[目的]烧结钕铁硼(Nd Fe B)的电镀前处理技术还不够成熟,开发适宜的前处理工艺极其重要。[方法]在电镀铜前,先采用以羟基乙叉二膦酸(HEDP)为主配位剂的溶液对NdFeB进行预浸。预浸液组成和工艺条件为:HEDP 20~30 g/L,氢氧化钾20~25 g/L,...[目的]烧结钕铁硼(Nd Fe B)的电镀前处理技术还不够成熟,开发适宜的前处理工艺极其重要。[方法]在电镀铜前,先采用以羟基乙叉二膦酸(HEDP)为主配位剂的溶液对NdFeB进行预浸。预浸液组成和工艺条件为:HEDP 20~30 g/L,氢氧化钾20~25 g/L,碳酸钾10~15 g/L,葡萄糖酸钾1~2 g/L,乙酸0.5~1.0 g/L,室温,时间60 s。通过电化学测试对比了Nd Fe B基体有无预浸处理时,铜在其表面的电沉积行为,并通过金相显微镜、扫描电镜、能谱仪和荧光光谱测厚仪,对比了有无预浸处理的Nd FeB基体表面Cu镀层的宏观和微观表面形貌、截面形貌、元素分布及厚度分布均匀性。[结果]Nd Fe B基体预浸后表面被活化,静态电位降低。预浸液能够填满基体表面的孔隙并形成一层水薄膜,在后续电镀铜时保护基体不被腐蚀。预浸处理的Nd Fe B基体表面所得Cu镀层均匀、致密,不易氧化发黑,结合力和耐蚀性较好。[结论]对烧结钕铁硼进行预浸处理,能够保证其在后续电镀铜过程不被腐蚀,提高Cu镀层的综合性能。展开更多
It was reported that hemispheric corrosion occurred in copper tubes in an acetic acid environment. When hemispheric corrosion occurred, corrosion could easily progress if water then flowed into the copper pipe, and co...It was reported that hemispheric corrosion occurred in copper tubes in an acetic acid environment. When hemispheric corrosion occurred, corrosion could easily progress if water then flowed into the copper pipe, and countermeasures were needed. Therefore, we studied the copper corrosion caused by acetic acid. The present work investigated the relationship between the corrosion form of copper and acetic acid concentration using phosphorous-deoxidized copper, and reported that hemispherical corrosion was observed at acetic acid concentrations of 0.01 to 1 vol.% (0.002 to 0.2 mol·L<sup>-1</sup>) in the immersion test. In this study, the effects of acetic acid and phosphate on copper corrosion were examined using oxygen-free copper in immersion tests. The results suggested that different concentrations of phosphate in acetic acid solutions and the presence or absence of acetic acid and phosphate affected the corrosion of copper, resulting in different corrosion forms and corrosion progress.展开更多
文摘[目的]烧结钕铁硼(Nd Fe B)的电镀前处理技术还不够成熟,开发适宜的前处理工艺极其重要。[方法]在电镀铜前,先采用以羟基乙叉二膦酸(HEDP)为主配位剂的溶液对NdFeB进行预浸。预浸液组成和工艺条件为:HEDP 20~30 g/L,氢氧化钾20~25 g/L,碳酸钾10~15 g/L,葡萄糖酸钾1~2 g/L,乙酸0.5~1.0 g/L,室温,时间60 s。通过电化学测试对比了Nd Fe B基体有无预浸处理时,铜在其表面的电沉积行为,并通过金相显微镜、扫描电镜、能谱仪和荧光光谱测厚仪,对比了有无预浸处理的Nd FeB基体表面Cu镀层的宏观和微观表面形貌、截面形貌、元素分布及厚度分布均匀性。[结果]Nd Fe B基体预浸后表面被活化,静态电位降低。预浸液能够填满基体表面的孔隙并形成一层水薄膜,在后续电镀铜时保护基体不被腐蚀。预浸处理的Nd Fe B基体表面所得Cu镀层均匀、致密,不易氧化发黑,结合力和耐蚀性较好。[结论]对烧结钕铁硼进行预浸处理,能够保证其在后续电镀铜过程不被腐蚀,提高Cu镀层的综合性能。
文摘It was reported that hemispheric corrosion occurred in copper tubes in an acetic acid environment. When hemispheric corrosion occurred, corrosion could easily progress if water then flowed into the copper pipe, and countermeasures were needed. Therefore, we studied the copper corrosion caused by acetic acid. The present work investigated the relationship between the corrosion form of copper and acetic acid concentration using phosphorous-deoxidized copper, and reported that hemispherical corrosion was observed at acetic acid concentrations of 0.01 to 1 vol.% (0.002 to 0.2 mol·L<sup>-1</sup>) in the immersion test. In this study, the effects of acetic acid and phosphate on copper corrosion were examined using oxygen-free copper in immersion tests. The results suggested that different concentrations of phosphate in acetic acid solutions and the presence or absence of acetic acid and phosphate affected the corrosion of copper, resulting in different corrosion forms and corrosion progress.
