Microstructure of aluminum/copper clad composite fabricated by casting-cold extrusion forming

An aluminum/copper clad composite was fabricated by the casting-cold extrusion forming technology and the microstructures of the products were observed and analyzed.It is found that aluminum grains at the interface are refined in the radial profiles of cone-shaped deformation zone,but the grains in the center maintain the original state and the grain size is non-uniform.A clear boundary presents between the refined area and center area.In contrast,the copper grains in the radial profiles have been significantly refined.In the center area of the copper,the grains are bigger than those at the boundary.On the surface of the deformable body,the grain size is the smallest,but with irregular grain morphology.After the product is entirely extruded,all the copper and aluminum grains are refined with small and uniform morphology.In the center area,the average diameter of aluminum grains is smaller than 5 μm,and the copper grain on the surface is about 10 μm.At the interface,the grain size is very small,with a good combination of copper and aluminum.The thickness of interface is in the range of 10-15 μm.Energy spectrum analysis shows that CuAl3 phase presents at the interface.

Interface repairing for AA5083/T2 copper explosive composite plate by friction stir processing

Multi-pass friction stir processing(M-FSP)was performed to repair the interface defects of AA5083/T2 copper explosive composite plates.The interface morphology and its bonding mechanism were explored.The results show that higher rotation speed and lower transverse speed produce more heat generated during FSP.The defect-free and good mechanical properties of the AA5083/T2 copper composite plate can be obtained under the condition of the rotation speed of 1200 r/min,the transverse speed of 30 mm/min and the overlap of 2/24.Moreover,M-FSP changes the interface bonding mechanism from metallurgical bonding to vortex connection,improving the bonding strength of composite plate,which can guarantee the repairing quality of composite plates.

Cu-Al interfacial compounds and formation mechanism of copper cladding aluminum composites

Copper cladding aluminum(CCA)rods with the section dimensions of12mm in diameter and2mm in sheath thickness were fabricated by vertical core-filling continuous casting(VCFC)technology.The kinds and morphology of interfacial intermetallic compounds(IMCs)were investigated by SEM,XRD and TEM.The results showed that the interfacial structure of Cu/Al was mainly composed of layeredγ1(Cu9Al4),cellularθ(CuAl2),andα(Al)+θ(CuAl2)phases.Moreover,residual acicularε2(Cu3Al2+x)phase was observed at the Cu/Al interface.By comparing the driving force of formation forε2(Cu3Al2+x)andγ1(Cu9Al4)phases,the conclusion was drawn that theε2(Cu3Al2+x)formed firstly at the Cu/Al interface.In addition,the interfacial formation mechanism of copper cladding aluminum composites was revealed completely.

Determining the microstructure and properties of magnesium aluminum composite panels by hot rolling and annealing

The researchers made magnesium aluminum composite panels by asymmetric metal packaging and studied rolling temperature,holding time,and high temperature heat treatment,such as short time and low temperatures over long periods of time parameters under the new preparation method.We tested the new magnesium aluminum composite panels’tensing properties and bending performance by using scanning electric mirror and EDS.It is concluded that the new magnesium aluminum composite panels’elongation is 24%under the tensile strength of 260 MPa.Regarding performance when compared with other methods,traditional magnesium aluminum composite panels’elongation is 10%,which shows its advanced nature.At the same time,bending performance test showed that the combination of the composite board has higher performance,offering the reference value for the preparation of magnesium–aluminum composite plate.

Effect of aluminum borate whisker coating on interface and mechanical properties of 6061Al matrix composites

Copper coating was deposited on the surface of aluminum borate whisker by an electroless plating method.This method was used to modify the interfacial property of squeeze-casting aluminum borate whisker reinforced 6061Al matrix composite.Interface observation indicates that the spinel reaction(MgAl2O4) is hindered by the copper coating,and the difference in interfacial reaction degree affects the tensile property and aging behavior of the composite.For the composite with less spinel reaction(MgAl2O4),its peak-aging process are postponed due to less depletion of magnesium.On the fracture surface of copper-coated composite dimples and fractures of whiskers are more,but on the fracture surface of uncoated composite pull-out of whiskers are more than that on the coated one.In uncoated composite the fracture generally originates from the near-interface-region.

