DBC substrates are the standard circuit boardsfor power modules. Using the DBC technologythick copper foils (0.125mm - 0.Tmm) arecladded to Alumina or Aluminum Nitride,The strong adhesion of the copper to ceramicbond ...DBC substrates are the standard circuit boardsfor power modules. Using the DBC technologythick copper foils (0.125mm - 0.Tmm) arecladded to Alumina or Aluminum Nitride,The strong adhesion of the copper to ceramicbond reduces the thermal expansion coefficientin horizontal direction only slightly above theTEC of the ceramic itself. This allows directsilicon attach of large dies without using TECcontrolling layers.As DBC technology is using copper foils,integralleads overhanging the ceramic can be realized...展开更多
The different copper coatings with thickness varying from 0.3μm to 1.5μm were deposited on carbon fibers using either electroless plating or electroplating method. The coated fibers were chopped and composites were ...The different copper coatings with thickness varying from 0.3μm to 1.5μm were deposited on carbon fibers using either electroless plating or electroplating method. The coated fibers were chopped and composites were fabricated with melting aluminum at 700℃. The effect of the copper layer on the microstructure in the system was discussed. The results show that the copper layer has fully reacted with aluminum matrix, and the intermetallic compound CuAl2 forms through SEM observation and XRD, EDX analysis. The results of tensile tests indicate that composites fabricated using carbon fibers with 0.7-1.1μm copper coating perform best and the composites turn to more brittle as the thickness of copper coating increases. The fracture surface observation exhibits good interface bonding and ductility of the matrix alloy when the thickness of copper coating is about 0.7-1.1μm.展开更多
文摘DBC substrates are the standard circuit boardsfor power modules. Using the DBC technologythick copper foils (0.125mm - 0.Tmm) arecladded to Alumina or Aluminum Nitride,The strong adhesion of the copper to ceramicbond reduces the thermal expansion coefficientin horizontal direction only slightly above theTEC of the ceramic itself. This allows directsilicon attach of large dies without using TECcontrolling layers.As DBC technology is using copper foils,integralleads overhanging the ceramic can be realized...
基金Project(204AA335010) supported by the National High-Tech Research and Development Program of China
文摘The different copper coatings with thickness varying from 0.3μm to 1.5μm were deposited on carbon fibers using either electroless plating or electroplating method. The coated fibers were chopped and composites were fabricated with melting aluminum at 700℃. The effect of the copper layer on the microstructure in the system was discussed. The results show that the copper layer has fully reacted with aluminum matrix, and the intermetallic compound CuAl2 forms through SEM observation and XRD, EDX analysis. The results of tensile tests indicate that composites fabricated using carbon fibers with 0.7-1.1μm copper coating perform best and the composites turn to more brittle as the thickness of copper coating increases. The fracture surface observation exhibits good interface bonding and ductility of the matrix alloy when the thickness of copper coating is about 0.7-1.1μm.
