Potential-dependent insights into the origin of high ammonia yield rate on copper surface via nitrate reduction:A computational and experimental study

Focusing on revealing the origin of high ammonia yield rate on Cu via nitrate reduction(NO3RR),we herein applied constant potential method via grand-canonical density functional theory(GC-DFT)with implicit continuum solvation model to predict the reaction energetics of NO3RR on pure copper surface in alkaline media.The potential-dependent mechanism on the most prevailing Cu(111)and the minor(100)and(110)facets were established,in consideration of NO_(2)_(−),NO,NH_(3),NH_(2)OH,N_(2),and N_(2)O as the main products.The computational results show that the major Cu(111)is the ideal surface to produce ammonia with the highest onset potential at 0.06 V(until−0.37 V)and the highest optimal potential at−0.31 V for ammonia production without kinetic obstacles in activation energies at critical steps.For other minor facets,the secondary Cu(100)shows activity to ammonia from−0.03 to−0.54 V with the ideal potential at−0.50 V,which requires larger overpotential to overcome kinetic activation energy barriers.The least Cu(110)possesses the longest potential range for ammonia yield from−0.27 to−1.12 V due to the higher adsorption coverage of nitrate,but also with higher tendency to generate di-nitrogen species.Experimental evaluations on commercial Cu/C electrocatalyst validated the accuracy of our proposed mechanism.The most influential(111)surface with highest percentage in electrocatalyst determined the trend of ammonia production.In specific,the onset potential of ammonia production at 0.1 V and emergence of yield rate peak at−0.3 V in experiments precisely located in the predicted potentials on Cu(111).Four critical factors for the high ammonia yield and selectivity on Cu surface via NO3RR are summarized,including high NO3RR activity towards ammonia on the dominant Cu(111)facet,more possibilities to produce ammonia along different pathways on each facet,excellent ability for HER inhibition and suitable surface size to suppress di-nitrogen species formation at high nitrate coverage.Overall,our work provides comprehensive potential-dependent insights into the reaction details of NO3RR to ammonia,which can serve as references for the future development of NO3RR electrocatalysts,achieving higher activity and selectivity by maximizing these characteristics of copper-based materials.

Surface segregation of copper in antibacterial ferritic stainless steel

By using auger electron spectroscopy （AES） and diffusion theory to analyze the surface segregation of copper in antibacterial ferritic stainless steel, establishing a diffusion model, and calculating the activation energy of diffusion of the copper in ferrite, the affect of surface segregation on the antibacterial capabilities were researched. The results show that the concentration of the copper surface at 973 K and 1 073 K could be expressed asln X^sCu/X^bCu = k0 √Dt/d（-△Hv^Cu＋△Hf^tron＋ △Hs^Cu）/3RT , with the parameters relating to the concentration of the diffusion layer, the coefficient of diffusion, the length of diffusion, the latent heat of evaporation and the latent heat of fusion. The activation energy of diffusion of copper in ferrite is approximately 221. 688 kJ/mol. The antibacterial property of the steel is improved as the surface segregation of the copper is increased. At 1 073 K for 60 min, the concentration of the surface copper is over three times higher than the basic concentration. The antibacterial property of the stainless steel can reach approximately 99.9%.

Ultra fast microwave-assisted leaching for the recovery of copper and tellurium from copper anode slime

The decomposition of copper anode slime heated by microwave energy in a sulfuric acid medium was investigated. Leaching experiments were carried out in a multi-mode cavity with microwave assistance. The leaching process parameters were optimized using response surface methodology（RSM）. Under the optimized conditions, the leaching efficiencies of copper and tellurium were 99.56% ± 0.16% and 98.68% ± 0.12%, respectively. Meanwhile, a conventional leaching experiment was performed in order to evaluate the influence of microwave radiation. The mechanism of microwave-assisted leaching of copper anode slime was also investigated. In the results, the microwave technology is demonstrated to have a great potential to improve the leaching efficiency and reduce the leaching time. The enhanced recoveries of copper and tellurium are believed to result from the presence of a temperature gradient due to the shallow microwave penetration depth and the superheating at the solid-liquid interface.

Fabrication of superhydrophilic surface on copper substrate by electrochemical deposition and sintering process

Superhydrophilic surfaces were fabricated on copper substrates by an electrochemical deposition and sintering process. Superhydrophobic surfaces were prepared by constructing micro/nano-structure on copper substrates through an electrochemical deposition method. Conversion from superhydrophobic to superhydrophilic was obtained via a suitable sintering process. After reduction sintering, the contact angle of the superhydrophilic surfaces changed from 155° to 0°. The scanning electron microscope （SEM） images show that the morphology of superhydrophobic and superhydrophilic surfaces looks like corals and cells respectively. The chemical composition and crystal structure of these surfaces were examined using energy dispersive spectrometry （EDS） and X-ray diffraction （XRD）. The results show that the main components on superhydrophobic surfaces are Cu, Cu2O and CuO, while the superhydrophilic surfaces are composed of Cu merely. The crystal structure is more inerratic and the grain size becomes bigger after the sintering. The interracial strength of the superhydrophilic surfaces was investigated, showing that the interfacial strength between superhydrophilic layer and copper substrate is considerably high.

