The electroformed copper layer with gradient microstructure was prepared using the ultrasonic technique. The microstructure of the electroformed copper layer was observed by using an optical microscope （OM） and a sc...The electroformed copper layer with gradient microstructure was prepared using the ultrasonic technique. The microstructure of the electroformed copper layer was observed by using an optical microscope （OM） and a scanning electron microscope （SEM）. The preferred orientations of the layer were characterized by X-ray diffraction （XRD）. The mechanical properties were evaluated with a Vicker＇s hardness tester and a tensile tester. It is found the gradient microstructure consists of two main parts： the outer part （faraway substrate） with columnar crystals and the inner part （nearby substrate） with equiaxed grains. The Cu-（220） preferred orientation increases with the increasing thickness of the copper layer. The test results show that the microhardness of the electroformed copper layer decreases with increasing grain size along the growth direction and presents a gradient distribution. The tensile strength of the outer part of the electroformed copper layer is higher than that of the inner part but at the cost of ductility. Meanwhile, the integral mechanical properties of the electroformed copper with gradient microstrucmre are significantly improved in comparison with the pure copper deposit.展开更多
The deposition of high-quality diamond films and their adhesion on cemented carbides are strongly influenced by the catalytic effect of cobalt under typical deposition conditions. Decreasing Co content on the surface...The deposition of high-quality diamond films and their adhesion on cemented carbides are strongly influenced by the catalytic effect of cobalt under typical deposition conditions. Decreasing Co content on the surface of the cemented carbide is often used for the diamond film deposition. But the leaching of Co from the WC-Co substrate leading to a mechanical weak surface often causes a poor adhesion. In this paper we adopted an implant copper layer prepared by vaporization to improve the mechanical properties of the Co-leached substrate. The diamond films were grown by microwave plasma chemical vapor deposition from CH4:H2 gas mixture. The cross section and the morphology of the diamond film were characterized by scanning electron microscopy (SEM). The non-diamond content in the film was analyzed by Raman spectroscopy. The effects of pretreatment on the concentrations of Co and Cu near the interfacial region were examined by energy dispersive spectrum (EDS) equipped with SEM. The adhesion of the diamond on the substrate was evaluated with a Rockwell-type hardness tester. The results indicate that the diamond films prepared with implant copper layer have a good adhesion to the cemented carbide substrate due to the recovery of the mechanical properties of the Co-depleted substrate after the copper implantation and the formation of less amorphous carbon between the substrate and the diamond film.展开更多
In this work, the deposition process features of a copper coating on stainless steel substrate, using the pulse vacuum arc spraying method were researched. A continuous layer of copper was deposited on a stainless ste...In this work, the deposition process features of a copper coating on stainless steel substrate, using the pulse vacuum arc spraying method were researched. A continuous layer of copper was deposited on a stainless steel substrate, and a high degree of coating adhesion to the substrate was demonstrated. The thickness of coating using application time was calculated, and the surface unevenness was estimated. Inside the coating layer substrate material elements were observed, that could appear as a result of simultaneously plasma spraying on the surface of the substrate. The feature of this method was discovered, that surface plasma plays a significant role in the deposition process. Finally, it was shown that the device with a pulsed arc could effectively be used in industry, since it is possible to change the layer thickness in the range of hundreds of microns by varying the deposition time.展开更多
Copper thin films were deposited by plasma-enhanced atomic layer deposition at low temperature, using copper（I）-N,N′-di-sec-butylacetamidinate as a precursor and hydrogen as a reductive gas. The influence of temper...Copper thin films were deposited by plasma-enhanced atomic layer deposition at low temperature, using copper（I）-N,N′-di-sec-butylacetamidinate as a precursor and hydrogen as a reductive gas. The influence of temperature, plasma power, mode of plasma, and pulse time, on the deposition rate of copper thin film, the purity of the film and the step coverage were studied.The feasibility of copper film deposition on the inner wall of a carbon fibre reinforced plastic waveguide with high aspect ratio was also studied. The morphology and composition of the thin film were studied by atomic force microscopy and x-ray photoelectron spectroscopy,respectively. The square resistance of the thin film was also tested by a four-probe technique. On the basis of on-line diagnosis, a growth mechanism of copper thin film was put forward, and it was considered that surface functional group played an important role in the process of nucleation and in determining the properties of thin films. A high density of plasma and high free-radical content were helpful for the deposition of copper thin films.展开更多
