Microstructure and electrical conductivity of electroless copper plating layer on magnesium alloy micro-arc oxidation coating

In order to impart electrical conductivity to the magnesium alloy micro-arc oxidation(MAO)coating,the electroless copper plating was performed.Effects of plating temperature and complexing agent concentration on the properties of the electroless copper plating layers were studied by measuring their microstructure,corrosion resistance and electrical conductivity.It was found that the optimized plating temperature was 60°C,and the most suitable value of the complexing agent concentration was 30 g/L.Under this condition,a complete and dense plating layer could be obtained.The formation mechanism of the plating layer on magnesium alloy MAO coating was analyzed.A three-stage model of the plating process was proposed.The square resistance of the plated specimen was finally reduced to 0.03Ω/□after the third stage.Through electroless copper plating,the MAO coated sample obtained excellent electrical conductivity without significantly reducing its corrosion resistance.

Electroless copper plating on microcellular polyurethane foam

In order to obtain substrates with good conductive foam for high porosity foam metal materials used in the metal electrodes,the technique of electroless copper plating on the microcellular polyurethane foam with pore size of 0.3 mm was investigated.The main factors affecting the deposition rate such as the solution composition,temperature,pH value and adding ultrasonic were explored.The results show that the optimum process conditions are CuSO4 16 g/L,HCHO 5 mL/L,NaKC4H4O6 30 g/L,Na2EDTA 20 g/L,K4Fe(CN)6 25 mg/L,pH value of 12.5-13.0 and temperature of 40-50℃.Under these technical conditions, the process has excellent bath stability.Adding ultrasonic on the process can elevate the deposition rate of copper by 20%-30%.The foam metal material with a porosity of 92.2%and a three-dimensional network structure,was fabricated by electro-deposition after the electroless copper plating.

Anode oxidation of HCHO in THPED-containing electroless copper plating solution

The electrochemical mechanism of anode oxidation of HCHO in electroless copper plating solution with N, N, N′, N′-tetrakis(2-hydroxypropyl)ethylenediamine (THPED) was investigated by measuring cyclic voltammetry curves and anodic polarization curves. Three different oxidation peaks occur at the potentials of -0.62 V (Peak 1), -0.40 V (Peak 2) and -0.17 V (Peak 3) in the anode oxidation process of THPED-containing solution. The reaction at Peak 1, a main oxidation reaction, is the irreversible reaction of adsorbed HCHO with hydrogen evolution. The reaction at Peak 2, a secondary oxidation reaction, is the quasi-reversible reaction of adsorbed HCHO without hydrogen evolution. The reaction at Peak 3 is the irreversible oxidation of anode copper. The current density of Peak 1 increases gradually, that of Peak 2 remains constant and that of Peak 3 decreases with the increase of HCHO concentration. The current density of Peak 3 increases with the increase of THPED concentration and the complexation of THPED promotes the dissolution of anode copper.

Conductive Polyacrylonitrile Fiber Prepared by Copper Plating with L-Ascorbic Acid as Reducing Agent

Conductive polyacrylonitrile fibers were prepared by electroless copper plating under weak alkaline conditions,with L-ascorbic acid as reducing agent.The influences of CuSO_(4)·5H_(2)O,L-ascorbic acid,2,2′-bipyridine and K_(4)Fe(CN)_(6) concentration on the conductivity and mass gain percentage of the fibers were studied.The morphological structure of the fibers was characterized by scanning electron microscopy(SEM),and the mechanical properties of the fibers were analyzed through the mechanical property test.The results showed that the optimal reaction conditions were as follows:26 g/L CuSO_(4)·5H_(2)O,26 g/L L-ascorbic acid,12 mg/L 2,2′-bipyridine,7 mg/L K 4Fe(CN)6,and 38℃.The volume resistivity of the conductive PAN fibers prepared by the process was only 3.84×10^(-3)Ω·cm.

