Nickel-coated graphite flakes/copper(GN/Cu) composites were fabricated by spark plasma sintering with the surface of graphite flakes(GFs) being modified by Ni–P electroless plating. The effects of the phase trans...Nickel-coated graphite flakes/copper(GN/Cu) composites were fabricated by spark plasma sintering with the surface of graphite flakes(GFs) being modified by Ni–P electroless plating. The effects of the phase transition of the amorphous Ni–P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity(TC) of the GN/Cu composites were systematically investigated. The introduction of Ni–P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650℃ and slightly increased the TC of the X–Y basal plane of the GF/Cu composites with 20 vol%–30 vol% graphite flakes. However, when the graphite flake content was greater than 30 vol%, the TC of the GF/Cu composites decreased with the introduction of Ni–P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.展开更多
Nanotubes, such as boron nitride nanotubes (BNNTs) and carbon nanotubes (CNTs), exhibit excellent mechanical properties. In this work, high-quality BNNTs were synthesized by ball milling and annealing. Subsequently, w...Nanotubes, such as boron nitride nanotubes (BNNTs) and carbon nanotubes (CNTs), exhibit excellent mechanical properties. In this work, high-quality BNNTs were synthesized by ball milling and annealing. Subsequently, well-dispersed 3vol%BNNTs/Cu and 3vol%CNTs/Cu composites were successfully prepared using ball milling, spark plasma sintering, and followed by hot-rolling. Moreover, the mechanical properties and strengthening mechanisms of BNNTs/Cu and CNTs/Cu composites were compared and discussed in details. At 293 K,both BNNTs/Cu and CNTs/Cu composites exhibited similar ultimate tensile strength (UTS) of~404 MPa, which is approximately 170%higher than pure Cu. However, at 873 K, the UTS and yield strength of BNNTs/Cu are 27%and 29%higher than those of CNTs/Cu, respectively.This difference can be attributed to the stronger inter-walls shear resistance, higher thermomechanical stability of BNNTs, and stronger bonding at the BNNTs/Cu interface as compared to the CNTs/Cu interface. These findings provide valuable insights into the potential of BNNTs as an excellent reinforcement for metal matrix composites, particularly at high temperature.展开更多
Copper matrix composites doped with ceramic particles are known to effectively enhance the mechanical properties,thermal expansion behavior and high-temperature stability of copper while maintaining high thermal and e...Copper matrix composites doped with ceramic particles are known to effectively enhance the mechanical properties,thermal expansion behavior and high-temperature stability of copper while maintaining high thermal and electrical conductivity.This greatly expands the applications of copper as a functional material in thermal and conductive components,including electronic packaging materials and heat sinks,brushes,integrated circuit lead frames.So far,endeavors have been focusing on how to choose suitable ceramic components and fully exert strengthening effect of ceramic particles in the copper matrix.This article reviews and analyzes the effects of preparation techniques and the characteristics of ceramic particles,including ceramic particle content,size,morphology and interfacial bonding,on the diathermancy,electrical conductivity and mechanical behavior of copper matrix composites.The corresponding models and influencing mechanisms are also elaborated in depth.This review contributes to a deep understanding of the strengthening mechanisms and microstructural regulation of ceramic particle reinforced copper matrix composites.By more precise design and manipulation of composite microstructure,the comprehensive properties could be further improved to meet the growing demands of copper matrix composites in a wide range of application fields.展开更多
In this study,we synthesized high-performance Carbon Fiber/Gold/Copper(CF/Au/Cu)composite wires by using a 2-step deposition method via sputtering and electrodeposition.After Au was sputtered on PANbased CFs as a pre-...In this study,we synthesized high-performance Carbon Fiber/Gold/Copper(CF/Au/Cu)composite wires by using a 2-step deposition method via sputtering and electrodeposition.After Au was sputtered on PANbased CFs as a pre-treatment,the wettability and surface reactivity of the CFs were improved,resulting in a homogeneous deposition of Cu on their surface.At different Cu electrodeposition time,the resulting CF/Au/Cu composite wires could possess a high strength of up to 3.27 GPa(~10 times stronger than copper wires)while their electrical conductivity could be as high as 4.4×10^5 S/cm(~75%of that for copper).More importantly,since the composite wires were lightweight(up to 70%lower than Cu mass density),they are a promising candidate to substitute conventional heavy metal wires in the future electrical applications.展开更多
Electrochemical oxidation of polyethylene glycol(PEG) in an acidic(pH 0.18 to 0.42) and high ionic strength electroplating solution was investigated. The electroplating solution is a major source of wastewater in the ...Electrochemical oxidation of polyethylene glycol(PEG) in an acidic(pH 0.18 to 0.42) and high ionic strength electroplating solution was investigated. The electroplating solution is a major source of wastewater in the printing wiring board industry. A paraffin composite copper hexacyanoferrate modified(PCCHM) electrode was used as the anode and a bare graphite electrode was used as the cathode. The changes in PEG and total organic carbon(TOC) concentrations during the course of the reaction were monitored. The efficiency of the PCCHM anode was compared with bare graphite anode and it was found that the former showed significant electrocatalytic property for PEG and TOC removal. Chlorides present in the solution were found to contribute significantly in the overall organic removal process. Short chain organic compounds like acetic acid, oxalic acid, formic acid and ethylene glycol formed during electrolysis were identified by HPLC method. Anode surface area and applied current density were found to influence the electro-oxidation process, in which the former was found to be dominating. Investigations of the kinetics for the present electrochemical reaction suggested that the two stage first-order kinetic model provides a much better representation of the overall mechanism of the process if compared to the generalized kinetic model.展开更多