CuAlBe alloy is an attractive shape memory alloy with many important usages in industrial field, in order to spread its range of application it is desirable to be able to join CuAlBe soundly with other metallic materi...CuAlBe alloy is an attractive shape memory alloy with many important usages in industrial field, in order to spread its range of application it is desirable to be able to join CuAlBe soundly with other metallic materials, for example stainless steel; however the weldability between CuAlBe alloy and stainless steel has never been studied, therefore an experimental investigation of different transition metals was carried out in the diffusion bonding joints of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti). The microstructure and phase composition of the joint were analyzed by SEM, EPMA and X ray diffraction. The following conclusions have been drawn: 1) The joint strength with Ni interlayer is higher than that with Cu interlayer when the welding parameters are the same; 2) When Ni interlayer is thinner, Al will interact with Ni and Fe, and the intermetallic compounds such as Fe 3Al are formed in the interface, which decreases the strength of the joints; 3) When the bonding temperature is higher, because the diffusion of Cu in Ni is faster than Ni in Cu, a Kirkendall effect occurs, which also decreases the strength of the joints.展开更多
Carbon nanotubes （CNTs） were coated by tungsten layer using metal organic chemical vapor deposition process with tungsten hexacarbonyl as a precursor. The W-coated CNTs （W-CNTs） were dispersed into Cu powders by m...Carbon nanotubes （CNTs） were coated by tungsten layer using metal organic chemical vapor deposition process with tungsten hexacarbonyl as a precursor. The W-coated CNTs （W-CNTs） were dispersed into Cu powders by magnetic stirring process and then the mixed powders were consolidated by spark plasma sintering to fabricate W-CNTs/Cu composites. The CNTs/Cu composites were fabricated using the similafprocesses. The friction coefficient and mass wear loss of W-CNTs/Cu and CNTs/Cu composites were studied. The results showed that the W-CNT content, interfacial bonding situation, and applied load could influence the friction coefficient and wear loss of W-CNTs/Cu com- posites. When the W-CNT content was 1.0 wt.%, the W-CNTs/Cu composites got the minimum friction coefficient and wear loss, which were decreased by 72.1% and 47.6%, respectively, compared with pure Cu specimen. The friction coefficient and wear loss of W-CNTs/Cu composites were lower than those of CNTs/Cu composites, which was due to that the interracial bonding at （W-CNTs）-Cu interface was better than that at CNTs-Cu interface. The friction coefficient of composites did not vary obviously with increasing applied load, while the wear loss of composites increased significantly with the increase of applied load.展开更多
Taking dodecanethiol as the representative, we investigated the corrosion inhibition performance of SAL in seawater under pressures from 0.1 to 9 MPa. By using scanning Kelvin probe, the dodecanethiol SAL is confirmed...Taking dodecanethiol as the representative, we investigated the corrosion inhibition performance of SAL in seawater under pressures from 0.1 to 9 MPa. By using scanning Kelvin probe, the dodecanethiol SAL is confirmed to build on Cu surface, and the modification of SAL has positively shifted the surface potential to realize the inertness. Electrochemical techniques, such as electrochemical impedance spectroscopy and potentiodynamic polarization were used to reveal the corrosion behavior of Cu modified by SAL under the different pressure, i e, 0.1, 3, 6, and 9 MPa. It is indicated that the longer modification time affords better corrosion resistance to Cu. Higher static pressure is easier to deteriorate the corrosion inhibition capability due to the penetration effect. A plausible mechanism is proposed to illustrate the degradation process of SAL in the high pressure seawater environment.展开更多
Nickel-coated graphite flakes/copper（GN/Cu） composites were fabricated by spark plasma sintering with the surface of graphite flakes（GFs） being modified by Ni–P electroless plating. The effects of the phase trans...Nickel-coated graphite flakes/copper（GN/Cu） composites were fabricated by spark plasma sintering with the surface of graphite flakes（GFs） being modified by Ni–P electroless plating. The effects of the phase transition of the amorphous Ni–P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity（TC） of the GN/Cu composites were systematically investigated. The introduction of Ni–P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650℃ and slightly increased the TC of the X–Y basal plane of the GF/Cu composites with 20 vol%–30 vol% graphite flakes. However, when the graphite flake content was greater than 30 vol%, the TC of the GF/Cu composites decreased with the introduction of Ni–P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.展开更多