Process optimization of electroless copper plating and its influence on electrochemical properties of AB_5-type hydrogen storage alloy

The amount of Cu coating by chemical plating was investigated based on quadratic regression orthogonal experimental design being adapted to the variation law of temperature, pH value and Ni2+ concentration, and the relevant regression equation was expressed as y=2.1609+0.5295×10-3T2-0.0342P2-0.0265N2+0.0023TP+0.0020TH+0.0199PN-0.0959T+0.3814P-0.2073N. The results showed that the deposition rate augmented with the increasing in temperature, pH value and Ni2+ concentration. The experimental parameters of the optimal coating were temperature 75 °C, pH value 8.5 and Ni2+ concentration 1.2 g/L. The electrochemical tests indicated that the cycle stability increased from 60.66% to 75.58%, indicating that the treated alloy exhibited better corrosion resistance.

Simulation of through via bottom–up copper plating with accelerator for the filling of TSVs

Filling high aspect ratio through silicon vias （TSVs） without voids and seams by copper plating is one of the technical challenges for 3D integration. Bottom-up copper plating is an effective solution for TSV filling. In this paper, a new numerical model was developed to simulate the electrochemical deposition （ECD） process, and the influence of an accelerator in the electrolyte was investigated. The arbitrary Lagrange-Eulerian （ALE） method for solving moving boundaries in the finite element method （FEM） was used to simulate the electrochemical process. In the model, diffusion coefficient and adsorption coefficient were considered, and then the time-resolved evolution of electroplating profiles was simulated with ion concentration distribution and the electric current density.

A New Approach on the Active Treatment for Electroless Copper Plating on Glass

A new method is described for the electroless deposition of copper onto glass. Commercially available glass slide was modified with γ-aminopropyltrimethoxysilane to form self-assembled monolayer (SAM) on it. Then it was dipped directly into PdCl_2 solution instead of the conventional SnCl_2 sensitization followed by PdCl_2 activation. Experimental results showed that the Pd 2+ ions from PdCl_2 solution were coordinated to the amino groups on the glass surface resulting in the formation of N-Pd complex. In an electroless copper bath containing a formaldehyde reducing agent, the N-Pd complexes were reduced to Pd 0 atoms, which then acted as catalysts and initiated the deposition of copper metal. Although the copper deposition rate on SAM-modified glass was slow at the beginning, it reached to that of conventional method in about 5 min.

Preparation and characterization of molybdenum powders with copper coating by the electroless plating technique

Molybdenum powders with a diameter of approximately 3 μn were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃. The optimization of the electroless copper bath was evaluated through the combination of process parameters like pH and temperature. The optimized values ofpH and temperature were found to be 12.5 and 60℃, respectively, which attributes to the bright maroon color of the coating with an increase in weight of 46%. The uncoated and coated powders were subjected to microstructural studies using scanning electron microscope （SEM） and the phases were analyzed using X-my diffrction （XRD）. An attempt was made to understand the growth mechanism of the coating. The diffusion-shrinkage autocatalytic model was suggested for copper growth on the molybdenum surface.

Preparation of copper-coated fine molybdenum powders with electroless technique

The molybdenum powders with average particle size of 3 μm were coated with copper by electroless plating. The influence of pretreatment, solution composition and plating conditions on electroless copper plating was studied. The copper-coated molybdenum powders were examined by SEM and XRD. Results indicate that a series of optimization methods is used to add activated sites before electroless copper plating. Taking TEA and EDTA as chief and assistant complex agents respectively, 2,2＇-bipyridyl and PEG as double stabilizers, the Mo powders are coated with copper successfully with little Cu20 contained, at the same time, Mo-Cu composite powders with copper content of 15 - 85 wt% can be obtained. The optimal values of pH, temperature and HCHO concentration are 12 -13, 60 -65 ℃ and 22 -26 mL/L, respectively.