Tailoring microstructure and mechanical properties of aluminum matrix composites reinforced with novel Al/CuFe multi-layered core-shell particles

Aluminum matrix composites(AMCs), reinforced with novel pre-synthesized Al/Cu Fe multi-layered coreshell particles, were fabricated by different consolidation techniques to investigate their effect on microstructure and mechanical properties. To synthesize multi-layered Al/Cu Fe core-shell particles, Cu and Fe layers were deposited on Al powder particles by galvanic replacement and electroless plating method, respectively. The core-shell powder and sintered compacts were characterized by using X-ray diffraction(XRD), scanning electron microscopy(SEM) equipped with energy dispersive spectroscopy(EDX), pycnometer, microhardness and compression tests. The results revealed that a higher extent of interfacial reactions, due to the transformation of the deposited layer into intermetallic phases in spark plasma sintered composite, resulted in high relative density(99.26%), microhardness(165 HV0.3) and strength(572 MPa). Further, the presence of un-transformed Cu in the shell structure of hot-pressed composite resulted in the highest fracture strain(20.4%). The obtained results provide stronger implications for tailoring the microstructure of AMCs through selecting appropriate sintering paths to control mechanical properties.

Microstructural characterization of Cu/Al composites and effect of cooling rate at the Cu/Al interfacial region

Cu/Al composites are of vital importance in industrial applications because of their numerous advantages. The influence of bond-ing temperature and cooling rate on the microstructure and morphology of Cu/Al composites was investigated in this paper. The interfacial morphology and constituent phases at the Cu/Al interface were analyzed by optical microscopy and field-emission scanning electron mi-croscopy equipped with energy-dispersive X-ray spectroscopy. The results indicate that effective Cu-Al bonding requires a higher bonding temperature to facilitate interdiffusion between the two metals. The microstructural characteristics are associated with various bonding tem-peratures, which impact the driving force of interdiffusion. It is observed that cooling rate exerts a significant influence on the morphology and amount of the intermetallic compounds at the interfacial region. Meanwhile, microhardness measurements show that hardness varies with the bonding temperature and rate of cooling.

Solute segregation in an Al_2O_(3f)/Al-4.5Cu alloy composite during solidification at different cooling rates

An Al_2O_(3f)/Al-4.5Cu composite was made by squeeze casting. The solutesegregation in the composite at different cooling rates was studied. The results indicate that theprimary crystal of Al-4.5Cu alloy nucleates and grows in the interstice between fibers. The fibersurface cannot serve as site for the heterogeneous nucleation of a primary dendrite. There exists anincreasing Cu concentration gradient from the center of the interstice between fibers to theinterface or the grain boundaries. There are the eutectic phases around the fibers. The solutesegregation in the matrix increases with the cooling rate rising. The amount of eutectic phasesfollowed by imbalance crystalline can be numerically calculated with Clyne-Kurz formula.

Manufacturing process and microstructure of copper-coated aluminum wires

Copper-coated aluminum wires exhibit good electrical conductivity, high thermal conductivity, low contact resistance of copper and low density, and provide economic advantages over aluminum. However, there are some problems in the manufacring processes of hot-dip copper-coated aluminum wires, such as the difficulties in controlling coating process. In this work, the hot-dip copper-coating method of aluminum wires was investigated for producing copper-coated aluminum wire composites. The interface microstructure between the aluminum wire and the copper coating layer was analyzed by scanning electron microscopy （SEM） and energy-dispersive X-ray spec- trometry （EDS）. Five different fluxing agents were tested. Experimental results show that appropriate conditions for the hot-dip process are determined as the liquid copper temperature of 1085℃ and the treatment time less than 1 s. A success in hot-dip copper-coated aluminum wires is achieved by hot-dipping a low-melting-point metal into a high-melting-point metal liquid, which is significant for the further devel- opment and application of copper-coated aluminum wire composites.

Effect of coating thickness on microstructures and mechanical properties of C/Cu/Al composites

The different copper coatings with thickness varying from 0.3μm to 1.5μm were deposited on carbon fibers using either electroless plating or electroplating method. The coated fibers were chopped and composites were fabricated with melting aluminum at 700℃. The effect of the copper layer on the microstructure in the system was discussed. The results show that the copper layer has fully reacted with aluminum matrix, and the intermetallic compound CuAl2 forms through SEM observation and XRD, EDX analysis. The results of tensile tests indicate that composites fabricated using carbon fibers with 0.7-1.1μm copper coating perform best and the composites turn to more brittle as the thickness of copper coating increases. The fracture surface observation exhibits good interface bonding and ductility of the matrix alloy when the thickness of copper coating is about 0.7-1.1μm.