文摘The electroformed copper layer with gradient microstructure was prepared using the ultrasonic technique. The microstructure of the electroformed copper layer was observed by using an optical microscope （OM） and a scanning electron microscope （SEM）. The preferred orientations of the layer were characterized by X-ray diffraction （XRD）. The mechanical properties were evaluated with a Vicker＇s hardness tester and a tensile tester. It is found the gradient microstructure consists of two main parts： the outer part （faraway substrate） with columnar crystals and the inner part （nearby substrate） with equiaxed grains. The Cu-（220） preferred orientation increases with the increasing thickness of the copper layer. The test results show that the microhardness of the electroformed copper layer decreases with increasing grain size along the growth direction and presents a gradient distribution. The tensile strength of the outer part of the electroformed copper layer is higher than that of the inner part but at the cost of ductility. Meanwhile, the integral mechanical properties of the electroformed copper with gradient microstrucmre are significantly improved in comparison with the pure copper deposit.
文摘The deposition of high-quality diamond films and their adhesion on cemented carbides are strongly influenced by the catalytic effect of cobalt under typical deposition conditions. Decreasing Co content on the surface of the cemented carbide is often used for the diamond film deposition. But the leaching of Co from the WC-Co substrate leading to a mechanical weak surface often causes a poor adhesion. In this paper we adopted an implant copper layer prepared by vaporization to improve the mechanical properties of the Co-leached substrate. The diamond films were grown by microwave plasma chemical vapor deposition from CH4:H2 gas mixture. The cross section and the morphology of the diamond film were characterized by scanning electron microscopy (SEM). The non-diamond content in the film was analyzed by Raman spectroscopy. The effects of pretreatment on the concentrations of Co and Cu near the interfacial region were examined by energy dispersive spectrum (EDS) equipped with SEM. The adhesion of the diamond on the substrate was evaluated with a Rockwell-type hardness tester. The results indicate that the diamond films prepared with implant copper layer have a good adhesion to the cemented carbide substrate due to the recovery of the mechanical properties of the Co-depleted substrate after the copper implantation and the formation of less amorphous carbon between the substrate and the diamond film.
文摘In this work, the deposition process features of a copper coating on stainless steel substrate, using the pulse vacuum arc spraying method were researched. A continuous layer of copper was deposited on a stainless steel substrate, and a high degree of coating adhesion to the substrate was demonstrated. The thickness of coating using application time was calculated, and the surface unevenness was estimated. Inside the coating layer substrate material elements were observed, that could appear as a result of simultaneously plasma spraying on the surface of the substrate. The feature of this method was discovered, that surface plasma plays a significant role in the deposition process. Finally, it was shown that the device with a pulsed arc could effectively be used in industry, since it is possible to change the layer thickness in the range of hundreds of microns by varying the deposition time.
文摘Copper thin films were deposited by plasma-enhanced atomic layer deposition at low temperature, using copper（I）-N,N′-di-sec-butylacetamidinate as a precursor and hydrogen as a reductive gas. The influence of temperature, plasma power, mode of plasma, and pulse time, on the deposition rate of copper thin film, the purity of the film and the step coverage were studied.The feasibility of copper film deposition on the inner wall of a carbon fibre reinforced plastic waveguide with high aspect ratio was also studied. The morphology and composition of the thin film were studied by atomic force microscopy and x-ray photoelectron spectroscopy,respectively. The square resistance of the thin film was also tested by a four-probe technique. On the basis of on-line diagnosis, a growth mechanism of copper thin film was put forward, and it was considered that surface functional group played an important role in the process of nucleation and in determining the properties of thin films. A high density of plasma and high free-radical content were helpful for the deposition of copper thin films.
