Simplified quantitative analysis method and its application in the insitu synthesized copper-based azide chips

Copper-based azide(Cu(N_(3))2 or CuN_(3),CA)chips synthesized by in-situ azide reaction and utilized in miniaturized explosive systems has become a hot research topic in recent years.However,the advantages of in-situ synthesis method,including small size and low dosage,bring about difficulties in quantitative analysis and differences in ignition capabilities of CA chips.The aim of present work is to develop a simplified quantitative analysis method for accurate and safe analysis of components in CA chips to evaluate and investigate the corresponding ignition ability.In this work,Cu(N_(3))2 and CuN_(3)components in CA chips were separated through dissolution and distillation by utilizing the difference in solubility and corresponding content was obtained by measuring N_(3)-concentration through spectrophotometry.The spectrophotometry method was optimized by studying influencing factors and the recovery rate of different separation methods was studied,ensuring the accuracy and reproducibility of test results.The optimized method is linear in range from 1.0-25.0 mg/L,with a correlation coefficient R^(2)=0.9998,which meets the requirements of CA chips with a milligram-level content test.Compared with the existing ICP method,component analysis results of CA chips obtained by spectrophotometry are closer to real component content in samples and have satisfactory accuracy.Moreover,as its application in miniaturized explosive systems,the ignition ability of CA chips with different component contents for direct ink writing CL-20 and the corresponding mechanism was studied.This study provided a basis and idea for the design and performance evaluation of CA chips in miniaturized explosive systems.

Metal-organic-framework-derived copper-based catalyst for multicomponent C-S coupling reaction

Copper-based metal-organic frameworks(Cu-MOFs)are a promising multiphase catalyst for catalyzing C-S coupling reactions by virtue of their diverse structures and functions.However,the unpleasant odor and instability of the organosulfur,as well as the mass-transfer resistance that exists in multiphase catalysis,have often limited the catalytic application of Cu-MOFs in C-S coupling reactions.In this paper,a Cu-MOFs catalyst modified by cetyltrimethylammonium bromide(CTAB)was designed to enhance mass transfer by increasing the adsorption of organic substrates using the long alkanes of CTAB.Concurrently,elemental sulfur was used to replace organosulfur to achieve a highly efficient and atom-economical multicomponent C-S coupling reaction.

A highly hydrothermal stable copper-based catalyst for catalytic wet air oxidation of m-cresol in coal chemical wastewater

Catalytic wet air oxidation(CWAO) can degrade some refractory pollutants at a low cost to improve the biodegradability of wastewater. However, in the presence of high temperature and high pressure and strong oxidizing free radicals, the stability of catalysts is often insufficient, which has become a bottleneck in the application of CWAO. In this paper, a copper-based catalyst with excellent hydrothermal stability was designed and prepared. TiO_(2) with excellent stability was used as the carrier to ensure the longterm anchoring of copper and reduce the leaching of the catalyst. The one pot sol–gel method was used to ensure the super dispersion and uniform distribution of copper nanoparticles on the carrier, so as to ensure that more active centers could be retained in a longer period. Experiments show that the catalyst prepared by this method has good stability and catalytic activity, and the catalytic effect is not significantly reduced after 10 cycles of use. The oxidation degradation experiment of m-cresol with the strongest biological toxicity and the most difficult to degrade in coal chemical wastewater was carried out with this catalyst. The results showed that under the conditions of 140℃, 2 MPa and 2 h, m-cresol with a concentration of up to 1000 mg·L^(-1) could be completely degraded, and the COD removal rate could reach 79.15%. The biological toxicity of wastewater was significantly reduced. The development of the catalyst system has greatly improved the feasibility of CWAO in the treatment of refractory wastewater such as coal chemical wastewater.

Preventing formation of intermetallic compounds in ultrasonic-assisted Sn soldering of Mg/Al alloys through pre-plating a Ni coating layer on the Mg substrate

Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.

