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Lithography-independent and large scale fabrication of a metal electrode nanogap 被引量:1
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作者 李艳 王晓峰 +3 位作者 张加勇 王晓东 樊中朝 杨富华 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2009年第9期142-145,共4页
A lithography-independent and wafer scale method to fabricate a metal nanogap structure is demonstrated. Polysilicon was first dry etched using photoresist (PR) as the etch mask patterned by photolithography. Then, ... A lithography-independent and wafer scale method to fabricate a metal nanogap structure is demonstrated. Polysilicon was first dry etched using photoresist (PR) as the etch mask patterned by photolithography. Then, by depositing conformal SiO2 on the polysilicon pattern, etching back SiO2 anisotropically in the perpendicular direction and removing the polysilicon with KOH, a sacrificial SiO2 spacer was obtained. Finally, after metal evaporation and lifting-off of the SiO2 spacer, an 82 nm metal-gap structure was achieved. The size of the nanogap is not determined by the photolithography, but by the thickness of the SiO2. The method reported in this paper is compatible with modern semiconductor technology and can be used in mass production. 展开更多
关键词 lithography-independent NANOGAP conformal deposition anisotropic etching
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