A Creep Equation Based on Thermal Activation

The creep equation proposed in so called θ projection concept is developed in the concept of thermal activation of creep. The measured creep curves of A286 alloy are fitted by the equation. The activation energy in theequation is evaluated, and creep rupture lives are predicted. The results are confirmed by creep tests of up to 13years.

APPLICABILITY OF CREEP CONSTITUTIVE EQUATIONS TOCREEP CURVES UNDER CONSTANT LOAD

Applicability of the following creep constitutive equations was investigated for normal type creep curves of Ni-18.5Cr alloy and tertiary creep dominant curves of Ni-18.5Cr16W alloy under constant load: the θ projection method describing a creep curse by a sum of two exponential terms, modified θ method describing a primary creep stage by an exponential term and a tertiary creep stage by a logarithmic term, modified Ω method describing a creep curve by a sum of two logarithmic term, 2θ method with only a tertiary creep component and Ω method. The θ, modified θ and modified Ω methods can describe normal type and tertiary creep dominant curves. Tertiary creep dominant curves of Ni-18.5Cr-16W alloy at 900℃ are also described using 2θ and Ω methods. Applicability of the modified θ and modified Ω methods is superior for constant load creep curves because they can predict creep curves up to rupture and rupture life accurately and conservatively.

Steady State Creep Rate Equation of Inconel 718 Superalloy

The steady state creep rate equdtion of a nickel base superalloy Inconel 718, strengthened by coherent ordered disc-shaped bct γ^(11) phase and coherent spherical fcc γ~1 phase precipitates, has been established in the stress and temperature ranges of 620-840 MN m^(-2) and 853-943K, respecti- vely. Constant stress tensile creep tests were used to medsure the values of steady state creep rate, ε_s, and the consecutive stress reduction method was used to measure the back stress during creep deformation. The values of effective stress exponent, n_e, were detemined from the slopes of the lgε_s vs. lg(σ_a-σ_0)/G plots. The effect of grain size, d, on steady state creep rdte has been also studied in this investigation, and the grain size sensitive exponents m were detemined from the slopes of lgε_s vs. lg(b/d) plots. The creep rate equations of Inconel 718, in the above stress and temperature ranges, have been proposed to be ε_s=1.6×10^(-5)(D_1Gb/KT) (b/d )^(0.19)[(σ_a-σ_0)/G]^(1.35) in diffusional creep region, and ε_s =75(D_1Gb/KT) (b/d)^(-0.42)[(σ_a-σ_0)/G]^(5.5) in dislocation power law creep region.

CREEP BEHAVIOUR OF T300/5222(C/E)COMPOSITE LAMINATEWITH CROSS-PLY

A study is conducted on the creep behaviour of T300/5222 compositelaminate by expenmental and theoretical researches. Experimental results of creep,stress relaxation and historydependent stress-strain curves at different temperaturelevels are reported. Both loading and unloading processes are included. The locally av-eraged constitutive functionals are established on the basis of rational theimodynamics.Finally, a non-linear creep constitutive equation is constructed using the experimentaldata.

Effect of Thermal Cycling on Properties and Microstructure of SnAgCuCe Soldered Joints in QFP Devices

Increasing global concern about the environment is bringing regulatory （European directives） and consumer （＂green products＂） pressure on the electronics industry in Europe and Japan to reduce or completely eliminate the use of lead （Pb） in products. Among all lead-free solder alloys, SnAgCu solder system, which has better thermo-mechanical properties compared with those of SnPb solder, is proven to be one of the promising candidates for electronic assembly. Previous work also revealed that adding a small amount of rare earth Ce into SnAgCu solder can visibly improve the properties and inhibit the excessive growth of the intermetallic compound layer. Thermal fatigue properties of SnAgCuCe soldered joints in QFP devices under thermal conditions have been investigated by finite element method and experiments. Based on creep model of low stress and high stress, corresponding creep subroutine was established for simulating the stress and strain response of SnAgCuCe soldered joint from -55 ℃ to 125 ℃, and fatigue life was calculated using creep fatigue life prediction equation. Moreover, thermal cycling experiments were conducted, the experimental results were found to be close to the simulated results. In addition, the tensile force of SnAgCuCe soldered joints decreased with increasing number of thermal cycles, and the fracture mechanism transformed from toughness fracture to brittle intergranular fracture. Moreover the tensile force changes and fracture microstructure evolution could benefit the quantitative evaluations of the mechanical performances of lead-free soldered joints under thermal cycling loadings.

A Constitutive Model of Granite Shear Creep under Moisture

Previous constitutive models of granite shear creep have two limitations：（1） although moisture greatly affects granite shear creep behavior, currently there are no constitutive models that include this factor;（2） there are also no models that include an acceleration stage. This paper presents an improved Burgers constitutive model with the addition of a damage parameter to characterize the moisture effect and uses a nonlinear relation equation between stress and strain for inclusion as the acceleration stage. The damage parameter is determined from granite creep experiment under four different moisture contents（0%, 0.22%, 0.49%, and 0.79%）. The nonlinear relation equation is obtained by fitting a dataset of stain versus time under five different loading stages. To verify the presented model, a creep experiment was conducted on other granite samples and the results show that the model agrees well with the experimental observation data.