectric PZT slices bonded on the same side of a magnetostrictive material Metglas, forming a novel two PZT in-series device. ME voltage obtained from the two PZT in-series is obviously higher than that of single PZT in a magnetic field with certain value. The ME voltage coefficient（αV） of the surface-mount ME device is significantly enhanced by adjusting the thickness of Metglas： 1） At a frequency of 1 k Hz, αV of this device increases with the layer number of Metglas increased, and the maximum value of αV is about 4.25 times than the minimum; 2） At a frequency of 5 k Hz, the maximum value of αV is 458 mV /Oe, which derives from the ME device with three layers Metglas. This novel design provides an effective way to manufacture miniature and high sensitive ME devices, which makes it possible to apply ME device into integrated circuit（IC）.