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Potential-dependent insights into the origin of high ammonia yield rate on copper surface via nitrate reduction:A computational and experimental study
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作者 Yangge Guo Nannan Sun +5 位作者 Liuxuan Luo Xiaojing Cheng Xueying Chen Xiaohui Yan Shuiyun Shen Junliang Zhang 《Journal of Energy Chemistry》 SCIE EI CAS 2024年第9期272-281,共10页
Focusing on revealing the origin of high ammonia yield rate on Cu via nitrate reduction(NO3RR),we herein applied constant potential method via grand-canonical density functional theory(GC-DFT)with implicit continuum s... Focusing on revealing the origin of high ammonia yield rate on Cu via nitrate reduction(NO3RR),we herein applied constant potential method via grand-canonical density functional theory(GC-DFT)with implicit continuum solvation model to predict the reaction energetics of NO3RR on pure copper surface in alkaline media.The potential-dependent mechanism on the most prevailing Cu(111)and the minor(100)and(110)facets were established,in consideration of NO_(2)_(−),NO,NH_(3),NH_(2)OH,N_(2),and N_(2)O as the main products.The computational results show that the major Cu(111)is the ideal surface to produce ammonia with the highest onset potential at 0.06 V(until−0.37 V)and the highest optimal potential at−0.31 V for ammonia production without kinetic obstacles in activation energies at critical steps.For other minor facets,the secondary Cu(100)shows activity to ammonia from−0.03 to−0.54 V with the ideal potential at−0.50 V,which requires larger overpotential to overcome kinetic activation energy barriers.The least Cu(110)possesses the longest potential range for ammonia yield from−0.27 to−1.12 V due to the higher adsorption coverage of nitrate,but also with higher tendency to generate di-nitrogen species.Experimental evaluations on commercial Cu/C electrocatalyst validated the accuracy of our proposed mechanism.The most influential(111)surface with highest percentage in electrocatalyst determined the trend of ammonia production.In specific,the onset potential of ammonia production at 0.1 V and emergence of yield rate peak at−0.3 V in experiments precisely located in the predicted potentials on Cu(111).Four critical factors for the high ammonia yield and selectivity on Cu surface via NO3RR are summarized,including high NO3RR activity towards ammonia on the dominant Cu(111)facet,more possibilities to produce ammonia along different pathways on each facet,excellent ability for HER inhibition and suitable surface size to suppress di-nitrogen species formation at high nitrate coverage.Overall,our work provides comprehensive potential-dependent insights into the reaction details of NO3RR to ammonia,which can serve as references for the future development of NO3RR electrocatalysts,achieving higher activity and selectivity by maximizing these characteristics of copper-based materials. 展开更多
关键词 Nitrate reduction to ammonia copper surface Density functional theory Constant electrode potential method Experimental validation
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Surface segregation of copper in antibacterial ferritic stainless steel 被引量:2
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作者 Zhang Zhixia Lin Gang Jiang Laizhu 《Baosteel Technical Research》 CAS 2008年第2期55-59,共5页
By using auger electron spectroscopy (AES) and diffusion theory to analyze the surface segregation of copper in antibacterial ferritic stainless steel, establishing a diffusion model, and calculating the activation ... By using auger electron spectroscopy (AES) and diffusion theory to analyze the surface segregation of copper in antibacterial ferritic stainless steel, establishing a diffusion model, and calculating the activation energy of diffusion of the copper in ferrite, the affect of surface segregation on the antibacterial capabilities were researched. The results show that the concentration of the copper surface at 973 K and 1 073 K could be expressed asln X^sCu/X^bCu = k0 √Dt/d(-△Hv^Cu+△Hf^tron+ △Hs^Cu)/3RT , with the parameters relating to the concentration of the diffusion layer, the coefficient of diffusion, the length of diffusion, the latent heat of evaporation and the latent heat of fusion. The activation energy of diffusion of copper in ferrite is approximately 221. 688 kJ/mol. The antibacterial property of the steel is improved as the surface segregation of the copper is increased. At 1 073 K for 60 min, the concentration of the surface copper is over three times higher than the basic concentration. The antibacterial property of the stainless steel can reach approximately 99.9%. 展开更多
关键词 ferritic antibacterial stainless steel copper surface segregation DIFFUSION AES
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Ultra fast microwave-assisted leaching for the recovery of copper and tellurium from copper anode slime 被引量:11
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作者 Zhi-yuan Ma Hong-ying Yang +2 位作者 Song-tao Huang Yang Lü Liu Xiong 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 2015年第6期582-588,共7页
The decomposition of copper anode slime heated by microwave energy in a sulfuric acid medium was investigated. Leaching experiments were carried out in a multi-mode cavity with microwave assistance. The leaching proce... The decomposition of copper anode slime heated by microwave energy in a sulfuric acid medium was investigated. Leaching experiments were carried out in a multi-mode cavity with microwave assistance. The leaching process parameters were optimized using response surface methodology(RSM). Under the optimized conditions, the leaching efficiencies of copper and tellurium were 99.56% ± 0.16% and 98.68% ± 0.12%, respectively. Meanwhile, a conventional leaching experiment was performed in order to evaluate the influence of microwave radiation. The mechanism of microwave-assisted leaching of copper anode slime was also investigated. In the results, the microwave technology is demonstrated to have a great potential to improve the leaching efficiency and reduce the leaching time. The enhanced recoveries of copper and tellurium are believed to result from the presence of a temperature gradient due to the shallow microwave penetration depth and the superheating at the solid-liquid interface. 展开更多