The objective of this work is to study the synthesis of copper-alumina nanocomposites using the coprecipitation process and hot-pressing method, and investigate their mechanical properties. The effects of calcination ...The objective of this work is to study the synthesis of copper-alumina nanocomposites using the coprecipitation process and hot-pressing method, and investigate their mechanical properties. The effects of calcination temperature on the average size of composite particles and chemical composition after calcination were also analyzed. The sintering parameters including sintering temperature, hot pressure and packing time were optimized to fabricate the alumina nanoparticles reinforced copper matrix composites(CMCs). The density, microhardness and tribological properties of the CMCs reinforced with 1 wt%, 2 wt%, 3 wt%, 4 wt% and 5 wt% of alumina nanoparticles were investigated correspondingly. The results showed that the optimum preparation parameters for the CMCs were 900 ℃ of hot pressing temperature, 27.5 MPa of hot pressure and 2 hrs of packing time. The CMC reinforced with 2 wt% of alumina nanoparticles had the lowest wear rate, with the relative wear resistance of 3.13.展开更多
A dual-scale hybrid HfB_(2)/Cu-Hf composite with HfB_(2) microparticles and Cu_(5) Hf nanoprecipitates was designed and prepared.The contribution of the hybrid effect to the mechanical properties and high-temperature ...A dual-scale hybrid HfB_(2)/Cu-Hf composite with HfB_(2) microparticles and Cu_(5) Hf nanoprecipitates was designed and prepared.The contribution of the hybrid effect to the mechanical properties and high-temperature performances was studied from macro and micro perspectives,respectively.The hybrid of dual-scale particles can make the strain distribution of the composite at the early deformation stage more uniform and delay the strain concentration caused by the HfB_(2) particle.The dislocation pinning of HfB_(2) particles and the coherent strengthening of Cu_(5) Hf nanoprecipitates simultaneously play a strengthening role,but the strength of the hybrid composite is not a simple superposition of two strengthening mod-els.In addition,both Cu_(5) Hf nanoprecipitates and HfB_(2) microparticles contribute to the high-temperature performance of the composite,the growth and phase transition of nanoprecipitates at high temperature will reduce their contribution to strength,while the stable HfB_(2) particles can inhibit the coarsening of matrix grains and maintain the high-density geometrically necessary dislocations(GNDs)in the matrix,which ensures more excellent high-temperature resistance of the hybrid composite.As a result,the hy-brid structure can simultaneously possess the advantages of multiple reinforcements and make up for the shortcomings of each other.Finally,a copper matrix composite with high strength,high conductivity,and excellent high-temperature performance is displayed.展开更多
A copper matrix composite reinforced by β-LiAlSiO4 with negative thermal expansion coefficient was fabricated using vacuum hot-pressed sintering technique. The thermal expansion behavior of the composite was investig...A copper matrix composite reinforced by β-LiAlSiO4 with negative thermal expansion coefficient was fabricated using vacuum hot-pressed sintering technique. The thermal expansion behavior of the composite was investigated, and the average residual stress in the matrix was analyzed by a simple model. The results indicate that the residual stress in the matrix affects the thermal expansion properties. After heat treatment, the coefficient of thermal expansion (CTE) of the composite decreases greatly. The CTE of the composite after thermal cycling between 50-350°C is the lowest.展开更多
The main objective of this paper was to fabricate CuSnNi alloy and its composites reinforced with various contents of SiNparticles(5wt%, 10wt%, and 15wt%) and to investigate their dry sliding wear behavior using a pin...The main objective of this paper was to fabricate CuSnNi alloy and its composites reinforced with various contents of SiNparticles(5wt%, 10wt%, and 15wt%) and to investigate their dry sliding wear behavior using a pin-on-disk tribometer. Microstructural examinations of the specimens revealed a uniform dispersion of SiNparticles in the copper matrix. Wear experiments were performed for all combinations of parameters, such as load(10, 20, and 30 N), sliding distance(500, 1000, and 1500 m), and sliding velocity(1, 2, and 3 m/s), for the alloy and the composites. The results revealed that wear rate increased with increasing load and increasing sliding distance, whereas the wear rate decreased and then increased with increasing sliding velocity. The primary wear mechanism encountered at low loads was mild adhesive wear, whereas that at high loads was severe delamination wear. An oxide layer was formed at low velocities, whereas a combination of shear and plastic deformation occurred at high velocities. The mechanism at short sliding distances was ploughing action of SiNparticles, which act as protrusions; by contrast, at long sliding distances, direct metal–metal contact occurred. Among the investigated samples, the Cu/10wt% SiNcomposite exhibited the best wear resistance at a load of 10 N, a velocity of 2 m/s, and a sliding distance of 500 m.展开更多
Cr-coated diamond/Cu composites were prepared by spark plasma sintering. The effects of sintering pressure, sintering temperature, sintering duration, and Cu powder particle size on the relative density and thermal co...Cr-coated diamond/Cu composites were prepared by spark plasma sintering. The effects of sintering pressure, sintering temperature, sintering duration, and Cu powder particle size on the relative density and thermal conductivity of the composites were investigated in this paper. The influence of these parameters on the properties and microstructures of the composites was also discussed. The results show that the relative density of Cr-coated diamond/Cu reaches ~100% when the composite is gradually compressed to 30 MPa during the heating process. The densification temperature increases from 880 to 915℃ when the diamond content is increased from 45vol% to 60vol%. The densification temperature does not increase further when the content reaches 65vol%. Cu powder particles in larger size are beneficial for increasing the relative density of the composite.展开更多