文摘CuAlBe alloy is an attractive shape memory alloy with many important usages in industrial field, in order to spread its range of application it is desirable to be able to join CuAlBe soundly with other metallic materials, for example stainless steel; however the weldability between CuAlBe alloy and stainless steel has never been studied, therefore an experimental investigation of different transition metals was carried out in the diffusion bonding joints of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti). The microstructure and phase composition of the joint were analyzed by SEM, EPMA and X ray diffraction. The following conclusions have been drawn: 1) The joint strength with Ni interlayer is higher than that with Cu interlayer when the welding parameters are the same; 2) When Ni interlayer is thinner, Al will interact with Ni and Fe, and the intermetallic compounds such as Fe 3Al are formed in the interface, which decreases the strength of the joints; 3) When the bonding temperature is higher, because the diffusion of Cu in Ni is faster than Ni in Cu, a Kirkendall effect occurs, which also decreases the strength of the joints.
基金financially supported by the National Natural Science Foundation of China (No.50971020)National HighTech Research and Development Program of China (No.2009AA03Z116)
文摘Carbon nanotubes （CNTs） were coated by tungsten layer using metal organic chemical vapor deposition process with tungsten hexacarbonyl as a precursor. The W-coated CNTs （W-CNTs） were dispersed into Cu powders by magnetic stirring process and then the mixed powders were consolidated by spark plasma sintering to fabricate W-CNTs/Cu composites. The CNTs/Cu composites were fabricated using the similafprocesses. The friction coefficient and mass wear loss of W-CNTs/Cu and CNTs/Cu composites were studied. The results showed that the W-CNT content, interfacial bonding situation, and applied load could influence the friction coefficient and wear loss of W-CNTs/Cu com- posites. When the W-CNT content was 1.0 wt.%, the W-CNTs/Cu composites got the minimum friction coefficient and wear loss, which were decreased by 72.1% and 47.6%, respectively, compared with pure Cu specimen. The friction coefficient and wear loss of W-CNTs/Cu composites were lower than those of CNTs/Cu composites, which was due to that the interracial bonding at （W-CNTs）-Cu interface was better than that at CNTs-Cu interface. The friction coefficient of composites did not vary obviously with increasing applied load, while the wear loss of composites increased significantly with the increase of applied load.
基金Funded by the Foundation of Key Laboratory of Marine Environmental Corrosion and Bio-fouling,Institute of Oceanology,Chinese Academy of Sciences(MCKF201605)the National Natural Science Foundation of China(21301161)
文摘Taking dodecanethiol as the representative, we investigated the corrosion inhibition performance of SAL in seawater under pressures from 0.1 to 9 MPa. By using scanning Kelvin probe, the dodecanethiol SAL is confirmed to build on Cu surface, and the modification of SAL has positively shifted the surface potential to realize the inertness. Electrochemical techniques, such as electrochemical impedance spectroscopy and potentiodynamic polarization were used to reveal the corrosion behavior of Cu modified by SAL under the different pressure, i e, 0.1, 3, 6, and 9 MPa. It is indicated that the longer modification time affords better corrosion resistance to Cu. Higher static pressure is easier to deteriorate the corrosion inhibition capability due to the penetration effect. A plausible mechanism is proposed to illustrate the degradation process of SAL in the high pressure seawater environment.
基金financially supported by the National Natural Science Foundation of China (No. 51374028)Fundamental Research Funds for the Central Universities (FRF-GF-17-B37)
文摘Nickel-coated graphite flakes/copper（GN/Cu） composites were fabricated by spark plasma sintering with the surface of graphite flakes（GFs） being modified by Ni–P electroless plating. The effects of the phase transition of the amorphous Ni–P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity（TC） of the GN/Cu composites were systematically investigated. The introduction of Ni–P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650℃ and slightly increased the TC of the X–Y basal plane of the GF/Cu composites with 20 vol%–30 vol% graphite flakes. However, when the graphite flake content was greater than 30 vol%, the TC of the GF/Cu composites decreased with the introduction of Ni–P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.