Catalytic combustion of methane over nano ZrO_2-supported copper-based catalysts

The nano ZrO2-supported copper-based catalysts for methane combustion were investigated by means of N2 adsorption, TEM, XRD, H2-TPR techniques and the test of methane oxidation. Two kinds of ZrO2 were used as support, one （ZrO2-1） was obtained from the commercial ZrO2 and the other （ZrO2-2） was issued from the thermal decomposition of zirconium nitrate. It was found that the CuO/ZrO2-2 catalyst was more active than CuO/ZrO2-1. N2 adsorption, H2-TPR and XRD measurements showed that larger surface area, better reduction property, presence of tetragonal ZrO2 and higher dispersion of active component for CuO/ZrO2-2 than that of CuO/ZrO2-1. These factors could be the dominating reasons for its higher activity for methane combustion.

Effect of preparation methods of aluminum emulsions on catalytic performance of copper-based catalysts for methanol synthesis from syngas

Various Cu/ZnO/Al2O3 catalysts have been synthesized by different aluminum emulsions as aluminum sources and their pertormances tor methanol synthesis from syngas have been investigated. The influences of preparation methods of aluminum emulsions on physicochemical and catalytic properties of catalysts were studied by XRD, SEM, XPS,N2 adsorption-desorption techniques and methanol synthesis from syngas. The preparation methods of aluminum emulsions were found to influence the catalytic activity, CuO crystallite size, surface area and Cu0 surface area and reduction process. The results show that the catalyst CN using the aluminum source prepared by addition the ammonia into the aluminum nitrate （NP） exhibited the best catalytic performance for methanol synthesis from syngas.

Comprehensive first-principles studies on phase stability of copper-based halide perovskite derivatives A_lCu_mX_n(A = Rb and Cs;X = Cl, Br, and I)

Recently,inorganic copper-based halide perovskites and their derivatives(CHPs)with chemical formulas AlCumXn(A=Rb and Cs;X=Cl,Br and I;l,m,and n are integers.),have received increasing attention in the photoluminescence field,due to their lead-free,cost-effective,earth-abundant and low electronic dimensionality.Ascribed to flexible valence charge of Cu(Cu1+and Cu2+)and complex competing phases,the crystal structures and phase stabilities of CHPs are complicated and ambiguous,which limits their experimental applications.Via comprehensive first-principles calculations,we have investigated thermodynamic stabilities of possible crystal phases for AlCumXn by considering all the possible secondary phases existing in inorganic crystal structure database(ICSD).Our results are in agreement with existing experiments and further predicted the existence of 10 stable CHPs,i.e.Rb3 Cu2 Br5,Rb3 Cu2 I5,Rb Cu2 Cl3,Rb2 Cu I3,Rb2 Cu Br4,Rb Cu Br3,Rb3 Cu2 Br7,Cs3 Cu2 Br7,Cs3 Cu2 Cl7 and Cs4 Cu5 Cl9,which have not yet been reported in experiments.This work provides a phase and compositional map that may guide experiments to synthesize more novel inorganic CHPs with diverse properties for potential functional applications.

Migration of sulfur in in-situ gasification chemical looping combustion of Beisu coal with iron-and copper-based oxygen carriers

Chemical looping combustion(CLC)is an energy conversion technology with high efficiency and inherent separation of CO_(2).The existence of sulfur in coal may affect the CO_(2) purity and the performance of oxygen carrier due to the interactions between sulfur contaminants and oxygen carrier.The migration of sulfur in Beisu coal during the in-situ gasification chemical looping combustion(i G-CLC)process using two oxygen carriers(iron ore and Cu O/Si O_(2))was investigated respectively.The thermodynamic analysis results showed the formation of metal sulfides was thermodynamically favored at low temperatures and low oxygen excess coefficients,while they were obviously inhibited and the production of SO_(2) was significantly promoted with an increase in temperature and oxygen excess coefficient.Moreover,part of sulfur was captured and fixed in the forms of alkali/alkaline earth metal sulfate due to the high amount of alkali/alkaline earth metal oxides in the coal ash or/and oxygen carrier.The experimental results showed that the sulfur in coal mainly released in the form of SO_(2),and the sulfur conversion efficiency(XS)in the reduction stage were 51.04%and 48.24%when using iron ore and Cu O/Si O_(2) respectively.The existence of metal sulfides was observed in the reduced oxygen carriers.The values of XSin the reoxidation process reached 3.80%and 7.64%when using iron ore and Cu O/Si O_(2) respectively.The residue and accumulation of sulfur were also found on the surfaces of two oxygen carriers.

