The cutting performance of particle reinforced meta ll ic matrix composites (PRMMCs) SiC p/Al in ultrasonic vibration cutting and comm on cutting with carbide tools and PCD tools was experimentally researched in the p...The cutting performance of particle reinforced meta ll ic matrix composites (PRMMCs) SiC p/Al in ultrasonic vibration cutting and comm on cutting with carbide tools and PCD tools was experimentally researched in the paper. The changing rules of chip shape, deformation coefficient, shear angle a nd surface residual stress were presented by ultrasonic vibration cutting. Resul ts show: when adopting common cutting, spiral chip with smaller curl radius will be obtained. The chip with zigzag contour is short and thick. There are lots of sheet cracking both on the face of the chip and on the machined surface. That i s to say, the cutting process of metallic matrix composites(MMCs) is not all lik e the cutting process of plastic material. It is akin to the breaking process of brittle material. By comparison, when adopting ultrasonic cutting, because tool contacts with workpiece intermittently in high frequency, deformation of chip i s small, loose spiral chip with larger curl radius is long and thin. The phenome non is just similar to vibration cutting of plastic material. But the chip still belongs to plastic or semi-plastic segmental chip due to the structure charact eristics of the material itself. Furthermore, the tangential residual compressio n stress of vibration cutting is larger than that of common cutting, axial resid ual stress has a relation to the feed rate and residual stress does not changes obviously with cutting depth and they are in the same order of magnitude on the whole. According to the test result analyzing, the following conclusions are put forward: 1) The extruding deformation is serious in common cutting PRMMCs, defo rmation of it’s chip is larger, and the chip with lesser curl radius is short. Whereas, the deformation of chip in vibration cutting PRMMCs is lesser, the curl radius is bigger, and the loose chips are obtained at every turn. 2) The cuttin g deformation coefficient of chip in vibration cutting is lesser than that in co mmon cutting, however the shear angle is bigger. 3) The tangential residual compression stress of vibration cutting is larger than that of common cutting, a nd residual stress does not change obviously with cutting depth, they are in the same order of magnitude on the whole.展开更多
微操作平台处于温度变化的工作环境中会产生热误差、断裂或疲劳破坏等意外情况．为了提高基于直梁式柔性铰链的微操作平台的精度，采用有限元方法建立考虑温度效应的平台热响应模型，并基于该模型对其热误差和热应力进行分析．采用欧拉...微操作平台处于温度变化的工作环境中会产生热误差、断裂或疲劳破坏等意外情况．为了提高基于直梁式柔性铰链的微操作平台的精度，采用有限元方法建立考虑温度效应的平台热响应模型，并基于该模型对其热误差和热应力进行分析．采用欧拉‐伯努利梁模拟直梁式柔性铰链和杆件的力学行为，采用最小势能原理得到计入温度效应的微操作平台的力学方程．采用模态截断技术推导出温度变化与热误差、热应力之间的传递函数．以桥式微操作平台为算例分析温度变化对其性能的影响．分析结果表明：热误差对温度变化的灵敏度为0.192μm／℃，温度变化会产生较大的静态热误差；通过选择合理的结构参数可减小热误差；当单位温度变化时会产生0～0．21μm振动和11.6 M Pa的热应力，在动态热载荷作用下会产生较大的热振动和热应力．所以，不能忽略温度效应对微操作平台的影响，需要通过优化设计和热误差补偿策略减小其影响．展开更多
文摘The cutting performance of particle reinforced meta ll ic matrix composites (PRMMCs) SiC p/Al in ultrasonic vibration cutting and comm on cutting with carbide tools and PCD tools was experimentally researched in the paper. The changing rules of chip shape, deformation coefficient, shear angle a nd surface residual stress were presented by ultrasonic vibration cutting. Resul ts show: when adopting common cutting, spiral chip with smaller curl radius will be obtained. The chip with zigzag contour is short and thick. There are lots of sheet cracking both on the face of the chip and on the machined surface. That i s to say, the cutting process of metallic matrix composites(MMCs) is not all lik e the cutting process of plastic material. It is akin to the breaking process of brittle material. By comparison, when adopting ultrasonic cutting, because tool contacts with workpiece intermittently in high frequency, deformation of chip i s small, loose spiral chip with larger curl radius is long and thin. The phenome non is just similar to vibration cutting of plastic material. But the chip still belongs to plastic or semi-plastic segmental chip due to the structure charact eristics of the material itself. Furthermore, the tangential residual compressio n stress of vibration cutting is larger than that of common cutting, axial resid ual stress has a relation to the feed rate and residual stress does not changes obviously with cutting depth and they are in the same order of magnitude on the whole. According to the test result analyzing, the following conclusions are put forward: 1) The extruding deformation is serious in common cutting PRMMCs, defo rmation of it’s chip is larger, and the chip with lesser curl radius is short. Whereas, the deformation of chip in vibration cutting PRMMCs is lesser, the curl radius is bigger, and the loose chips are obtained at every turn. 2) The cuttin g deformation coefficient of chip in vibration cutting is lesser than that in co mmon cutting, however the shear angle is bigger. 3) The tangential residual compression stress of vibration cutting is larger than that of common cutting, a nd residual stress does not change obviously with cutting depth, they are in the same order of magnitude on the whole.
文摘微操作平台处于温度变化的工作环境中会产生热误差、断裂或疲劳破坏等意外情况．为了提高基于直梁式柔性铰链的微操作平台的精度，采用有限元方法建立考虑温度效应的平台热响应模型，并基于该模型对其热误差和热应力进行分析．采用欧拉‐伯努利梁模拟直梁式柔性铰链和杆件的力学行为，采用最小势能原理得到计入温度效应的微操作平台的力学方程．采用模态截断技术推导出温度变化与热误差、热应力之间的传递函数．以桥式微操作平台为算例分析温度变化对其性能的影响．分析结果表明：热误差对温度变化的灵敏度为0.192μm／℃，温度变化会产生较大的静态热误差；通过选择合理的结构参数可减小热误差；当单位温度变化时会产生0～0．21μm振动和11.6 M Pa的热应力，在动态热载荷作用下会产生较大的热振动和热应力．所以，不能忽略温度效应对微操作平台的影响，需要通过优化设计和热误差补偿策略减小其影响．
