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Above 700 V superjunction MOSFETs fabricated by deep trench etching and epitaxial growth 被引量:1
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作者 李泽宏 任敏 +5 位作者 张波 马俊 胡涛 张帅 王非 陈俭 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2010年第8期48-52,共5页
Silicon superjunction power MOSFETs were fabricated with deep trench etching and epitaxial growth,based on the process platform of the Shanghai Hua Hong NEC Electronics Company Limited.The breakdown voltages of the fa... Silicon superjunction power MOSFETs were fabricated with deep trench etching and epitaxial growth,based on the process platform of the Shanghai Hua Hong NEC Electronics Company Limited.The breakdown voltages of the fabricated superjunction MOSFETs are above 700 V and agree with the simulation.The dynamic characteristics, especially reverse diode characteristics,are equivalent or even superior to foreign counterparts. 展开更多
关键词 SUPERJUNCTION deep trench etching epitaxial growth power MOSFET
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