Two types of alumina dispersion-strengthened copper(ADSC) alloys were fabricated by a novel in-situ reactive synthesis(IRS) and a traditional internal oxidation(IO) process. The features of alumina dispersoids i...Two types of alumina dispersion-strengthened copper(ADSC) alloys were fabricated by a novel in-situ reactive synthesis(IRS) and a traditional internal oxidation(IO) process. The features of alumina dispersoids in these ADSC alloys were investigated by X-ray diffraction, scanning electron microscopy, and high-resolution transmission electron microscopy. It is found that nano-sized γ-Al2O3 particles of approximately 10 nm in diameter are homogeneously distributed in the IRS-ADSC composites. Meanwhile, larger-sized, mixed crystal structure alumina with rod-shaped morphology is embedded in the IO-ADSC alloy. The IRS-ADSC composites can obtain better mechanical and physical properties than the IO-ADSC composites; the tensile strength of the IRS-ADSC alloy can reach 570 MPa at room temperature, its electrical conductivity is 85% IACS, and the Rockwell hardness can reach 86 HRB.展开更多
A novel chemical technique combined with unique plasma activated sintering(PAS) was utilized to prepare consolidated copper matrix composites(CMCs) by adding Cu-SnO2-rGO layered micro powders as reinforced fillers...A novel chemical technique combined with unique plasma activated sintering(PAS) was utilized to prepare consolidated copper matrix composites(CMCs) by adding Cu-SnO2-rGO layered micro powders as reinforced fillers into Cu matrix. The repeating Cu-SnO2-rGO structure was composed of inner dispersed reduced graphene oxide(r GO), SnO2 as intermedia and outer Cu coating. SnO2 was introduced to the surface of rGO sheets in order to prevent the graphene aggregation with SnO2 serving as spacer and to provide enough active sites for subsequent Cu deposition. This process can guarantee rGO sheets to suffi ciently disperse and Cu nanoparticles to tightly and uniformly anchor on each layer of rGO by means of the SnO2 active sites as well as strictly control the reduction speed of Cu^2+. The complete cover of Cu nanoparticles on rGO sheets thoroughly avoids direct contact among rGO layers. Hence, the repeating structure can simultaneously solve the wettability problem between rGO and Cu matrix as well as improve the bonding strength between rGO and Cu matrix at the well-bonded Cu-SnO2-rGO interface. The isolated rGO can effectively hinder the glide of dislocation at Cu-rGO interface and support the applied loads. Finally, the compressive strength of CMCs was enhanced when the strengthening effi ciency reached up to 41.展开更多
In view of the inherent poor tribological properties of copper,the reinforcement of copper matrix composites with WC particles presents a promising research area with significant industrial influence.Therefore,in the ...In view of the inherent poor tribological properties of copper,the reinforcement of copper matrix composites with WC particles presents a promising research area with significant industrial influence.Therefore,in the present study,a molecular dynamics approach is used to simulate the process of repeated friction of diamond grinding balls on WC/Cu composites,and the friction force,friction coefficient,abrasion depth,wear rate,abrasion morphology,von-Mises stress,internal defects,workpiece energy,and performance comparison of different layer thicknesses are systematically investigated in the multiple friction process.It is found that the fluctuation amplitude of friction force,friction coefficient,and abrasion depth are smaller and the fluctuation frequency is larger during the initial friction,whereas near the WC phase,there appears extreme values of the above parameters and the von-Mises stress is highly concentrated while the workpiece energy contonues to increase.In the case of the repeated friction,with the increase of friction times,the friction force,friction coefficient,and abrasion depth fluctuation amplitude increase,the fluctuation frequency decreases,the workpiece energy reaches an extreme value near the WC phase,and a large number of dislocations plug,therefore,the region is strengthened.As the distance between the grinding ball and the WC phase decreases,the more obvious the strengthening effect,the stronger the ability of workpiece to resist the wear will be.展开更多
Copper alloy composite bit matrix was prepared by pressureless vacuum infiltration,using at least one of the three kinds of tungsten carbide particles,for example,irregular cast tungsten carbide,monocrystalline tungst...Copper alloy composite bit matrix was prepared by pressureless vacuum infiltration,using at least one of the three kinds of tungsten carbide particles,for example,irregular cast tungsten carbide,monocrystalline tungsten carbide and sintered reduced tungsten carbide particles.The effects of powder particle morphology,particle size and mass fraction of tungsten carbide on the microstructure and mechanical properties of copper alloy composite were investigated by means of scanning electron microscopy,X-ray diffraction and abrasive wear test in detail.The results show that tungsten carbide morphology and particle size have obvious effects on the mechanical properties of copper alloy composites.Cast tungsten carbide partially dissolved in the copper alloy binding phase,and layers of Cu_(0.3)W_(0.5)Ni_(0.1)Mn_(0.1)C phase with a thickness of around 8–15μm were formed on the edge of the cast tungsten carbide.When 45%irregular crushed fine cast tungsten carbide and 15%monocrystalline cast tungsten carbide were used as the skeleton,satisfactory comprehensive performance of the reinforced copper alloy composite bit matrix was obtained,with the bending strength,impact toughness and hardness reaching 1048 MPa,4.95 J/cm^(2) and 43.6 HRC,respectively.The main wear mechanism was that the tungsten carbide particles firstly protruded from the friction surface after the copper alloy matrix was worn,and then peeled off from the matrix when further wear occurred.展开更多
Graphene reinforced copper matrix composites (Gr/Cu) were fabricated by electrostatic self-assembly and powder metallurgy. The morphology and structure of graphene oxide, graphene oxide-Cu powders and Gr/Cu composit...Graphene reinforced copper matrix composites (Gr/Cu) were fabricated by electrostatic self-assembly and powder metallurgy. The morphology and structure of graphene oxide, graphene oxide-Cu powders and Gr/Cu composites were characterized by scanning electronic microscopy, transmission electronic microscopy, X-ray diffraction and Raman spectroscopy, respectively. The effects of graphene contents, applied loads and sliding speeds on the tribological behavior of the composites were investigated. The results indicate that the coefficient of friction of the composites decreases first and then increases with increasing the graphene content. The lowest friction coefficient is achieved in 0.3 wt~ Gr/Cu composite, which decreases by 65% compared to that of pure copper. The coefficient of friction of the composite does not have significant change with increasing the applied load, however, it increases with increasing the sliding speed. The tribological mechanisms of the composite under different conditions were also investigated.展开更多
