A self-designed setup of modified sloping cooling/shearing process was made to prepare the semisolid Al-3wt%Mg alloy. A three-dimensional simulation model was established for the analysis of preparing the semisolid Al...A self-designed setup of modified sloping cooling/shearing process was made to prepare the semisolid Al-3wt%Mg alloy. A three-dimensional simulation model was established for the analysis of preparing the semisolid Al-3wt%Mg alloy. Through simulation and experiment, it is shown that the sloping angle of the plate greatly affects temperature and velocity distributions, and the temperature and velocity of the alloy at the exit of the sloping plate increase with the increase of the sloping angle. The alloy temperature decreases linearly from the pouring mouth to the exit. The alloy temperature at the exit increases obviously with the increase of pouring temperature. To prepare the semisolid Al-3wt%Mg alloy with good quality, the sloping angle θ=45° is reasonable, and the pouring temperature is suggested to be designed above 650-660℃ but under 700℃.展开更多
基金This work was financially supported by the National Natural Science Foundation of China (No.50604007)the Natural ScienceFoundation of Liaoning Province, China (No.20062016)
文摘A self-designed setup of modified sloping cooling/shearing process was made to prepare the semisolid Al-3wt%Mg alloy. A three-dimensional simulation model was established for the analysis of preparing the semisolid Al-3wt%Mg alloy. Through simulation and experiment, it is shown that the sloping angle of the plate greatly affects temperature and velocity distributions, and the temperature and velocity of the alloy at the exit of the sloping plate increase with the increase of the sloping angle. The alloy temperature decreases linearly from the pouring mouth to the exit. The alloy temperature at the exit increases obviously with the increase of pouring temperature. To prepare the semisolid Al-3wt%Mg alloy with good quality, the sloping angle θ=45° is reasonable, and the pouring temperature is suggested to be designed above 650-660℃ but under 700℃.
