A copolymer of bismaleimide-diallylbisphenol A-diphenylsilandiol was synthesized and the copolymerisation was studied by using N-phenylmaleimide, bisphenol A and diphenyl-silandiol as model compounds. The copolymer co...A copolymer of bismaleimide-diallylbisphenol A-diphenylsilandiol was synthesized and the copolymerisation was studied by using N-phenylmaleimide, bisphenol A and diphenyl-silandiol as model compounds. The copolymer could be well. cured around 200 degrees C, and the cured resins had good thermal stability. In the range of 170-210 degrees C, a higher curing temperature was favorable to obtain more thermal stable resin by reducing the content of diphenylsilandiol cyclo-homopolymer in resin which would spoil its-thermal stability.展开更多
文摘A copolymer of bismaleimide-diallylbisphenol A-diphenylsilandiol was synthesized and the copolymerisation was studied by using N-phenylmaleimide, bisphenol A and diphenyl-silandiol as model compounds. The copolymer could be well. cured around 200 degrees C, and the cured resins had good thermal stability. In the range of 170-210 degrees C, a higher curing temperature was favorable to obtain more thermal stable resin by reducing the content of diphenylsilandiol cyclo-homopolymer in resin which would spoil its-thermal stability.
