CLINICAL STUDY ON SERUM COPPER AND ZINC LEVELS AND COPPER/ZINC RATIO IN MALIGNANT LYMPHOMA

173 simultaneous determinations of serum copper levels (SCL), serum zinc levels (SZL) and copper/zinc ratio (CZR) were made by atomic absorption spectrophotometry in 51 previously untreated lymphoma patients. SCL and CZR were significantly higher in patients before treatment (mean value 22.97 μmol/L, 1.55, respectively) and in those who did not reach complete remission (mean 21.21 μmol/L, 1.36) as compared with the patients in complete remission (mean 16.36 μmol/L, 1.06) or normal controls (mean 15.67 μmol/L, 0.98). The mean value of SCL and CZR of patients in complete remission did not differ significantly from those of normal controls. Patients in stages HI and IV had higher SCL and CZR (mean 25.15 μmol/L, 1.79) than those in stage Ⅰ and Ⅱ (mean 19.30 μmol/L, 1.16). No significant difference in SZL was observed between the patient groups and normal controls. Thus, SCL and CZR may be used as prognostic indicators for monitoring disease activity and response to therapy in malignant lymphoma.

射流电沉积流场变化对铜沉积层的影响

目的探究射流电沉积过程中电镀液流场参数对铜沉积层的微观形貌、粗糙度、定域性和沉积速率的影响。方法以铂丝为阳极、镍板为阴极,电镀液从内置阳极铂丝的喷嘴流出接触镍板阴极,在外加电场作用下铜离子还原形成铜沉积层。通过控制喷嘴形状、长宽比例(1∶1、2∶1、4∶1、6∶1)等来改变射流状态及流场参数。利用激光三维形貌仪、扫描电镜、COMSOL模拟等手段分析流场参数变化对铜沉积层粗糙度、定域性、缺陷的影响规律。结果当喷嘴面积固定时,矩形喷嘴长宽比的变化显著影响铜沉积层的粗糙度、瘤状沉积物、定域性以及内部缺陷。当长宽比为1∶1时,沉积层面粗糙度Sa=5.40μm,定域性差,沉积范围为喷嘴宽度的192%,且瘤状沉积物较多。随着长宽比的减小,表面粗糙度逐渐降低,结构趋于均匀,瘤状沉积物也相应减少,且定域性精度增加。当长宽比为6∶1时,铜沉积层面粗糙度Sa=2.76μm,定域性误差为-1%,瘤状沉积物显著减少。利用截面扫描电镜观察发现,当长宽比为6∶1时,沉积层内部的微裂纹、气孔最少。COMSOL流场模拟了不同长宽比下流场的速度分布,结果与实验一致。结论流场速度分布的均匀性显著影响铜沉积层的表面质量和内部结构。流场流速分布均匀性增加,则沉积层表面粗糙度降低,气泡、瘤状物等减少,且内部致密性增加,微裂纹、微孔洞等沉积缺陷明显减少。

全血铜锌比值与维持性血液透析患者认知功能障碍的关系

目的探讨全血铜锌比值与维持性血液透析(maintenance hemodialysis,MHD)患者认知功能障碍(cognitive impairment,CI)的关系。方法选取2022年3月—2023年9月在徐州医科大学附属淮安医院行MHD治疗的130例患者作为研究对象,收集患者临床资料,根据蒙特利尔认知评估量表(Montreal cognitive assessment,MoCA)评分结果分为CI组(n=55)和认知功能正常组(n=75)。采用电感耦合等离子体质谱法检测患者全血锌、血铜水平。比较2组患者一般资料及实验室资料,分析铜锌比值与MoCA积分的相关性、MHD患者发生CI的独立影响因素以及铜锌比值对MHD患者CI的预测价值。结果CI组患者年龄(t=-6.161,P<0.001)、糖尿病占比(χ^(2)=4.240,P=0.039)、透析龄(Z=-2.131,P=0.033)、超敏C反应蛋白(Z=-2.691,P=0.007)、全血铜(Z=-4.272,P<0.001)、铜锌比值(Z=-5.539,P<0.001)水平高于认知功能正常组,受教育年限(Z=-4.227,P<0.001)、肌酐(t=2.002,P=0.047)、血红蛋白(t=5.948,P<0.001)、白蛋白(Z=-5.519,P<0.001)、全血锌(t=4.872,P<0.001)水平低于认知功能正常组。Spearman相关性分析显示MoCA积分与全血铜锌比值呈负相关(r=-0.509,P<0.001)。多因素Logistic回归分析结果显示铜锌比值(OR=1.449,95%CI:1.017~1.344,P=0.028)、年龄(OR=1.068,95%CI:1.002~1.138,P=0.044)是MHD患者CI的独立危险因素,白蛋白(OR=0.746,95%CI:0.616~0.904,P=0.003)、血红蛋白(OR=0.945,95%CI:0.906~0.987,P=0.011)是CI的独立保护因素。ROC曲线分析显示铜锌比值预测MHD患者发生CI的曲线下面积为0.785(95%CI:0.704~0.866,P<0.001),最佳截断值为0.15,此时敏感度和特异度分别为74.5%、76.0%。结论高全血铜锌比值是MHD患者发生CI的独立危险因素,对MHD患者合并CI有一定的预测价值。