In this study, neutral salt spray accelerated corrosion test of copper–aluminium composite under 0–125 A DC current was carried out under 5% concentration. The effect of corrosion behaviour on copper–aluminium comp...In this study, neutral salt spray accelerated corrosion test of copper–aluminium composite under 0–125 A DC current was carried out under 5% concentration. The effect of corrosion behaviour on copper–aluminium composite by DC current was carried out by a scanning electron microscope(SEM) with energy-dispersive spectroscopy(EDS), X-ray diffraction(XRD) patterns, X-ray photoelectron spectroscopy(XPS), weight-loss method and electrochemical analysis. The results show that the current can accelerate the corrosion rate. Meanwhile, the current temperature effect can reduce the corrosion rate. The current caused directional migration of ions resulting in different corrosion products on positive and negative poles of specimen, and the corrosion degree on the positive pole was more serious. The galvanic corrosion mechanism at the copper–aluminium interface is different from the pitting corrosion mechanism far away from the interface, and the latter is more affected by DC current.展开更多
The package and system level temperature and thermal stress distributions of 10 W light emitting diode (LED) with 4 chips and 100 W LED with 100 chips were investigated using finite element analysis. The chips were ...The package and system level temperature and thermal stress distributions of 10 W light emitting diode (LED) with 4 chips and 100 W LED with 100 chips were investigated using finite element analysis. The chips were arranged on a Si sheet which is soldered on the copper/diamond composite slug with very high conductivity. The experimental results show that the maximal temperature appears in the chips of both two high power LEDs packages. Compared with the 10 W LEDs package with 4 chips array, the heat issue caused by stacking and coupling of the heat in 100 W LEDs package with 100 chips array is more serious. The chip temperature in the center of the array is much higher, and it decreases with the distance between the chip and the center of LEDs increases. Great thermal stress lies between the chips and the solder, which will reduce the reliability of the package.展开更多
A Cu-1.5 wt.%Ti/Diamond(55 vol.%)composite was fabricated by hot forging from powder mixture of copper,titanium and diamond powders at 1050?C.A nano-thick TiC interfacial layer was formed between the diamond particle ...A Cu-1.5 wt.%Ti/Diamond(55 vol.%)composite was fabricated by hot forging from powder mixture of copper,titanium and diamond powders at 1050?C.A nano-thick TiC interfacial layer was formed between the diamond particle and copper matrix during forging,and it has an orientation relationship of(111)TiC//(002)Cu&[110]TiC//[110]Cuwith the copper matrix.HRTEM analysis suggests that TiC is semicoherently bond with copper matrix,which helps reduce phonon scattering at the TiC/Cu interface and facilitates the heat transfer,further leading to the hot-forged copper/diamond composite(referred as to Cu-Ti/Dia-0)has a thermal conductivity of 410 W/m K,and this is about 74%of theoretical thermal conductivity of hot-forged copper/composite(552 W/m K).However,the formation of thin amorphous carbon layer in diamond particle(next to the interfacial TiC layer)and deformed structure in the copper matrix have adverse effect on the thermal conductivity of Cu-Ti/Dia-0 composite.800℃-annealing eliminates the discrepancy in TiC interface morphology between the diamond-{100}and-{111}facets of Cu-Ti/Dia-0 composite,but causes TiC particles coarsening and agglomerating for the Cu-Ti/Dia-2 composite and interfacial layer cracking and spallation for the Cu-Ti/Dia-1 composite.In addition,a large amount of graphite was formed by titanium-induced diamond graphitization in the Cu-Ti/Dia-2 composite.All these factors deteriorate the heat transfer behavior for the annealed Cu-Ti/Dia composites.Appropriate heat treatment needs to be continually investigated to improve the thermal conductivity of hot-forged CuTi/Dia composite by eliminating deformed structure in the copper matrix with limit/without impacts on the formed TiC interfacial layer.展开更多
Both the coarsening of Al2O3 nanoparticles and the growth of Cu nanograins of mechanically milled nanostructured Cu-5 vol.%Al2O3 composites with, and without, trace amounts of Ti during annealing at973 K for 1 h were ...Both the coarsening of Al2O3 nanoparticles and the growth of Cu nanograins of mechanically milled nanostructured Cu-5 vol.%Al2O3 composites with, and without, trace amounts of Ti during annealing at973 K for 1 h were investigated. It was found that doping with a small amount of Ti(e.g. 0.2 wt%) in a nanostructured Cu-5 vol.%Al2O3 composite effectively suppressed the coarsening of Al2O3 nanoparticles during exposure at this temperature. Further, the Ti addition also prevented the concomitant abnormal growth of the copper grains normally caused by the coarsening of the Al2O3 nanoparticles. Energy dispersive X-ray spectroscopy analysis of the Al2O3 nanoparticles in the annealed Cu-5 vol.%Al2 O3-0.2 wt%Ti sample suggested that the Ti atoms either diffused into the Al2O3 nanoparticles or segregated to the Cu/Al2O3 interfaces to form Ti-doped Al2O3 nanoparticles, which was more stable than Ti-free Al2O3 nanoparticles during annealing at high homologous temperatures.展开更多
基金financially supported by the National Natural Science Foundation of China (No. 51374028)Fundamental Research Funds for the Central Universities (FRF-GF-17-B37)
文摘Nickel-coated graphite flakes/copper(GN/Cu) composites were fabricated by spark plasma sintering with the surface of graphite flakes(GFs) being modified by Ni–P electroless plating. The effects of the phase transition of the amorphous Ni–P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity(TC) of the GN/Cu composites were systematically investigated. The introduction of Ni–P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650℃ and slightly increased the TC of the X–Y basal plane of the GF/Cu composites with 20 vol%–30 vol% graphite flakes. However, when the graphite flake content was greater than 30 vol%, the TC of the GF/Cu composites decreased with the introduction of Ni–P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.