关键词 copper anode slime leaching microwave heating sulfuric acid response surface experiments
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Corrosion property of copperized layer on Zr formed by double glow plasma surface alloying technique
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作者 Jian-Qing Wang Hong-Bo Yang +3 位作者 Bing Zhang Han-Long Lin Bao Chen Qin Jing 《Rare Metals》 SCIE EI CAS CSCD 2016年第9期711-717,共7页
Zr and its alloys have excellent mechanical properties as new structural material,but in specific application environment,its corrosion resistance still needs to be further explored.In this work,double glow plasma sur... Zr and its alloys have excellent mechanical properties as new structural material,but in specific application environment,its corrosion resistance still needs to be further explored.In this work,double glow plasma surface alloying technique was used for copperizing on pure Zr surface.Besides,X-ray diffraction(XRD),scanning electron microscope(SEM) and energy dispersion spectrum(EDS) were employed to characterize the samples.Furthermore,research was also conducted on the polarization curve of the samples in different solutions.Copperizing on surface can improve corrosion resistance of pure Zr in 3.5 % Na Cl and 0.5 moláL-1Na OH solutions.Especially in 0.5 moláL-1Na OH solution,the corrosion resistance can achieve significant improvement.However,copperizing has no influence on the improvement of corrosion resistance of pure Zr in 0.5 moláL-1H2SO4 solution.The results may provide new insight into way for improving the corrosion property of zirconium alloys. 展开更多
关键词 Zr Double glow plasma surface alloying technique copperizing Polarization curve Corrosion resistance
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Interaction between Cu^(2+) and different types of surface-modified nanoscale zero-valent iron during their transport in porous media 被引量:3
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作者 Haoran Dong Guangming Zeng +5 位作者 Chang Zhang Jie Liang Kito Ahmad Piao Xu Xiaoxiao He Mingyong Lai 《Journal of Environmental Sciences》 SCIE EI CAS CSCD 2015年第6期180-188,共9页
This study investigated the interaction between Cu^2+and nano zero-valent iron(NZVI)coated with three types of stabilizers(i.e., polyacrylic acid [PAA], Tween-20 and starch) by examining the Cu^2+ uptake, coll... This study investigated the interaction between Cu^2+and nano zero-valent iron(NZVI)coated with three types of stabilizers(i.e., polyacrylic acid [PAA], Tween-20 and starch) by examining the Cu^2+ uptake, colloidal stability and mobility of surface-modified NZVI(SM-NZVI) in the presence of Cu^2+. The uptake of Cu^2+ by SM-NZVI and the colloidal stability of the Cu-bearing SM-NZVI were examined in batch tests. The results showed that NZVI coated with different modifiers exhibited different affinities for Cu^2+, which resulted in varying colloidal stability of different SM-NZVI in the presence of Cu^2+. The presence of Cu^2+ exerted a slight influence on the aggregation and settling of NZVI modified with PAA or Tween-20. However, the presence of Cu^2+caused significant aggregation and sedimentation of starch-modified NZVI, which is due to Cu^2+complexation with the starch molecules coated on the surface of the particles. Column experiments were conducted to investigate the co-transport of Cu^2+ in association with SM-NZVI in water-saturated quartz sand. It was presumed that a physical straining mechanism accounted for the retention of Cu-bearing SM-NZVI in the porous media. Moreover, the enhanced aggregation of SM-NZVI in the presence of Cu^2+ may be contributing to this straining effect. 展开更多
关键词 copper ion Colloidal stability Co-transport Nanoscale zero valent iron surface modification
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Effect of H_2O_2 and nonionic surfactant in alkaline copper slurry 被引量:2
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作者 袁浩博 刘玉岭 +3 位作者 蒋勐婷 陈国栋 刘伟娟 王胜利 《Journal of Semiconductors》 EI CAS CSCD 2015年第1期163-167,共5页
For improving the polishing performance, in this article, the roles of a nonionic surfactant(Fatty alcohol polyoxyethylene ether) and H2O2 were investigated in the chemical mechanical planarization process, respecti... For improving the polishing performance, in this article, the roles of a nonionic surfactant(Fatty alcohol polyoxyethylene ether) and H2O2 were investigated in the chemical mechanical planarization process, respectively.Firstly, the effects of the nonionic surfactant on the within-wafer non-uniformity(WIWNU) and the surface roughness were mainly analyzed. In addition, the passivation ability of the slurry, which had no addition of BTA, was also discussed from the viewpoint of the static etch rate, electrochemical curve and residual step height under different concentrations of H2O2. The experimental results distinctly revealed that the nonionic surfactant introduced in the slurry improved the WIWNU and surface roughness, and that a 2 vol% was considered as an appropriate concentration relatively. When the concentration of H2O2 surpasses 3 vol%, the slurry will possess a relatively preferable passivation ability, which can effectively decrease the step height and contribute to acquiring a flat and smooth surface. Hence, based on the result of these experiments, the influences of the nonionic surfactant and H2O2 are further understood, which means the properties of slurry can be improved. 展开更多
关键词 copper CMP nonionic surfactant within wafer non-uniformity surface roughness electrochemical curve step height
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