压延率对无氧铜板高温退火的组织及性能影响

高导热AMB陶瓷基板的覆铜厚板性能直接影响基板的电性能和力学性能。通过对无氧铜原料板的加工、微观组织调整以及陶瓷与铜板的活性焊料复合,达到AMB陶瓷覆铜基板最优的组织状态和电学与力学性能。首先对无氧铜板原料进行450℃和650℃再结晶退火0.5 h处理,得到两种原始的铜板组织。其次,对原始铜板进行压延率为15%、30%、45%、60%、75%的压延和800℃/1 h的退火处理,研究了退火铜板的微观组织及力学性能和电学性能。结果表明:当压延率在15%~75%时,随着压延率增加,晶粒逐渐被拉长变成扁平状,再变成纤维状;硬度随着压延率增加逐渐增大,铜板的延伸率逐渐减小,抗拉强度在压延率为15%~60%时逐渐增大,压延率达到75%时出现了小幅度降低。当在800℃退火1 h后,铜板表面晶粒尺寸随着压延率的增加逐渐减小,晶粒分布更加均匀,其大小稳定在400~800μm之间。铜板在压延率为15%~60%时的抗拉强度基本保持不变;当压延率到达75%时,抗拉强度出现小幅度降低。铜板硬度随着压延率增加基本保持不变。当压延率从15%变为75%时,铜板的电阻率有小幅度上升。

CIGS薄膜太阳电池的数值模拟研究

建立了铜铟镓硒(CIGS)薄膜太阳能电池结构模型,利用SCAPS模拟计算得到CIGS薄膜太阳能电池的载流子生成率、能带排列、电场强度等,研究了CIGS薄膜太阳能电池吸收层的Ga组分含量、不同共蒸法制备的电池吸收层缺陷密度、吸收层厚度、掺杂浓度对电池输出性能的影响。结果表明,单步共蒸法制备的电池中CIGS/CdS异质结“尖峰状”的能带排列有利于载流子传输;当Ga组分含量在30%时,太阳能电池的输出性能优异。三步共蒸法制备的电池吸收层缺陷密度进一步降低,可提升电池的输出性能。吸收层厚度为2.0μm厚的电池吸收层即可吸收大部分的光子,继续增加吸收层厚度会导致短路电流密度降低。增大吸收层掺杂浓度,提高了光生电动势、增大了开路电压,但CIGS/CdS异质结界面处势垒下降,载流子复合率上升,导致短路电流密度下降。优化CIGS薄膜太阳能电池参数后,利用SCAPS模拟得到其转换效率达到了27.67%。