Effects of Copper-based Nutritional Foliar Fertilizers on Photosynthetic Characteristics,Yield and Disease Control Efficiency of Cotton

[Objectives] The effects of copper-based nutrient foliar fertilizer on photosynthetic characteristics,yield,accumulation and distribution of trace elements in various organs,disease prevention effect and soil enzyme activity were studied,so as to provide a theoretical basis for the application of foliar fertilizers in cotton production. [Methods]Through two years of field experiments,six treatments were set in total,namely spraying water( CK),traditional Bordeaux mixture( BDM),Kocide 2000( KCD),copper-based nutrient foliar fertilizer( CF),iron-copper-based nutrient foliar fertilizer( CFFe),and zinc-boron-copper-based nutrient foliar fertilizer( CFZnB). Randomized block arrangement was adopted. Chlorophyll content in leaves was measured at each growth stage of the cotton. Photosynthetic characteristics of leaves were measured at the peak bolling stage. Plants were sampled at initial boll opening stage. The whole plant was divided into root,stem,leaf and cotton boll parts,in which the total copper,total zinc,total iron contents and accumulations were determined. Soil samples were collected from each plot,followed by the determination of soil enzyme activity. Disease index was investigated at bud,flowering and boll-forming and boll opening stage. [Results]( 1) Spraying CFFe,CFZnB,CF and KCD could significantly improve chlorophyll content of cotton leaves,and the CFFe treatment had the highest increase up to13. 30%,followed by the CFZnB treatment,which was 11. 40% higher than the CK; and photosynthetic rate,stomata conductance and transpiration rate could be improved significantly,and the CFFe treatment showed the highest photosynthetic rate,which increased by 26. 35% compared with the CK,followed by the CFZnB treatment,which increased by 17. 96% compared with CK; and intercellular CO2 concentration was significantly reduced.( 2) Spraying BDM,KCD,CF,CFFe and CFZnB can significantly increase total copper content and accumulation in various cotton organs( except the total copper content in the stem part of the CFZnB treatment; the CFZnB and CFFe treatments can significantly increase total zinc content and accumulation in various cotton organs; and spraying CFFe,CFZnB and CF can significantly increase total iron content and accumulation in various cotton organs( except the total iron content in the stem part of the CF treatment).( 3)Spraying CFFe,CFZnB,CF,KCD and BDM greatly reduced the disease index at flowering and boll-forming and boll opening stages.( 4) The CFZnB and CFFe treatments had the highest soil urease activity,which was 7. 14% higher than that of the CK,but the difference from the CK was not significant; the catalase activity of each treatment was significantly higher than that of the BDM treatment; and the sucrase activity of each treatment was significantly higher than that of the CK.( 5) Spraying CFFe,CFZnB,CF and KCD significantly improved lint yield of cotton,and the CFZnB treatment showed the highest yield increase up to 12. 34%,followed by the CFFe treatment,with an increase in the range of 8. 77%-10. 20%. [Conclusions]Copper-based nutrient foliar fertilizers have dual functions of disease control and prevention and plant nutrition and health care,and not only can significantly increase cotton yield,but also has certain disease prevention effect.It is recommended to use copper-based nutrient foliar fertilizers.

Tarnish Testing of Copper-Based Alloys Coated with SiO_2-Like Films by PECVD

The tarnishing test in the presence of hydrogen sulfide（H2S） vapors has been used to investigate the tarnish resistance capability of copper-based alloys coated with Si02-like films by means of plasma-enhanced chemical vapor deposition（PECVD） fed with a tetraethoxysilane/oxygen mixture.The chemical and morphological properties of the films have been characterized by using infrared absorption spectroscopy（IR） and scanning electron microscopy（SEM）with energy disperse spectroscopy（EDS）.The corrosion products of the samples after the tarnishing test have been identified by X-ray diffraction analysis（XRD）.It has been found that SiO2-like films formed via PECVD with a high O2 flow rate could protect copper-based alloys from H2S vapor tarnishing.The alloys coated at the O2 flow rate of 20 sccm remain uncorroded after 54days of H2S vapor tarnish testing.The corrosion products for the alloys deposited at a low O2flow rate after 54 days of tarnish testing are mainly composed of brochantite.