Wear Displayed by the Scratch of Epoxy Composites Filled by Metallic Particles under the Influence of Magnetic Field

The tribological performance of the sliding bearings which are probably made of polymers, which is subjected to magnetic field, is of great intense. The wear of epoxy composites filled by metallic particles such as iron, copper and aluminum scratched by steel indenter is investigated. The wear scar width of the scratch was measured by an optical microscope. It was found that wear displayed by the scratch of epoxy filled by the metallic filling materials such as iron, copper and aluminum increased with increasing applied load. As the content of the metallic filling materials increased, wear slightly increased due to the reduction in cohesive stress inside the matrix as well as the epoxy transfer into the indenter surface might be responsible for that behavior. For epoxy filled by iron, when the magnetic field was applied to the contact area wear significantly decreased. Increasing the intensity of the magnetic field showed slight wear increase. Wear displayed by the scratch of epoxy filled by copper showed higher values than that observed for copper filled epoxy. Presence of the magnetic field might generate electric current at the contact area leading to an increase in the intensity of the electric static charge. Moreover, wear of epoxy filled by aluminum showed lower values than that observed for epoxy composites filled by copper and higher than that displayed by iron filled epoxy composites. Under the effect of magnetic field, wear significantly increased. This behavior could explained on the basis that the presence of magnetic field accompanied by the movement of the indenter in the epoxy composites generated electric current passing through the steel indenter which caused softening of the epoxy composites. In that condition removal of epoxy from the wear track was easier and epoxy transfer into the steel indenter was accelerated.

增强体表面改性在高导热金属基复合材料中的应用

随着电子技术的高速发展和电子器件的更新换代,电子封装材料的性能需求越来越高。金属基复合材料,尤其是铝基和铜基复合材料具有高导热、低膨胀、高稳定性等特点,是具有广阔应用前景的电子封装材料。然而,金刚石、石墨烯、硅等增强体与基体的润湿性差,或者在高温下与基体发生有害的界面反应,限制了此类高导热金属基复合材料的开发和应用。本文简述了金属基复合材料的界面研究进展,结合影响金属基复合材料界面结合的因素,提出了几种改善界面结合的方法。增强体表面改性是改善金属基复合材料界面的重要途径之一,常用工艺有磁控溅射法、化学气相沉积法、溶胶凝胶法、化学镀法等;最后,对增强体表面改性在高热导金属基复合材料中的应用进行分析和展望。

铜/铝双金属固-液复合工艺研究

采用冲击射流固-液复合法制备铜/铝复合材料,预先在铜基体表面进行预处理,在浇注过程中改变铜基体的移动速度,使铝液与铜基体产生不同程度强化换热作用。利用SEM、XRD、EDS检测分析了铜/铝复合层成分与组织变化规律,用万能力学试验机测量其结合强度,显微硬度分析复合层的硬度分布。试验表明:浇注温度720℃时,随着铜基体移动速度升高,铝液对铜基体冲击射流换热量降低,复合层由Cu/Al金属间化合物组成。镀镍层使得铝液在铜基体表面产生润湿、漫流、保护作用,促进固-液界面形成冶金结合,有效提升了铜/铝复合材料的结合强度。试样在浇注温度720℃、铜基体移动速15 mm/s时,测得界面结合强度为24.8 MPa。

热轧温度对1060/6201/1060复合板力学性能及导电性能的影响

通过首道次大变形量热轧、再经两道次冷轧方式成功制备了1060/6201/1060三层复合板,详细考察了不同热轧温度对复合板力学性能及导电性能的影响。结果表明,随着热轧温度的升高,复合板的力学性能逐渐降低,导电率先升高后降低。在200℃热轧时,抗拉强度为257.21 MPa,导电率为57.45%IACS,综合性能最佳。在300、400℃轧制时,由于发生动态回复,析出相粗化,基体晶粒长大,复合板的强度降低,伸长率提高,导电率增加。

石墨烯化学镀铜对放电等离子烧结石墨烯增强铝基复合材料组织和性能的影响

通过化学镀方法得到镀铜石墨烯粉末,再通过静电自组装方法将镀铜石墨烯粉末与铝粉混合,然后经放电等离子烧结工艺制备镀铜石墨烯增强铝基复合材料,研究了不同质量分数(0.1%,0.2%,0.3%,0.4%,0.5%)镀铜石墨烯增强铝基复合材料的微观结构和性能,并与质量分数0.1%未镀铜石墨烯增强铝基复合材料进行对比。结果表明:镀铜石墨烯在复合材料中分散均匀,复合材料的相对密度均在99%以上;铝和铜发生反应生成了中间相Al_(2)Cu,但未有Al_(4)C_(3)界面相生成;镀铜石墨烯增强铝基复合材料的硬度和耐磨性能均优于未镀铜石墨烯增强铝基复合材料;随着镀铜石墨烯含量的增加,复合材料的硬度先升高后降低,磨损质量损失和摩擦因数均呈先减小后增加的趋势。当镀铜石墨烯的质量分数为0.2%时,复合材料具有优异的综合性能,其硬度为74.7 HV,磨损质量损失和摩擦因数均最小,分别为0.0023 g和0.259,磨损机制为氧化磨损。