面向高深宽比微细嵌入式金属网格结构的选择性镀铜工艺

高深宽比微细嵌入式金属网格结构具有出色的光电性能和机械稳定性,可广泛应用于柔性触摸/显示器、太阳能电池、智能窗户等领域,但是传统的制备方法存在难以形成高深宽比结构、分辨率不足或材料利用率低等问题。借助电流体喷墨打印高分辨率按需喷印的优势结合选择性镀铜的特点实现高深宽比微细嵌入式金属网格的制备。通过实验研究,揭示了镀液温度、铜离子质量浓度、电流密度、电镀时间等参数对铜生长的速率和截面质量的影响规律,并对比了电镀和化学镀的优劣。结果表明,在电流密度约为1.5 A/dm^(2)时,电镀铜15 min能够实现线宽为10μm、深宽比为1的微细凹槽结构内金属铜的完全填充。最后,通过优化后的镀铜工艺参数结合电流体喷印,制备了线宽为10μm、深宽比为1、周期为800μm的28 mm×60 mm的嵌入式金属网格,其透过率(可见光波段550 nm处)为87.3%,方阻约为0.26Ω/□,品质因数(FOM)达到10 318,达到行业较高水准,可为高性能柔性光电子器件的制备提供新途径。

新型高纵横比通孔镀铜整平剂研究

印制电路板是电子工业的重要部件之一,广泛地应用在社会生活的方方面面。随着电子信息技术的发展,电子产品与设备不断轻薄化、小型化、集成化。作为电子元器件的载体,电路板设计和制造也朝着高密度互连、小孔化技术的方向快速发展。通孔作为连接层与层之间的导通孔,逐渐成为实现层间互连的核心技术。但是高厚径比通孔的电镀工艺往往存在电流密度分布不均、孔内镀液传质不佳等现象,导致镀层均匀性及铜层结晶质量变差现象产生,无法满足客户端的需求。如何解决高厚径比的微通孔镀铜是电镀领域的一个技术难题,具有重要研究意义及实际应用价值。整平剂是镀铜整平剂体系中很重要的物质,其含量较低,对孔内的低电流密度区域影响不大。目前针对高厚径比通孔电镀整平剂研究较少,且市面上使用较为广泛的镀铜整平剂被国外大公司垄断。因此,急需研发一种高厚径比通孔电镀方法,有效改善线路板表面与孔内镀层均匀性,提升通孔深镀能力,从而打破技术垄断,突破“卡脖子”难题,促进我国印制电路板产业的发展。

An Analysis of Contemporary Copper Recycling in China

Copper consumption increased very quickly in China in recent years,which could not be met by inland copper industry.In order to achieve a sustainable development of copper industry,an analysis of copper recycling in China was necessary.For the life cycle of copper products a copper-flow diagram with time factor was worked out and the contemporary copper recycling in China was analyzed,from which the following data were obtained.The average life cycle of copper products was 30 years.From 1998 to 2002,the use ratio of copper scraps in copper production,the use ratio of copper scraps in copper manufacture,the materials self-support ratio in copper production,and the materials self-support ratio in copper manufacture were 26.50%,15.49%,48.05% and 59.41%,respectively.The materials self-support ratios in copper production and manufacture declined year by year in recent years on the whole,and the latter dropped more quickly.The average index of copper ore and copper scrap from 1998 to 2002 were 0.8475 t/t and 0.0736 t/t,respectively;and copper resource efficiency was 1.1855 t/t.Some efforts should be paid to reduce copper ores consumption and promote copper scraps regeneration.Copper scraps were mostly imported from foreign countries because of shortage in recent years in China.Here the reasons related to copper scraps deficiency were also demonstrated.But we can forecast:when copper production was in a slow rise or in a steady state in China,the deficiency of copper scraps may be mitigated;when copper production was in a steady state for a very long time,copper scraps may become relatively abundant.According to the status of copper industry in China,the raw materials of copper production and manufacture have to depend on oversea markets heavily in recent years,and at the same time,the copper scraps using proportion and efficiency in copper industry should be improved.

Rule of Structural Factors in Formation of Porphyry Copper Deposits in South Western Part of Kerman Area, Iran

Kerman area is located in southern parts of central Iranian volcanic belt. The area under study is located in the southern part of this complex copper mineralization in the area, which is mainly porphyry type and is associated with extensive hydrothermal alteration. This area has a great potential as far as tertiary porphyry copper deposits are concerned. To the exploration of porphyry copper deposits in study area, we have analyzed the lineaments. The lineaments interpreted out from ETM + (band8) data is recognized as another method for locating porphyry type copper mineralization. There is a close correlation between photo lineament factor values and the known copper mineralization in the area. The relationship between 16 porphyry copper deposits with faults and fractures in the area is studied. Photo lineament factor assessments by using satellite photos indicate a strong relationship between a number of lineation intersection in each cell refer to an amount of average lineation in whole map (c/C ratio). In the study area, ratio of c/C even has more relationship refers to PF factor that has previously described in the papers.