基金financially supported by the National Natural Science Foundation of China (No.52171144)。
文摘Nanotubes, such as boron nitride nanotubes (BNNTs) and carbon nanotubes (CNTs), exhibit excellent mechanical properties. In this work, high-quality BNNTs were synthesized by ball milling and annealing. Subsequently, well-dispersed 3vol%BNNTs/Cu and 3vol%CNTs/Cu composites were successfully prepared using ball milling, spark plasma sintering, and followed by hot-rolling. Moreover, the mechanical properties and strengthening mechanisms of BNNTs/Cu and CNTs/Cu composites were compared and discussed in details. At 293 K,both BNNTs/Cu and CNTs/Cu composites exhibited similar ultimate tensile strength (UTS) of~404 MPa, which is approximately 170%higher than pure Cu. However, at 873 K, the UTS and yield strength of BNNTs/Cu are 27%and 29%higher than those of CNTs/Cu, respectively.This difference can be attributed to the stronger inter-walls shear resistance, higher thermomechanical stability of BNNTs, and stronger bonding at the BNNTs/Cu interface as compared to the CNTs/Cu interface. These findings provide valuable insights into the potential of BNNTs as an excellent reinforcement for metal matrix composites, particularly at high temperature.
基金supported by National Natural Science Foundation of China(No.51971101)Science and Technology Development Program of Jilin Province,China(20230201146G X)Exploration Foundation of State Key Laboratory of Automotive Simulation and Control(asclzytsxm-202015)。
文摘Copper matrix composites doped with ceramic particles are known to effectively enhance the mechanical properties,thermal expansion behavior and high-temperature stability of copper while maintaining high thermal and electrical conductivity.This greatly expands the applications of copper as a functional material in thermal and conductive components,including electronic packaging materials and heat sinks,brushes,integrated circuit lead frames.So far,endeavors have been focusing on how to choose suitable ceramic components and fully exert strengthening effect of ceramic particles in the copper matrix.This article reviews and analyzes the effects of preparation techniques and the characteristics of ceramic particles,including ceramic particle content,size,morphology and interfacial bonding,on the diathermancy,electrical conductivity and mechanical behavior of copper matrix composites.The corresponding models and influencing mechanisms are also elaborated in depth.This review contributes to a deep understanding of the strengthening mechanisms and microstructural regulation of ceramic particle reinforced copper matrix composites.By more precise design and manipulation of composite microstructure,the comprehensive properties could be further improved to meet the growing demands of copper matrix composites in a wide range of application fields.
基金Lloyd’s Register Foundation(R-265-000-553-597)for the financial support for this project.
文摘In this study,we synthesized high-performance Carbon Fiber/Gold/Copper(CF/Au/Cu)composite wires by using a 2-step deposition method via sputtering and electrodeposition.After Au was sputtered on PANbased CFs as a pre-treatment,the wettability and surface reactivity of the CFs were improved,resulting in a homogeneous deposition of Cu on their surface.At different Cu electrodeposition time,the resulting CF/Au/Cu composite wires could possess a high strength of up to 3.27 GPa(~10 times stronger than copper wires)while their electrical conductivity could be as high as 4.4×10^5 S/cm(~75%of that for copper).More importantly,since the composite wires were lightweight(up to 70%lower than Cu mass density),they are a promising candidate to substitute conventional heavy metal wires in the future electrical applications.
文摘Electrochemical oxidation of polyethylene glycol(PEG) in an acidic(pH 0.18 to 0.42) and high ionic strength electroplating solution was investigated. The electroplating solution is a major source of wastewater in the printing wiring board industry. A paraffin composite copper hexacyanoferrate modified(PCCHM) electrode was used as the anode and a bare graphite electrode was used as the cathode. The changes in PEG and total organic carbon(TOC) concentrations during the course of the reaction were monitored. The efficiency of the PCCHM anode was compared with bare graphite anode and it was found that the former showed significant electrocatalytic property for PEG and TOC removal. Chlorides present in the solution were found to contribute significantly in the overall organic removal process. Short chain organic compounds like acetic acid, oxalic acid, formic acid and ethylene glycol formed during electrolysis were identified by HPLC method. Anode surface area and applied current density were found to influence the electro-oxidation process, in which the former was found to be dominating. Investigations of the kinetics for the present electrochemical reaction suggested that the two stage first-order kinetic model provides a much better representation of the overall mechanism of the process if compared to the generalized kinetic model.