Electroless copper-phosphorus coatings with the addition of silicon carbide (SiC) particles

Cu-P-silicon carbide （SiC） composite coatings were deposited by means of electroless plating.The effects of pH values,temperature,and different concentrations of sodium hypophosphite （NaH2PO2·H2O）,nickel sulfate （NiSO4·6H2O）,sodium citrate （C6H5Na3O7·2H2O） and SiC on the deposition rate and coating compositions were evaluated,and the bath formulation for Cu-P-SiC composite coatings was optimised.The coating compositions were determined using energy-dispersive X-ray analysis （EDX）.The corresponding optimal operating parameters for depositing Cu-P-SiC are as follows：pH 9;temperature,90oC;NaH2PO2·H2O concentration,125 g/L;NiSO4·6H2O concentration,3.125 g/L;SiC concentration,5 g/L;and C6H5Na3O7·2H2O concentration,50 g/L.The surface morphology of the coatings analysed by scanning electron microscopy （SEM） shows that Cu particles are uniformly distributed.The hardness and wear resistance of Cu-P composite coatings are improved with the addition of SiC particles and increase with the increase of SiC content.

Interface repairing for AA5083/T2 copper explosive composite plate by friction stir processing

Multi-pass friction stir processing(M-FSP)was performed to repair the interface defects of AA5083/T2 copper explosive composite plates.The interface morphology and its bonding mechanism were explored.The results show that higher rotation speed and lower transverse speed produce more heat generated during FSP.The defect-free and good mechanical properties of the AA5083/T2 copper composite plate can be obtained under the condition of the rotation speed of 1200 r/min,the transverse speed of 30 mm/min and the overlap of 2/24.Moreover,M-FSP changes the interface bonding mechanism from metallurgical bonding to vortex connection,improving the bonding strength of composite plate,which can guarantee the repairing quality of composite plates.

Effect of cooling structure on thermal behavior of copper plates of slab continuous casting mold

A three-dimensional finite-element model of slab continuous casting mold was conducted to clarify the effect of cooling structure on thermal behavior of copper plates. The results show that temperature distribution of hot surface is mainly governed by cooling structure and heat-transfer conditions. For hot surface centricity, maximum surface temperature promotions are 30 ℃and 15 ℃ with thickness increments of copper plates of 5 mm and nickel layers of 1 ram, respectively. The surface temperature without nickel layers is depressed by 10 ℃ when the depth increment of water slots is 2 mm and that with nickel layers adjacent to and away from mold outlet is depressed by 7℃ and 5 ℃, respectively. The specific trend of temperature distribution of transverse sections of copper plates is nearly free of cooling structure, but temperature is changed and its law is similar to the corresponding surface temperature.

Ar-N_2 Shielding GTA Welding of Copper Thick Plates

The Ar-N2 gas tungsten arc(GTA) welding of 10 mm copper thick plates without preheating was investigated.The microstructure of weld metal and joints was observed and mechanical performance of weld metal was tested by using Cu-Ti welding metal with different Ti content.The Ar-N2 GTA weld of copper thick plates can eliminate the nitrogen porosities in the weld metal by adding element Ti in filler metal,which is caused by N2 gas in shield gas.The elimination degree of nitrogen porosities,the distribution of CuTiN intermetallic compound(IMC) and the mechanical performance of joints are associated with the change of the Ti content in the welding materials.And when Ti content is about 5%,nitrogen porosities is eliminated completely and the CuTiN IMC distribute dispersedly,the tensile strength and impact ductility of the joint achieve the best result,which almost reaches the lever of the base metal.

Low temperature solid-phase sintering of sintered metal fibrous media with high specific surface area

A procedure of low temperature solid-phase sintering（LTSS） was carried out to fabricate sintered metal fibrous media（SMFM） with high specific surface area.Stainless steel fibers which were produced by cutting process were first plated with a coarse copper coating layer by electroless plating process.A low-temperature sintering process was then completed at about 800 °C for 1 h under the protection of hydrogen atmosphere.The results show that a novel SMFM with complex surface morphology and high specific surface area（0.2 m2/g） can be obtained in this way.The effect of sintering temperature on the surface morphology and specific surface area of SMFM was studied by means of scanning electron microscopy and Brunauer-Emmett-Teller.The damage of micro-structure during the sintering process mainly contributed to the loss of specific surface area of SMFM and the optimal sintering temperature was 800 °C.