铜电解阴极钛板碳化硅悬浮液超声波协同清洗研究

铜电解阴极钛板作为铜电解工艺的重要组成部分,其表面质量对电解质量和效率及钛板本身使用寿命有显著影响。针对此问题,采用碳化硅悬浮液超声波协同清洗技术对钛板进行简单、高效、环保的表面处理。通过铝箔腐蚀法探究了最佳清洗参数,分析了清洗过程中的协同效应及其作用机理。通过SEM+EDS和接触角测量仪对钛板表面清洁度、微观形貌和湿润性进行表征和评价。结果表明:距离换能器78 mm、碳化硅颗粒质量分数为0.05%,粒径为70 nm、p H值为中性、温度为55℃时清洗效果最佳;碳化硅悬浮液作为清洗介质,其协同效应可以明显提高清洗效率,改善钛板表面质量;清洗前后的对比表明,协同清洗能够有效地去除钛板表面的污染物,提高表面洁净度和湿润性,恢复钛板表面微观形貌及金属光泽。研究为优化钛板清洗工艺提供参考依据。

压延铜箔的无氰电镀镍铜黑化处理工艺

为了研究出相较于电镀纯镍黑化工艺成本更低的电镀镍铜黑化工艺,以NiSO_(4)·6H_(2)O、CuSO_(4)·5H_(2)O、H_(3)BO_(3)、(NH_(4))_(2)S_(2)O_(8)和C_(6)H_(15)NO_(3)为镀液基本成分,通过加入添加剂,使金属在铜箔表面沉积形成光陷阱结构,从而实现电镀镍铜使铜箔黑化的目的。研究了镀液成分及工艺参数对黑化箔镀层亮度的影响,对黑化箔镀层的成分进行了测试,并对黑化箔镀层结构进行了观察分析。研究结果表明:电镀镍铜的黑化箔镀层中Cu代替Ni形成镀层,黑化箔镀层成分为NiCu;通过加入添加剂可以使电镀时使用的电流密度降低,达到了降低成本的目的。

退火工艺对镁/铝复合板材力学性能的影响

以爆炸复合制备的镁/铝复合板材为研究对象,研究了退火处理工艺对复合板组织及力学性能的影响。采用电子万能试验机测试了复合板的力学性能,采用奥林巴斯GX51型金相显微镜和JSM-6510A扫描电子显微镜对复合板的显微组织进行了表征。结果表明:退火处理后,复合板的抗拉强度及硬度均降低,伸长率比原始试样的高。退火保温时间越长、温度越高,镁/铝复合板材的抗拉强度越低、伸长率越高、塑性越好。复合板材断口形貌表明,退火处理后铝侧韧窝增多,镁侧断口处的微裂纹消失,出现少量韧窝。退火处理改变了镁、铝两侧结合界面处过渡层的断裂方式,铝侧附近的过渡层出现大量撕裂脊,以韧性为主间有少量脆性断裂;镁侧附近的过渡层出现大量的解理面伴有少量韧窝,以脆性断裂为主间有韧性断裂。

不同载荷下镀镍石墨-铜基复合材料的载流摩擦性能

首先采用化学镀的方法在石墨表面镀Ni,随后采用快速热压方法制备10 mass%镀Ni石墨-铜基复合材料。在不同载荷下对复合材料开展了载流摩擦实验,采用扫描电镜观察了复合材料的磨损表面形貌,进而从磨损表面形貌特征分析其损伤机制。结果表明:在石墨表面成功镀覆了致密且均匀的Ni金属层,化学镀镍有效改善了石墨和铜之间的润湿性;镀镍石墨-铜基复合材料的相组成为石墨和铜基体两相,石墨在铜基体中呈弥散分布,未形成连续网状结构;随载荷的增加,复合材料的摩擦系数逐渐降低,磨痕宽度和磨损率逐渐升高,载流效率和载流稳定性逐渐下降;在低载荷下(20和40 N),复合材料的损伤机制以显微切削为主;随着载荷的增加(60和80 N),电侵蚀加剧,成为主要的损伤机制。

基于氮化铝HTCC的表面Cu互连制备技术

针对高集成密度、高散热封装外壳发展需求,基于氮化铝(AlN)高温共烧陶瓷(HTCC)多层基板,结合直接镀铜(DPC)工艺,提出了一种薄厚膜相结合的高散热封装基板及其制备方法。重点对氮化铝HTCC与表面铜(Cu)层间的结合力进行研究和优化,通过扫描电子显微镜(SEM)、能谱仪(EDS)和剥离强度测试仪分析和研究了界面的微观结构和力学性能。研究结果表明:与氮化铝/钛钨(TiW)/Cu相比,氮化铝/钛(Ti)/Cu界面的缺陷更少,金属Ti的黏附性能更优,拉脱断裂面在陶瓷基板上。当采用厚度为400 nm的Ti作为黏附层时,表面金属化剥离强度高达592 MPa,实现了高界面结合力,保证了产品封装性能的稳定性。