基金Funded by Jiangsu Innovation Program for Graduate EducationFundamental Research Funds for the Central Universities(No.KYLX_0258)+1 种基金Opening Project of Jiangsu Key Laboratory of Advanced Structural Materials and Application Technology(No.ASMA201401)Priority Academic Program Development of Jiangsu Higher Education Institutions
文摘The objective of this work is to study the synthesis of copper-alumina nanocomposites using the coprecipitation process and hot-pressing method, and investigate their mechanical properties. The effects of calcination temperature on the average size of composite particles and chemical composition after calcination were also analyzed. The sintering parameters including sintering temperature, hot pressure and packing time were optimized to fabricate the alumina nanoparticles reinforced copper matrix composites(CMCs). The density, microhardness and tribological properties of the CMCs reinforced with 1 wt%, 2 wt%, 3 wt%, 4 wt% and 5 wt% of alumina nanoparticles were investigated correspondingly. The results showed that the optimum preparation parameters for the CMCs were 900 ℃ of hot pressing temperature, 27.5 MPa of hot pressure and 2 hrs of packing time. The CMC reinforced with 2 wt% of alumina nanoparticles had the lowest wear rate, with the relative wear resistance of 3.13.
基金supported by the National Natural Science Foundation of China(Nos.52127802,52271137,and 51834009).
文摘A dual-scale hybrid HfB_(2)/Cu-Hf composite with HfB_(2) microparticles and Cu_(5) Hf nanoprecipitates was designed and prepared.The contribution of the hybrid effect to the mechanical properties and high-temperature performances was studied from macro and micro perspectives,respectively.The hybrid of dual-scale particles can make the strain distribution of the composite at the early deformation stage more uniform and delay the strain concentration caused by the HfB_(2) particle.The dislocation pinning of HfB_(2) particles and the coherent strengthening of Cu_(5) Hf nanoprecipitates simultaneously play a strengthening role,but the strength of the hybrid composite is not a simple superposition of two strengthening mod-els.In addition,both Cu_(5) Hf nanoprecipitates and HfB_(2) microparticles contribute to the high-temperature performance of the composite,the growth and phase transition of nanoprecipitates at high temperature will reduce their contribution to strength,while the stable HfB_(2) particles can inhibit the coarsening of matrix grains and maintain the high-density geometrically necessary dislocations(GNDs)in the matrix,which ensures more excellent high-temperature resistance of the hybrid composite.As a result,the hy-brid structure can simultaneously possess the advantages of multiple reinforcements and make up for the shortcomings of each other.Finally,a copper matrix composite with high strength,high conductivity,and excellent high-temperature performance is displayed.
基金supported by the National Natural Science Foundation of China (No. 50671029).
文摘A copper matrix composite reinforced by β-LiAlSiO4 with negative thermal expansion coefficient was fabricated using vacuum hot-pressed sintering technique. The thermal expansion behavior of the composite was investigated, and the average residual stress in the matrix was analyzed by a simple model. The results indicate that the residual stress in the matrix affects the thermal expansion properties. After heat treatment, the coefficient of thermal expansion (CTE) of the composite decreases greatly. The CTE of the composite after thermal cycling between 50-350°C is the lowest.
文摘The main objective of this paper was to fabricate CuSnNi alloy and its composites reinforced with various contents of SiNparticles(5wt%, 10wt%, and 15wt%) and to investigate their dry sliding wear behavior using a pin-on-disk tribometer. Microstructural examinations of the specimens revealed a uniform dispersion of SiNparticles in the copper matrix. Wear experiments were performed for all combinations of parameters, such as load(10, 20, and 30 N), sliding distance(500, 1000, and 1500 m), and sliding velocity(1, 2, and 3 m/s), for the alloy and the composites. The results revealed that wear rate increased with increasing load and increasing sliding distance, whereas the wear rate decreased and then increased with increasing sliding velocity. The primary wear mechanism encountered at low loads was mild adhesive wear, whereas that at high loads was severe delamination wear. An oxide layer was formed at low velocities, whereas a combination of shear and plastic deformation occurred at high velocities. The mechanism at short sliding distances was ploughing action of SiNparticles, which act as protrusions; by contrast, at long sliding distances, direct metal–metal contact occurred. Among the investigated samples, the Cu/10wt% SiNcomposite exhibited the best wear resistance at a load of 10 N, a velocity of 2 m/s, and a sliding distance of 500 m.
基金financially supported by the National Natural Science Foundation of China (No. 51374028)
文摘Cr-coated diamond/Cu composites were prepared by spark plasma sintering. The effects of sintering pressure, sintering temperature, sintering duration, and Cu powder particle size on the relative density and thermal conductivity of the composites were investigated in this paper. The influence of these parameters on the properties and microstructures of the composites was also discussed. The results show that the relative density of Cr-coated diamond/Cu reaches ~100% when the composite is gradually compressed to 30 MPa during the heating process. The densification temperature increases from 880 to 915℃ when the diamond content is increased from 45vol% to 60vol%. The densification temperature does not increase further when the content reaches 65vol%. Cu powder particles in larger size are beneficial for increasing the relative density of the composite.
基金financially supported by the National Natural Science Foundation of China(NO.51464013)the Dr.Initialization Fund of Jiangxi University of Science and Technology(No.jxxjbs14013)
文摘Two types of alumina dispersion-strengthened copper(ADSC) alloys were fabricated by a novel in-situ reactive synthesis(IRS) and a traditional internal oxidation(IO) process. The features of alumina dispersoids in these ADSC alloys were investigated by X-ray diffraction, scanning electron microscopy, and high-resolution transmission electron microscopy. It is found that nano-sized γ-Al2O3 particles of approximately 10 nm in diameter are homogeneously distributed in the IRS-ADSC composites. Meanwhile, larger-sized, mixed crystal structure alumina with rod-shaped morphology is embedded in the IO-ADSC alloy. The IRS-ADSC composites can obtain better mechanical and physical properties than the IO-ADSC composites; the tensile strength of the IRS-ADSC alloy can reach 570 MPa at room temperature, its electrical conductivity is 85% IACS, and the Rockwell hardness can reach 86 HRB.