Parameters optimization of electroless deposition of Cu on Cr-coated diamond

Electroless copper plating on diamond particles precoated with 1%Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction parameters. The formulated samples under optimized parameters were characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectra and optical microscopy. The best parameters, where uniform and maximum coating thickness was achieved, are etching with 20%NaOH for 30 min, sensitization and activation with SnCl2 and PdCl2 for 5 and 20 min, respectively. The composition of the copper solution bath was 16 g/L CuSO4＆#183;5H2O, 35 mL/L formaldehyde （HCHO）, 23 g/L KNaC4H4O6 at 60 ℃, pH=13 and stirring at （350±15） r/min under ultrasonication.

Fabrication, microstructure and properties of SiCp/Cu heat sink materials

Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments.

Electroless plating of copper layer on surfaces of urea-formaldehyde microcapsule particles containing paraffin for low infrared emissivity

A copper coating was deposited by electroless plating on the surfaces of urea-formaldehyde microcap- sules containing paraffin （UFP） particles. This composite microcapsule structure had low infrared OR） emissivity and maintained a constant temperature, and could be used in IR stealth applications. The eiectroless copper layer formation and its micro-appearance, and the effect of the copper layer on the IR emissivity and thermal properties of the composite microcapsules were investigated. The IR emissivity of the composite microcapsules at wavelengths of 1-14 μm gradually decreased with increasing copper mass on the surface. After formation of an integrated copper layer, the rate of IR emissivity decrease was lower. This is because the copper coating improves the surface conductivity of the UFP; a high conductivity results in high reflectivity, which leads to a decrease in IR emissivity. The lowest IR emissivity achieved was 0.68. The phase-change enthalpy of the composite microcapsules decreased with increasing amount of copper coated on the surface because of the high density of copper. When the mass increase of the UFP after electroless copper plating was about 300%, the composite microcapsules had low IR emissivity （about 0.8） and a high phase-change enthalpy （80J/g）.

Development of China's Copper Plate and Strip Industry——Part Ⅰ

As a metal,copper comes in third only to iron and aluminum in terms of importance in national economy and as a non-ferrous metal,it ranks second in terms of consumption.The copper industry is a pillar of the non-ferrous metal industry in China.In 2016,the copper industry’s assets accounted for23%of the national non-ferrous industry’s total,and its income accounted for 35%.China also holds

Development of China's Copper Plate and Strip Industry——Part Ⅱ

In China,the upstream industries of copper processing are copper ore dressing and copper smelting industries.But China’s copper industry has seen unbalanced development between the three steps:copper ore dressing,copper smelting and processing.The industrialpattern where processing capacity is greater than smelting capacity,and smelting capacity

Longitudinal corner crack of chamfered slab and optimization of mould

Chamfered mould has gradually become a new technology equipment to eliminate transverse corner crack.However,longitudinal corner crack ratio of chamfered slab was very high.Solidification microstructure was detected in the area where the longitudinal corner crack occurred.Effect of narrow face shape and taper distribution of mould copper plate on longitudinal corner crack was studied by industrial tests.Water velocity distribution in the narrow copper plate was studied by numerical simulation.On the premise of preventing cooling water from nuclear boiling,improvement measures of mould cooling process and water seam structure were put forward through heat transfer calculation.The results showed that local taper of the meniscus region of mould should be increased to prevent generation of longitudinal corner crack.Chamfering slope length of narrow copper plate should be controlled within 55 mm,and chamfering angle should be controlled at about 30°.Average water velocity should be more than 7.0 m/s.The flat and chamfering regions of narrow copper plate working face should be designed as double taper and funnel structure,respectively.The water seam in the chamfering region should preferentially choose the combined cooling structure with two holes and one slot.In order to prevent the extension of longitudinal corner crack,chamfered narrow face foot roller should be used.