Bioleaching of low-grade copper sulphides

The bioleaching behavior of low-grade copper sulphides under the condition of preferential solution flow was investigated through experiments. The experiment of bioleaching was conducted within the multifunction autocontrol bioleaching apparatus. The results show that the concentrations of Cu2+ and total Fe increase slowly at the beginning. The recovery rate decreases with the increase of depth of dump. The preferential solution happens within the fine region when the application rate is low, and the recovery rate of the fine region is higher than that of the coarse region. The content of fine ore particles within both fine and coarse regions increases during the leaching period, and the preferential solution flow shifts from fine region to coarse region. The surface of the ores at the top of dump is attacked seriously, and the ores in the middle is attacked slightly. There are plenty of crackles on the surface of bottom ores because of the precipitation layer on the surface.

基于斜率比法评定断奶仔猪对不同铜源的相对生物学利用率

本试验旨在研究不同铜源(硫酸铜、碱式氯化铜和柠檬酸铜)和铜添加水平(20和30 mg/kg)对断奶仔猪生长性能、血清铜含量与含铜酶活性以及组织铜含量的影响,探讨断奶仔猪对不同铜源的相对生物学利用率。试验采用3×2双因子随机区组设计,选取平均体重为(8.98±0.48)kg的杜×长×大三元杂交断奶仔猪112头,随机分为7组,每组4个重复,每个重复4头猪。对照组饲喂玉米-豆粕型基础饲粮(铜含量为7.80 mg/kg),各试验组分别在基础饲粮中添加20或30 mg/kg硫酸铜、碱式氯化铜或柠檬酸铜(均以铜含量计)。试验预试期3 d,正试期28 d。结果表明:1)试验组与对照组断奶仔猪平均日增重、平均日采食量和料重比均无显著差异(P>0.05)。2)饲粮铜源和铜添加水平对断奶仔猪血清铜含量具有显著影响(P<0.05),但对血清铜蓝蛋白和铜锌超氧化物歧化酶活性均无显著影响(P>0.05)。3)饲粮铜源和铜添加水平对断奶仔猪肝脏铜含量具有显著影响(P<0.05),但对心脏、肾脏、胰脏和跖骨铜含量均无显著影响(P>0.05)。4)根据多元线性回归斜率比法计算,以血清铜含量为评价指标,碱式氯化铜和柠檬酸铜相对于硫酸铜(100%)的生物学利用率分别为110.39%和120.78%;以肝脏铜含量为评价指标,碱式氯化铜和柠檬酸铜相对于硫酸铜(100%)的生物学利用率分别为119.39%和136.09%。综上所述,本试验条件下,断奶仔猪对低铜饲粮(铜添加水平为20或30 mg/kg)中3种铜源的相对生物学利用率表现为柠檬酸铜>碱式氯化铜>硫酸铜。

Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides

Copper thin films were deposited by plasma-enhanced atomic layer deposition at low temperature, using copper（I）-N,N′-di-sec-butylacetamidinate as a precursor and hydrogen as a reductive gas. The influence of temperature, plasma power, mode of plasma, and pulse time, on the deposition rate of copper thin film, the purity of the film and the step coverage were studied.The feasibility of copper film deposition on the inner wall of a carbon fibre reinforced plastic waveguide with high aspect ratio was also studied. The morphology and composition of the thin film were studied by atomic force microscopy and x-ray photoelectron spectroscopy,respectively. The square resistance of the thin film was also tested by a four-probe technique. On the basis of on-line diagnosis, a growth mechanism of copper thin film was put forward, and it was considered that surface functional group played an important role in the process of nucleation and in determining the properties of thin films. A high density of plasma and high free-radical content were helpful for the deposition of copper thin films.