基金Funded by the National Natural Science Foundation of China(51572208)the 111 Project(B13035)+1 种基金the National Natural Science Foundation of Hubei Province(2014CFB257 and 2014CFB258)the Fundamental Research Funds for the Central Universities(WUT:2015-III-059)
文摘A novel chemical technique combined with unique plasma activated sintering(PAS) was utilized to prepare consolidated copper matrix composites(CMCs) by adding Cu-SnO2-rGO layered micro powders as reinforced fillers into Cu matrix. The repeating Cu-SnO2-rGO structure was composed of inner dispersed reduced graphene oxide(r GO), SnO2 as intermedia and outer Cu coating. SnO2 was introduced to the surface of rGO sheets in order to prevent the graphene aggregation with SnO2 serving as spacer and to provide enough active sites for subsequent Cu deposition. This process can guarantee rGO sheets to suffi ciently disperse and Cu nanoparticles to tightly and uniformly anchor on each layer of rGO by means of the SnO2 active sites as well as strictly control the reduction speed of Cu^2+. The complete cover of Cu nanoparticles on rGO sheets thoroughly avoids direct contact among rGO layers. Hence, the repeating structure can simultaneously solve the wettability problem between rGO and Cu matrix as well as improve the bonding strength between rGO and Cu matrix at the well-bonded Cu-SnO2-rGO interface. The isolated rGO can effectively hinder the glide of dislocation at Cu-rGO interface and support the applied loads. Finally, the compressive strength of CMCs was enhanced when the strengthening effi ciency reached up to 41.
基金Project supported by the National Natural Science Foundation of China(Grant No.52005236)the Natural Science Foundation of Gansu Province,China(Grant No.20JR5RA442)。
文摘In view of the inherent poor tribological properties of copper,the reinforcement of copper matrix composites with WC particles presents a promising research area with significant industrial influence.Therefore,in the present study,a molecular dynamics approach is used to simulate the process of repeated friction of diamond grinding balls on WC/Cu composites,and the friction force,friction coefficient,abrasion depth,wear rate,abrasion morphology,von-Mises stress,internal defects,workpiece energy,and performance comparison of different layer thicknesses are systematically investigated in the multiple friction process.It is found that the fluctuation amplitude of friction force,friction coefficient,and abrasion depth are smaller and the fluctuation frequency is larger during the initial friction,whereas near the WC phase,there appears extreme values of the above parameters and the von-Mises stress is highly concentrated while the workpiece energy contonues to increase.In the case of the repeated friction,with the increase of friction times,the friction force,friction coefficient,and abrasion depth fluctuation amplitude increase,the fluctuation frequency decreases,the workpiece energy reaches an extreme value near the WC phase,and a large number of dislocations plug,therefore,the region is strengthened.As the distance between the grinding ball and the WC phase decreases,the more obvious the strengthening effect,the stronger the ability of workpiece to resist the wear will be.
基金supported by the National Natural Science Foundation of China(Grant No.52074365)grateful to the Sichuan Science and Technology Program,China(Grant No.2022YFG0289)+2 种基金sponsored by the Funding Project of Key Laboratory of Sichuan Province for comprehensive Utilization of Vanadium and Titanium Resources,China(Grant No.2018FTSZ26)the Project Supported by the Opening Project of Material Corrosion and Protection Key Laboratory of Sichuan province,China(Grant Nos.2021CL26,GK202104,and GK202106)supported by the Ph.D.Programs Foundation of Sichuan University of Science and Engineering,China(Grant No.2021RC18).
文摘Copper alloy composite bit matrix was prepared by pressureless vacuum infiltration,using at least one of the three kinds of tungsten carbide particles,for example,irregular cast tungsten carbide,monocrystalline tungsten carbide and sintered reduced tungsten carbide particles.The effects of powder particle morphology,particle size and mass fraction of tungsten carbide on the microstructure and mechanical properties of copper alloy composite were investigated by means of scanning electron microscopy,X-ray diffraction and abrasive wear test in detail.The results show that tungsten carbide morphology and particle size have obvious effects on the mechanical properties of copper alloy composites.Cast tungsten carbide partially dissolved in the copper alloy binding phase,and layers of Cu_(0.3)W_(0.5)Ni_(0.1)Mn_(0.1)C phase with a thickness of around 8–15μm were formed on the edge of the cast tungsten carbide.When 45%irregular crushed fine cast tungsten carbide and 15%monocrystalline cast tungsten carbide were used as the skeleton,satisfactory comprehensive performance of the reinforced copper alloy composite bit matrix was obtained,with the bending strength,impact toughness and hardness reaching 1048 MPa,4.95 J/cm^(2) and 43.6 HRC,respectively.The main wear mechanism was that the tungsten carbide particles firstly protruded from the friction surface after the copper alloy matrix was worn,and then peeled off from the matrix when further wear occurred.
