Fabrication of superhydrophilic surface on copper substrate by electrochemical deposition and sintering process

Superhydrophilic surfaces were fabricated on copper substrates by an electrochemical deposition and sintering process. Superhydrophobic surfaces were prepared by constructing micro/nano-structure on copper substrates through an electrochemical deposition method. Conversion from superhydrophobic to superhydrophilic was obtained via a suitable sintering process. After reduction sintering, the contact angle of the superhydrophilic surfaces changed from 155° to 0°. The scanning electron microscope （SEM） images show that the morphology of superhydrophobic and superhydrophilic surfaces looks like corals and cells respectively. The chemical composition and crystal structure of these surfaces were examined using energy dispersive spectrometry （EDS） and X-ray diffraction （XRD）. The results show that the main components on superhydrophobic surfaces are Cu, Cu2O and CuO, while the superhydrophilic surfaces are composed of Cu merely. The crystal structure is more inerratic and the grain size becomes bigger after the sintering. The interracial strength of the superhydrophilic surfaces was investigated, showing that the interfacial strength between superhydrophilic layer and copper substrate is considerably high.

Effect of sintering on the relative density of Cr-coated diamond/Cu composites prepared by spark plasma sintering

Cr-coated diamond/Cu composites were prepared by spark plasma sintering. The effects of sintering pressure, sintering temperature, sintering duration, and Cu powder particle size on the relative density and thermal conductivity of the composites were investigated in this paper. The influence of these parameters on the properties and microstructures of the composites was also discussed. The results show that the relative density of Cr-coated diamond/Cu reaches ~100% when the composite is gradually compressed to 30 MPa during the heating process. The densification temperature increases from 880 to 915℃ when the diamond content is increased from 45vol% to 60vol%. The densification temperature does not increase further when the content reaches 65vol%. Cu powder particles in larger size are beneficial for increasing the relative density of the composite.

Microstructure and Mechanical Performance of Cu-SnO_2-rGO based Composites Prepared by Plasma Activated Sintering

A novel chemical technique combined with unique plasma activated sintering（PAS） was utilized to prepare consolidated copper matrix composites（CMCs） by adding Cu-SnO2-rGO layered micro powders as reinforced fillers into Cu matrix. The repeating Cu-SnO2-rGO structure was composed of inner dispersed reduced graphene oxide（r GO）, SnO2 as intermedia and outer Cu coating. SnO2 was introduced to the surface of rGO sheets in order to prevent the graphene aggregation with SnO2 serving as spacer and to provide enough active sites for subsequent Cu deposition. This process can guarantee rGO sheets to suffi ciently disperse and Cu nanoparticles to tightly and uniformly anchor on each layer of rGO by means of the SnO2 active sites as well as strictly control the reduction speed of Cu^2＋. The complete cover of Cu nanoparticles on rGO sheets thoroughly avoids direct contact among rGO layers. Hence, the repeating structure can simultaneously solve the wettability problem between rGO and Cu matrix as well as improve the bonding strength between rGO and Cu matrix at the well-bonded Cu-SnO2-rGO interface. The isolated rGO can effectively hinder the glide of dislocation at Cu-rGO interface and support the applied loads. Finally, the compressive strength of CMCs was enhanced when the strengthening effi ciency reached up to 41.

Microstructure and properties of Al_2O_3 dispersion-strengthened copper fabricated by reactive synthesis process

Al2O3 dispersion-strengthened copper alloy was prepared by reactive synthesis and spark plasma sintering（SPS） process. Studies show that nano-sized c-Al2O3 particles with 27.4 nm mean size and 50-nm interval are homogeneously distributed in copper matrix. The density of SPS alloy is about 99 %, meanwhile, the electrical conductivity of sintered alloy is 72 % IACS and the Rockwell hardness can reach to HRB 91.

Transient performance and intelligent combination control of a novel spray cooling loop system

Effective thermal control systems are essential for the reliable working of insulated gate bipolar transistors （IGBTs） in many applications. A novel spray cooling loop system with integrated sintered porous copper wick （SCLS-SPC） is proposed to meet the requirements of higher device level heat fluxes and the harsh environments in some applications such as hybrid, fuel cell vehicles and aerospace. Fuzzy logic and proportional-integral-derivative （PID） policies are applied to adjust the electronic temperature within a safe working range. To evaluate the thermal control effect, a mathematical model of a 4-node thermal network and pump are established for predicting the dynamics of the SCLS-SPC. Moreover, the transient response of the 4 nodes and vapor mass flowrate under no control, PID and Fuzzy-PID are numerically investigated and discussed in detail.