A review of soldering by localized heating

In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the thermal needs of different modules has become increasingly prominent,especially for small-size solder joints with high heat dissipation in high-power devices.Localized soldering is con-sidered a suitable choice to selectively heat the desired target while not affecting other heat-sensitive chips.This paper reviews several local-ized soldering processes,focusing on the size of solder joints,soldering materials,and current state of the technique.Each localized solder-ing process was discovered to have unique characteristics.The requirements for small-size solder joints are met by laser soldering,microres-istance soldering,and self-propagating soldering;however,laser soldering has difficulty meeting the requirements for large heat dissipation,microresistance soldering requires the application of pressure to joints,and self-propagating soldering requires ignition materials.However,for small-size solder junctions,selective wave soldering,microwave soldering,and ultrasonic soldering are not appropriate.Because the magnetic field can be focused on a tiny area and the output energy of induction heating is large,induction soldering can be employed as a significant trend in future research.

Interfacial reaction behavior and mechanical properties of 5A06 Al alloy soldered with Sn-1Ti-xGa solders at a low temperature

Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were investigated. The results showed that the Sn-1Tisolder broke the oxide film on the surface of the Al substrate and induced intergranular diffusion in the Al substrate. When Ga was added tothe solder, severe dissolution pits appeared in the Al substrate due to the action of Sn-1Ti-0.3Ga solder, and many Al particles were flakedfrom the matrix into the solder seam. Under thermal stress and the Ti adsorption effect, the oxide film cracked. With increasing solderingtime, the shear strength of 5A06 Al alloy joints soldered with Sn-1Ti and Sn-1Ti-0.3Ga active solders increased. When soldered for 90 min,the joint soldered with Sn-1Ti-0.3Ga solder had a higher shear strength of 22.12 MPa when compared to Sn-1Ti solder.

Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration

The spacecraft for deep space exploration missions will face extreme environments,including cryogenic temperature,intense radiation,wide-range temperature variations and even the combination of conditions mentioned above.Harsh environments will lead to solder joints degradation or even failure,resulting in damage to onboard electronics.The research activities on high reliability solder joints using in extreme environments can not only reduce the use of onboard protection devices,but effectively improve the overall reliability of spacecraft,which is of great significance to the aviation industry.In this paper,we review the reliability research on SnPb solder alloys,Sn-based lead-free solder alloys and In-based solder alloys in extreme environments,and try to provide some suggestions for the follow-up studies,which focus on solder joint reliability under extreme environments.

Effect of Strain Rate on Tensile Behavior of Sn-9Zn-xAg-ySb;{(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} Lead-Free Solder Alloys

The tensile properties of Sn-9Zn-xAg-ySb;{(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} lead-free solders were investigated. All the test samples were annealed at 150°C for 1 hour. The tests are carried out at room temperature at the strain rate of 4.17 × 10-3 s-1, 20.85 × 10-3 s-1, and 208.5 × 10-3 s-1. It is seen that the tensile strength increases and the ductility decrease with increasing the strain rate over the investigated range. From the strain rate change test results, the strain sensitivity values are found in the range of 0.0831 to 0.1455 due to the addition of different alloying elements.

大尺寸AlN活性金属焊接覆铜基板的界面结合机理

基于190 mm×139 mm×0.635 mm的大尺寸AlN表面活性金属钎焊(AMB)覆铜板工艺制程,开展其界面显微组织、物相组成等的研究,确定钎焊界面结合机理,为制备大尺寸、低气孔、高剥离强度AlN-AMB覆铜板提供支持。结果表明,在大尺寸AlN-AMB覆铜板钎焊过程中,Ag-Cu-Ti合金钎料中的Ag-Cu合金与Cu箔扩散溶合,形成强的冶金结合界面。同时,钎料中的活性Ti原子向AlN基板表面扩散,并与其反应,生成厚度为0.5~1μm的TiN反应层,形成强的反应结合界面。此外,钎料熔体难以填充基板的AlN晶界和凹坑,其中的Ti原子也不与Y-Al-O第二相颗粒反应,导致AlN基板表面TiN反应层不连续分布,形成气孔,降低大尺寸AlN-AMB覆铜板的界面结合强度及可靠性。

