A complete small-signal HBT model including AC current crowding effect

An improved small-signal equivalent circuit of HBT concerning the AC current crowding effect is proposed in this paper. AC current crowding effect is modeled as a parallel RC circuit composed of Cbi and Rbi, with distributed base-collector junction capacitance also taken into account. The intrinsic portion is taken as a whole and extracted directly from the measured Sparameters in the whole frequency range of operation without any special test structures. An HBT device with a 2 × 20 μm^(2) emitter-area under three different biases were used to demonstrate the extraction and verify the accuracy of the equivalent circuit.

Effect of pad geometry on current density and temperature distributions in solder bump joints

Three-dimensional thermo-electrical finite element analyses were conducted to simulate the current density and temperature distributions in solder bump joints with different pad geometries.The effects of pad thickness,diameter and shape on current density and temperate distributions were investigated respectively.It was found that pads with larger thickness or/and diameter could reduce current density and temperature in solder bump significantly.Pad shapes affected the current density and temperature distributions in solder bumps.The relatively low current density and temperature didn＇t occur in the bump joint with traditional rounded pad but occurred in bump joints with octagonal and nonagonal pads respectively.Therefore,optimized pad geometry may be designed to alleviate the current crowding effect and reduce the bump temperature,and therefore delay electromigration failure and increase the mean-time-to-failure.

Study of Magnetic Force Distribution for Electromagnetic V-shape Bending Forming of Small Size Flat Sheet

Electromagnetic V-shape bending of small size sheet blank is investigated numerically and experimentally. Three-dimensional electromagnetic field models are established to calculate the magnetic force distribution on the sheet by software ANSYS / EMAG. Series of electromagnetic V-shape bending forming experiments are presented,in which small size uniform pressure coil and big size round flat spiral coil are used. The results show that small size uniform pressure coil is not suitable for electromagnetic forming of small size flat sheet,and the coil is susceptible to failure such as bulging,ablation and cracking. When the plane dimension of round flat spiral coil is bigger than sheet blank sizes,the induced current crowding effect will be resulted which seriously influence the magnetic force distribution on the sheet. In this case,magnetic force distribution can be adjusted through the change of the relative position between coil and sheet,the desired deformation can be obtained finally. Therefore,big size round flat spiral coil can be well applied to electromagnetic V-shape bending forming of small size flat sheet.

Characterization of the current crowding effect on chip surface using a quantum wide-field microscope

We characterize the current crowding effect for microwave radiation on a chip surface based on a quantum wide-field microscope combining a wide-field reconstruction technique. A swept microwave signal with the power of 0–30 d Bm is supplied to a dumbbell-shaped microstrip antenna, and the significant differences in microwave magnetic-field amplitudes attributed to the current crowding effect are experimentally observed in a 2.20 mm ×1.22 mm imaging area. The normalized microwave magnetic-field amplitude along the horizontal geometrical center of the image area further demonstrates the feasibility of the characterization of the current crowding effect. The experiments indicate the proposal can be qualified for the characterization of the anomalous area of the radio-frequency chip surface.

Design of MCI single and symmetrical on-chip spiral inductors

In this paper,the MCI（multipath crossover interconnection）technique for octagon single and symmetrical spiral inductors has been presented to improve the quality factor.The metal wires of the single and symmetrical inductors formed by the top metal are divided into multiple segments according to the depth of the skin effects.The outermost path of the metal is crossover-interconnected to the innermost path by the underlayer metal and via The crossover technique makes the lengths of the total current paths between two ports approximately equal to each other.Therefore,the induced magnetic flux and resistance of each path can be balanced and the Q-factor of spiral inductors can be enhanced.The proposed MCI technique has been validated by the electromagnetic simulation with the 130-nm 1P6M SiGe BiCMOS process.For the devices with occupying areas of 240 240 μm^2,results of electromagnetic simulation show that about 24%improvement in the Q-peak（3.3 GHz）of the MCI single inductor as compared to conventional single inductors（3.1 GHz）,and about 88.1%improvement in the Q-peak（3.2 GHz）of the MCI symmetrical inductor as compared to conventional symmetrical inductors（1.8 GHz）.