Lithogeochemistry of Intrusive Rocks in the Halo Porphyry Copper-Molybdenum Prospect, Northeast Cambodia

The Halo copper-molybdenum prospect is a porphyry system in Ratanakiri province, northeastern part of Cambodia. There is only one research was carried out on this prospect about geological mapping and short wave infrared (SWIR) spectroscopy on alteration mineral identification. The purpose of this research is to confirm the deposit type from previous Angkor Gold’s report and find the centre of porphyry deposit based on characteristic of intrusive rocks at surface and subsurface, characteristics of the intrusive rocks and alteration lithogeochemistry of intrusive and volcanic rocks by using Pearce Element Ratio (PER) analysis. PER analysis was used to examine the nature and extend of the alteration halos in the porphyry Halo copper-molybdenum prospect. The intrusive rocks and volcanic rocks in Halo, range from diorite to granite (quartz feldspar porphyry) in composition as well as dacite to trachyandesite (andesite porphyry) in composition, respectively. They were formed in a subduction-related tectonic setting, likely a volcanic arc. Trace elements spider diagrams were normalized to primitive mantle display strong enrichment in large-ion lithophile elements such as Rb, Ba and K and depletion in some high-field strength elements such as Nb and Ti, suggesting magmas generated in a subduction-related tectonic setting. PER analysis indicates a moderate to high degree of sericite alteration of dacites, quartz feldspar porphyries, andesite porphyries and granodiorite porphyries. Moreover, three alterations in the Halo prospect such as potassic (secondary K-feldspar and biotite), phyllic (sericite) and propylitic (epidote) alteration were identified, which are consistent with petrography analysis. The potassic alteration zone is vectoring center of the hydrothermal system which may represent the locus of mineralization. Therefore the geochemical signature of potassic alteration within the quartz feldspar porphyry, andesite porphyry and granodiorite porphyry with high grad of copper ranges up to 2670 ppm and molybdenum ranges up to 5297 ppm represents a character for further exploration in the Halo porphyry copper-molybdenum prospect.

X射线分选技术在某硫化铜矿的应用研究

某硫化铜矿含Cu约0.8%,采用X射线分选技术预选粗碎后≥30 mm的铜矿石,抛废率27%,抛出废石含Cu 0.09%,预选作业回收率96.95%。预选后入选品位提高0.2个百分点、选比由29.85 t/t降至22.68 t/t。年采出规模30万t铜矿,粗碎后≥30 mm预选,年创效339.7万元。

Efficient Degradation 4-Nitrophenol by Photocatalysis from Modified TiO_2 Doped Copper

In the present study,a film consisting of TiO_2 doped with copper was prepared for efficiently decomposing 4-nitrophenol(4-NP) by photocatalysis.The preparing process of TiO_2 doped with copper includes two procedures:preparing Ti(OH)_4 doped with copper and synthesizing anatase and rutile TiO_2 doped with copper.Ti(OH)_4 doped with copper could be achieved by hydrolyzing TiCl_4in the mixed solution containing deionized water and copper oxalate.The Ti(OH)_4 doped with copper can be gained successfully by the following procedures:rinsing,drying and vacuum drying.The Ti(OH)_4 doped with copper could be converted into anatase TiO_2 doped with copper and rutile TiO_2 doped with copper by incineration for 4.5 h at 723 and 1 073 K,respectively.Characterizations of anatase TiO_2 doped with copper and rutile TiO_2 doped with copper were determined by X-ray diffraction(XRD) and energy dispersion of X-ray(EDX).Anatase and rutile TiO_2 doped with copper were dissolved in a mixed solution containing isopropanol and diethylamine.Stainless electrode was submerged into with the solutions,the film of TiO_2 was formed by drying the thin layer at a ramp rate of 3℃/min until 373 K,and this temperature was held for 1 h.The temperature of the oven was subsequently increased to a final temperature of 823 K at a ramp rate of 3℃/min,and was held at this value for 1 h.The stainless steel covered with modified TiO_2 film was utilized as the anode.The stainless steel mesh was used as the cathode.The cathode and anode were connected with the source and immersed into the solution with 100 mg/L 4-NP.The whole reaction on photocatalysis was perfectly carried out after ultraviolet radiation and aerator were run.The experimental results showed that:cracking ratio of 4-NP ring,the removal ratio of chemical oxygen demand(COD) and total organic carbon(TOC) were respectively more than 90%,80% and 80% within 2 h.Degradation of 4-NP implied its potential application in associated wastewater.

