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Constant Angle Surfaces in the Heisenberg Group 被引量:2
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作者 Johan FASTENAKELS Marian Ioan MUNTEANU Joeri VAN DER VEKEN 《Acta Mathematica Sinica,English Series》 SCIE CSCD 2011年第4期747-756,共10页
In this article we extend the notion of constant angle surfaces in S2 × R and H2 ×R to general Bianchi-Cartan-Vranceanu spaces. We show that these surfaces have constant Gaussian curvature and we give a comp... In this article we extend the notion of constant angle surfaces in S2 × R and H2 ×R to general Bianchi-Cartan-Vranceanu spaces. We show that these surfaces have constant Gaussian curvature and we give a complete local classification in the Heisenberg group. 展开更多
关键词 Heisenberg group Bianchi-Cartan Vranceanu space constant angle surface
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Experimental study of evaporation of sessile water droplet on PDMS surfaces 被引量:9
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作者 Ying-Song Yu Zi-Qian Wang Ya-Pu Zhao 《Acta Mechanica Sinica》 SCIE EI CAS CSCD 2013年第6期799-805,共7页
Evaporation of sessile water droplet on polydimethylsiloxane (PDMS) surfaces with three different curing ratios (5:1, 10:1, and 20:1) was experimentally investigated in this paper. We show that the constant con... Evaporation of sessile water droplet on polydimethylsiloxane (PDMS) surfaces with three different curing ratios (5:1, 10:1, and 20:1) was experimentally investigated in this paper. We show that the constant contact radius (CCR) evaporation on surface with high curing ratio lasts longer than that with low curing ratio. We also measured Young's moduli of PDMS films by using atomic force microscopy (AFM) and simulated surface deformation of PDMS films induced by sessile water droplet. With increasing curing ratio of PDMS film, Young's modulus of PDMS film is getting lower, and then there will be larger surface deformation and more elastic stored energy. Since such energy acts as a barrier to keep the three-phase contact line pinned, thus it will result in longer CCR evaporation on PDMS surface with higher curing ratio. 展开更多
关键词 Droplet evaporation PDMS constant contact radius mode constant contact angle mode Force- displacement curve Surface deformation Liquid-vapor interfacial tension
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