基金financially supported by the Natural Science Foundation of Heilongjiang Province,China(No.LC2015020)Technology Foundation for Selected Overseas Chinese Scholar,Ministry of Personnel of China(No.2015192)+1 种基金the Innovative Talent Fund ofHarbin City(No.2016RAQXJ185)Science Funds for the Young Innovative Talents of HUST(No.201604)
文摘Graphene reinforced copper matrix composites (Gr/Cu) were fabricated by electrostatic self-assembly and powder metallurgy. The morphology and structure of graphene oxide, graphene oxide-Cu powders and Gr/Cu composites were characterized by scanning electronic microscopy, transmission electronic microscopy, X-ray diffraction and Raman spectroscopy, respectively. The effects of graphene contents, applied loads and sliding speeds on the tribological behavior of the composites were investigated. The results indicate that the coefficient of friction of the composites decreases first and then increases with increasing the graphene content. The lowest friction coefficient is achieved in 0.3 wt~ Gr/Cu composite, which decreases by 65% compared to that of pure copper. The coefficient of friction of the composite does not have significant change with increasing the applied load, however, it increases with increasing the sliding speed. The tribological mechanisms of the composite under different conditions were also investigated.
基金financially supported by the National Natural Science Foundation of China(No.U1604251)the Doctoral Start-up Foundation of Liaoning Province(No.2019-BS-178)the National Outstanding Youth Science Fund Project of National Natural Science Foundation of China(CN)(No.U52001216)。
文摘In this study, neutral salt spray accelerated corrosion test of copper–aluminium composite under 0–125 A DC current was carried out under 5% concentration. The effect of corrosion behaviour on copper–aluminium composite by DC current was carried out by a scanning electron microscope(SEM) with energy-dispersive spectroscopy(EDS), X-ray diffraction(XRD) patterns, X-ray photoelectron spectroscopy(XPS), weight-loss method and electrochemical analysis. The results show that the current can accelerate the corrosion rate. Meanwhile, the current temperature effect can reduce the corrosion rate. The current caused directional migration of ions resulting in different corrosion products on positive and negative poles of specimen, and the corrosion degree on the positive pole was more serious. The galvanic corrosion mechanism at the copper–aluminium interface is different from the pitting corrosion mechanism far away from the interface, and the latter is more affected by DC current.
基金Funded by the High-Tech Research and Development Program of China (No. 2008AA03Z505)
文摘The package and system level temperature and thermal stress distributions of 10 W light emitting diode (LED) with 4 chips and 100 W LED with 100 chips were investigated using finite element analysis. The chips were arranged on a Si sheet which is soldered on the copper/diamond composite slug with very high conductivity. The experimental results show that the maximal temperature appears in the chips of both two high power LEDs packages. Compared with the 10 W LEDs package with 4 chips array, the heat issue caused by stacking and coupling of the heat in 100 W LEDs package with 100 chips array is more serious. The chip temperature in the center of the array is much higher, and it decreases with the distance between the chip and the center of LEDs increases. Great thermal stress lies between the chips and the solder, which will reduce the reliability of the package.
基金supported by the Air Force Office of Scientific Research under award number FA2386-17-14025。
文摘A Cu-1.5 wt.%Ti/Diamond(55 vol.%)composite was fabricated by hot forging from powder mixture of copper,titanium and diamond powders at 1050?C.A nano-thick TiC interfacial layer was formed between the diamond particle and copper matrix during forging,and it has an orientation relationship of(111)TiC//(002)Cu&[110]TiC//[110]Cuwith the copper matrix.HRTEM analysis suggests that TiC is semicoherently bond with copper matrix,which helps reduce phonon scattering at the TiC/Cu interface and facilitates the heat transfer,further leading to the hot-forged copper/diamond composite(referred as to Cu-Ti/Dia-0)has a thermal conductivity of 410 W/m K,and this is about 74%of theoretical thermal conductivity of hot-forged copper/composite(552 W/m K).However,the formation of thin amorphous carbon layer in diamond particle(next to the interfacial TiC layer)and deformed structure in the copper matrix have adverse effect on the thermal conductivity of Cu-Ti/Dia-0 composite.800℃-annealing eliminates the discrepancy in TiC interface morphology between the diamond-{100}and-{111}facets of Cu-Ti/Dia-0 composite,but causes TiC particles coarsening and agglomerating for the Cu-Ti/Dia-2 composite and interfacial layer cracking and spallation for the Cu-Ti/Dia-1 composite.In addition,a large amount of graphite was formed by titanium-induced diamond graphitization in the Cu-Ti/Dia-2 composite.All these factors deteriorate the heat transfer behavior for the annealed Cu-Ti/Dia composites.Appropriate heat treatment needs to be continually investigated to improve the thermal conductivity of hot-forged CuTi/Dia composite by eliminating deformed structure in the copper matrix with limit/without impacts on the formed TiC interfacial layer.
基金supported financially by the China Scholarship Council (CSC)National Natural Science Foundation of China (Project No. 51271115)+1 种基金the Ministry of Science and Technology, China (Project No. 2012CB619600)the SJTU-UNSW Strategic Collaboration to conduct this investigation
文摘Both the coarsening of Al2O3 nanoparticles and the growth of Cu nanograins of mechanically milled nanostructured Cu-5 vol.%Al2O3 composites with, and without, trace amounts of Ti during annealing at973 K for 1 h were investigated. It was found that doping with a small amount of Ti(e.g. 0.2 wt%) in a nanostructured Cu-5 vol.%Al2O3 composite effectively suppressed the coarsening of Al2O3 nanoparticles during exposure at this temperature. Further, the Ti addition also prevented the concomitant abnormal growth of the copper grains normally caused by the coarsening of the Al2O3 nanoparticles. Energy dispersive X-ray spectroscopy analysis of the Al2O3 nanoparticles in the annealed Cu-5 vol.%Al2 O3-0.2 wt%Ti sample suggested that the Ti atoms either diffused into the Al2O3 nanoparticles or segregated to the Cu/Al2O3 interfaces to form Ti-doped Al2O3 nanoparticles, which was more stable than Ti-free Al2O3 nanoparticles during annealing at high homologous temperatures.