基于磨矿动力学某铜矿磨矿介质配比优化试验研究

针对云南某铜矿磨矿介质配比m(Φ80)∶m(Φ60)=50∶50与球磨机给矿力学性质及粒度不匹配,导致磨矿细度及中间易选粒级产率偏低等问题,基于磨矿动力学原理可得到磨矿介质推荐配比m(Φ70)∶m(Φ60)∶m(Φ50)∶m(Φ40)=15∶30∶10∶45。对比试验结果表明,推荐配比与现场配比相比,磨矿前期(4 min),+0.3 mm粒级物料产率提高1.01百分点,0.3~0.074 mm粒级产率降低7.88百分点;磨矿细度(-0.074 mm)在12 min时达到79.85%,且中间易选粒级与过粉碎粒级产率分别提高3.44、1.79百分点。最终推荐选厂选择基于磨矿动力学原理所得介质配比m(Φ70)∶m(Φ60)∶m(Φ50)∶m(Φ40)=15∶30∶10∶45。

铜矿渣用于地铁防水的研究进展

通过总结国内外有关铜渣、铜渣混凝土的资料,并对其进行综述,思考如何充分利用铜渣混凝土的力学性能和耐久性,如在掺入铜矿渣会降低混凝土的早期强度时,提出改变水灰比、降低掺量等方法来缓解不良影响。

微反应器共沉淀反应制备铜锰催化剂

在Caterpillar微反应器中采用共沉淀法制备了不同铜锰比的共沉淀物,直接焙烧得到铜锰复合氧化物催化剂。采用X射线衍射(XRD)、热重分析(TG)、拉曼光谱(Raman)和X射线光电子能谱(XPS)对沉淀物和催化剂进行了物相和结构分析。结果显示,随着Cu含量的增加,催化剂中Mn3+所占比例逐渐下降,表面晶格氧含量呈现先上升后下降的趋势,催化甲苯降解的活性呈现先上升后下降的规律。微反应器中的流动反应特性使得催化剂中的Cu、Mn保持良好分散性,有利于提高催化剂中Mn3+含量,此时表面晶格氧成为催化活性的制约因素。

智能手机辅助铜纳米团簇比率荧光探针检测四环素

稀土离子Eu^(3+)结合EW-Cu NCs设计双发射荧光探针,由于四环素(Tc)与EW-Cu NCs之间的内滤效应,EW-Cu NCs的荧光被猝灭,同时Tc与Eu^(3+)之间的天线效应(AEE)使得Eu^(3+)的荧光得到增强,基于此,通过探针的荧光双响应模式对Tc进行定量检测,在0.25~72.50μmol/L浓度范围内,对Tc的响应有良好的线性关系,检测限为80 nmol/L.同时根据检测过程中溶液荧光颜色的变化(由绿到红),利用智能手机进行比色法分析,颜色信号比值R/B与Tc浓度在2.5~45.0μmol/L范围内有良好的线性关系.该方法成功用于实际样品牛奶中Tc的检测,并获得满意的回收率,表明EW-Cu NCs具有较高的实际应用价值.

铜、锌离子浓度比对羟基乙叉二膦酸体系电镀黄铜的影响

以羟基乙叉二膦酸(HEDP)为配位剂进行电镀黄铜(Cu–Zn合金),通过阴极极化测试、循环伏安分析、扫描电镜(SEM)观察、X射线衍射(XRD)等手段研究了Cu^(2+)/Zn^(2+)浓度比对电沉积过程及镀层微观结构的影响。结果表明,HEDP体系中Cu–Zn合金电沉积的电位介于Cu和Zn之间。随Cu^(2+)/Zn^(2+)浓度比减小,Cu–Zn合金的初始沉积电位正移,共沉积得到促进,镀层的Zn质量分数增大。Cu^(2+)/Zn^(2+)浓度比为1:4时所得Cu–Zn合金镀层为金黄色,微观上呈均匀分布的胞状结构,镀层中Cu的质量分数在65%~70%之间,与氰化物电镀黄铜的组成最接近。