SnAgCu/SnBi混装焊点的热循环可靠性研究

Sn-Bi和Sn-Ag-Cu混装焊点是利用低熔点的Sn-58Bi锡膏将高熔点的Sn-3.0Ag-0.5Cu(SAC305)的小球回流焊接在印制电路板(PCB)上,从而实现高温芯片的低温焊接工艺.文中研究了SnAgCu/SnBi混装焊点在热循环条件下的可靠性并通过有限元模拟揭示了混装焊点热循环可靠性的应变演变行为.热循环试验发现混装焊点的寿命要优于SAC305无铅焊点.有限元计算表明,结构混装焊点内SnBi钎料层的添加能够减小最大非弹性应变范围,从而提升混装焊点的热循环可靠性.

PCB中耐高温有机可焊保护剂成膜机理及性能研究

印制电路板铜焊盘表面生成耐高温有机可焊保护剂(HT-OSP)膜是克服无铅高温回流焊工艺并获得良好焊点的关键。选用2-[(2,4-二氯苯基)甲基]-1H-苯并咪唑(C_(14)H_(10)Cl_(2)N_(2))作为成膜剂,在铜层表面生成了HT-OSP膜。理论计算结合对比实验,研究C_(14)H_(10)Cl_(2)N_(2)分子与Cu原子反应生成HT-OSP膜机理。基于量子化学密度泛函理论,模拟C_(14)H_(10)Cl_(2)N_(2)分子与Cu^(+)之间的络合反应;利用红外光谱对HT-OSP膜中的特征官能团进行表征;借助X射线光电子能谱测试HT-OSP膜中Cu元素的化合价;设计对比实验分析Cu^(2+)对生成HT-OSP膜的影响。结果表明:HT-OSP膜生成机理是C_(14)H_(10)Cl_(2)N_(2)分子与Cu原子发生反应生成HT-OSP膜并沉积在铜层表面,Cu^(2+)通过络合反应促进HT-OSP膜生长。另外,HT-OSP膜的分解温度高达531℃,HT-OSP膜保护的铜层放置在自然环境中180天没有被氧化,证明HT-OSP膜具有优异的耐热性和抗氧化性。

基于度量学习的电路焊点缺陷检测方法

针对目前电路焊点缺陷检测方法效率低、准确度差、焊点图像样本量小的问题,提出了一种基于度量学习的快速识别焊点缺陷的方法.首先利用工业相机搭配远心镜头获取焊点图像.通过挖掘焊点图像特征,设计交点检测法来分割焊接单元图像,制作焊点缺陷数据集.在此基础上,设计焊点图像全局特征与局部表征提取方法来对焊点的两类特征进行融合,并对注意力机制进行改进,加入到全局特征提取模块中.对焊点缺陷的检测实验结果表明该方法最终实现了准确率达到98.4%,满足焊点缺陷检测的实际生产要求.

基于双目结构光的三维立体电路板焊点定位

三维立体电路将传统二维集成电路拓展至三维,在提高了电路板形状设计柔性的同时,也提升了电路板上元器件焊点定位的复杂度.为了降低三维立体电路加工过程中的人力成本,提高加工效率,设计了一种用于焊接机床对三维立体电路板焊点定位的双目结构光系统,并针对双目结构光系统在与焊接机床结合应用过程中存在的坐标转换、焊点识别困难等问题,从硬件与算法层面提出了解决方案.在软硬件的配合下,可以简单快速地完成双目结构光系统与焊接机床之间的坐标转换,并对电路板焊点完成定位与坐标计算,代替了人工对三维立体电路板焊点测量定位的复杂流程.实验表明,提出的方案具有较高的精度,能够满足机床焊接元器件过程中对焊点的定位需求.

基于波峰焊桥连改善的设计优化研究

波峰焊是一种常见的电装工艺焊接方式,而桥连是波峰焊工艺最为常见的焊接缺陷之一。介绍了波峰焊接桥连产生的机理,并分析了焊盘间距过近、引脚出脚长度过长,以及器件布局方向不当三种典型可制造性设计引起桥连的原因,并探讨了有助于波峰焊接桥连改善的可制造性设计优化方案。