单级高频AC/AC变换器将工频交流输入电压变换为高频(一般大于100 k Hz)交流输出电压,主要由功率因数校正、高频谐振逆变两个功能单元构成。结合单级高频AC/AC变换器的性能分析结果,提出一种参数定量设计方法。首先分析设计的已知参数,...单级高频AC/AC变换器将工频交流输入电压变换为高频(一般大于100 k Hz)交流输出电压,主要由功率因数校正、高频谐振逆变两个功能单元构成。结合单级高频AC/AC变换器的性能分析结果,提出一种参数定量设计方法。首先分析设计的已知参数,再根据单级高频AC/AC变换器的性能要求,确定相关预设参数。然后根据上述已知及预设参数,对功率因数校正单元和高频谐振逆变单元进行详细的参数设计,还根据储能电容电压纹波大小的要求,确定储能电容的大小。最后给出具体设计实例,并进行实验验证,实验结果验证了该设计方法的正确性。由于单级高频AC/AC变换器的拓扑推导思路来源于单级功率因数校正器,该设计方法对单级功率因数校正器的设计具有借鉴意义。展开更多
The horizontal bearing behavior of a single batter pile(SBP)is vital to its application in practical engineering;however,the horizontal responses of SBPs change with the directions of horizontal loads,and this phenome...The horizontal bearing behavior of a single batter pile(SBP)is vital to its application in practical engineering;however,the horizontal responses of SBPs change with the directions of horizontal loads,and this phenomenon is rarely investigated.Therefore,the directional differences in the horizontal bearing behaviors of SBPs are investigated in this study.Four model tests are conducted to preliminarily examine the effects of the skew angle of horizontal loads on the horizontal bearing capacities and distributions of the bending moments of the SBPs.Subsequently,the differences in the responses of the SBPs under horizontal loads in various directions at full scale are analyzed comprehensively via finite-element(FE)analysis.The effects of the skew angle on SBP-soil interaction are discussed.Moreover,an empirical design method is proposed based on the FE analysis results to predict the bearing ratios of SBPs in medium-dense and dense sand while considering the effects of the skew angle,batter angle,and pile diameter.The method is confirmed to be effective,as confirmed by the close agreement between the predicting results with the model test(reported in this study)and centrifuge model test results(reported in the literature).展开更多
Firstly, this paper presents an orthogonal test of six factors and five levels, called the chemical mechanical polishing （CMP） process parameters experiment, for determining the best process parameters and ranking t...Firstly, this paper presents an orthogonal test of six factors and five levels, called the chemical mechanical polishing （CMP） process parameters experiment, for determining the best process parameters and ranking the influencing factors from primary to secondary. The three most important factors are the polishing pressure, the polishing liquid concentration and the relative velocity ratio of polishing disk to polishing carrier. Then, based on this analysis, the three factors and three levels of the quadratic orthogonal regression test are put forward. A math- ematical model impacting the surface roughness has also been set up. Finally, this work has achieved a polished wafer, whose material removal rate （MRR） is in the range of 70-90 nm/h and the surface roughness （Ra） is between 0.3 nm and 0.5 nm.展开更多
文摘单级高频AC/AC变换器将工频交流输入电压变换为高频(一般大于100 k Hz)交流输出电压,主要由功率因数校正、高频谐振逆变两个功能单元构成。结合单级高频AC/AC变换器的性能分析结果,提出一种参数定量设计方法。首先分析设计的已知参数,再根据单级高频AC/AC变换器的性能要求,确定相关预设参数。然后根据上述已知及预设参数,对功率因数校正单元和高频谐振逆变单元进行详细的参数设计,还根据储能电容电压纹波大小的要求,确定储能电容的大小。最后给出具体设计实例,并进行实验验证,实验结果验证了该设计方法的正确性。由于单级高频AC/AC变换器的拓扑推导思路来源于单级功率因数校正器,该设计方法对单级功率因数校正器的设计具有借鉴意义。
基金supported by the National Natural Science Foundation of China(Grant Nos.52178358,52108349,and 51779217)the Key Project of the Natural Science Foundation of Zhejiang Province(No.LXZ22E080001).
文摘The horizontal bearing behavior of a single batter pile(SBP)is vital to its application in practical engineering;however,the horizontal responses of SBPs change with the directions of horizontal loads,and this phenomenon is rarely investigated.Therefore,the directional differences in the horizontal bearing behaviors of SBPs are investigated in this study.Four model tests are conducted to preliminarily examine the effects of the skew angle of horizontal loads on the horizontal bearing capacities and distributions of the bending moments of the SBPs.Subsequently,the differences in the responses of the SBPs under horizontal loads in various directions at full scale are analyzed comprehensively via finite-element(FE)analysis.The effects of the skew angle on SBP-soil interaction are discussed.Moreover,an empirical design method is proposed based on the FE analysis results to predict the bearing ratios of SBPs in medium-dense and dense sand while considering the effects of the skew angle,batter angle,and pile diameter.The method is confirmed to be effective,as confirmed by the close agreement between the predicting results with the model test(reported in this study)and centrifuge model test results(reported in the literature).
基金Project supported by the National Natural Science Foundation of China(No.51375266)
文摘Firstly, this paper presents an orthogonal test of six factors and five levels, called the chemical mechanical polishing （CMP） process parameters experiment, for determining the best process parameters and ranking the influencing factors from primary to secondary. The three most important factors are the polishing pressure, the polishing liquid concentration and the relative velocity ratio of polishing disk to polishing carrier. Then, based on this analysis, the three factors and three levels of the quadratic orthogonal regression test are put forward. A math- ematical model impacting the surface roughness has also been set up. Finally, this work has achieved a polished wafer, whose material removal rate （MRR） is in the range of 70-90 nm/h and the surface roughness （Ra） is between 0.3 nm and 0.5 nm.