Automated visual inspection of surface defects based on compound moment invariants and support vector machine

The traditional inspection methods are mostly based on manual inspection which is very likely to make erroneous judgments due to personal subjectivity or eye fatigue, and can＇t satisfy the accuracy. To overcome these difficulties, we develop a machine vision inspection system. We first compare several kinds of methods for feature extraction and classification, and then present a real-time automated visual inspection system for copper strips surface （CSS） defects based on compound moment invariants and support vector machine （SVM）. The proposed method first processes images collected by hardware system, and then extracts feature characteristics based on grayscale characteristics and morphologic characteristics （Hu and Zernike compound moment invariants）. Finally, we use SVM to classify the CSS defects. Furthermore, performance comparisons among SVM, back propagation （BP） and radial basis function （RBF） neural networks have been involved. Experimental results show that the proposed approach achieves an accuracy of 95.8% in detecting CSS defects.

Effect of H_2O_2 and nonionic surfactant in alkaline copper slurry

For improving the polishing performance, in this article, the roles of a nonionic surfactant（Fatty alcohol polyoxyethylene ether） and H2O2 were investigated in the chemical mechanical planarization process, respectively.Firstly, the effects of the nonionic surfactant on the within-wafer non-uniformity（WIWNU） and the surface roughness were mainly analyzed. In addition, the passivation ability of the slurry, which had no addition of BTA, was also discussed from the viewpoint of the static etch rate, electrochemical curve and residual step height under different concentrations of H2O2. The experimental results distinctly revealed that the nonionic surfactant introduced in the slurry improved the WIWNU and surface roughness, and that a 2 vol% was considered as an appropriate concentration relatively. When the concentration of H2O2 surpasses 3 vol%, the slurry will possess a relatively preferable passivation ability, which can effectively decrease the step height and contribute to acquiring a flat and smooth surface. Hence, based on the result of these experiments, the influences of the nonionic surfactant and H2O2 are further understood, which means the properties of slurry can be improved.

Corrosion property of copperized layer on Zr formed by double glow plasma surface alloying technique

Zr and its alloys have excellent mechanical properties as new structural material,but in specific application environment,its corrosion resistance still needs to be further explored.In this work,double glow plasma surface alloying technique was used for copperizing on pure Zr surface.Besides,X-ray diffraction（XRD）,scanning electron microscope（SEM） and energy dispersion spectrum（EDS） were employed to characterize the samples.Furthermore,research was also conducted on the polarization curve of the samples in different solutions.Copperizing on surface can improve corrosion resistance of pure Zr in 3.5 % Na Cl and 0.5 moláL-1Na OH solutions.Especially in 0.5 moláL-1Na OH solution,the corrosion resistance can achieve significant improvement.However,copperizing has no influence on the improvement of corrosion resistance of pure Zr in 0.5 moláL-1H2SO4 solution.The results may provide new insight into way for improving the corrosion property of zirconium alloys.

Interaction between Cu^(2+) and different types of surface-modified nanoscale zero-valent iron during their transport in porous media

This study investigated the interaction between Cu^2＋and nano zero-valent iron（NZVI）coated with three types of stabilizers（i.e., polyacrylic acid [PAA], Tween-20 and starch） by examining the Cu^2＋ uptake, colloidal stability and mobility of surface-modified NZVI（SM-NZVI） in the presence of Cu^2＋. The uptake of Cu^2＋ by SM-NZVI and the colloidal stability of the Cu-bearing SM-NZVI were examined in batch tests. The results showed that NZVI coated with different modifiers exhibited different affinities for Cu^2＋, which resulted in varying colloidal stability of different SM-NZVI in the presence of Cu^2＋. The presence of Cu^2＋ exerted a slight influence on the aggregation and settling of NZVI modified with PAA or Tween-20. However, the presence of Cu^2＋caused significant aggregation and sedimentation of starch-modified NZVI, which is due to Cu^2＋complexation with the starch molecules coated on the surface of the particles. Column experiments were conducted to investigate the co-transport of Cu^2＋ in association with SM-NZVI in water-saturated quartz sand. It was presumed that a physical straining mechanism accounted for the retention of Cu-bearing SM-NZVI in the porous media. Moreover, the enhanced aggregation of SM-NZVI in the presence of Cu^2＋ may be contributing to this straining effect.