New Vitrified Bond Diamond Grinding Wheel for Grinding the Cylinder of Polycrystalline Diamond Compacts

In this work, a kind of new vitrified bond based on Li2O-Al2O3-SiO2 glass ceramics was used to bond the diamond grains, which is made into grinding wheel and the cylindrical grinding process of polycrystalline diamond compacts （PDCs） by using the new vitrified bond diamond grinding wheel was discussed. Several factors which influence the properties of grinding wheel such as amount of vitrified bond and the kinds and amount of stuff in grinding wheel were also investigated. It was found that the new vitrified bond can firmly combine diamond grains, when there are only diamonds and vitrified bond in the structure of grinding wheel, the longevity of the grinding wheel is about 2.5-3 times as that of resin bond grinding wheel for processing PDCs. The grinding size precision of PDCs can be improved from 4-0.03 mm to 4-0.01 mm because of larger Young＇s modulus of vitrified bond than resin bond. The grinding time of a PDC product can be 1.75-2.0 min from 3.25-3.5 min, so this kind of grinding wheel can save much time for processing PDCs. Also, there is hardly noise when using this new vitrified bond diamond grinding wheel to process PDCs. The amount of vitrified bond in grinding wheel influences the longevity of grinding wheel. When the size of diamond grains is 90-107 μm, the optimal amount of vitrified bond in grinding wheel is 21% （wt pct）. When the amount of vitrified bond exceeds 21%, there are many pores in grinding block, which will decrease the longevity of grinding wheel. The existence of addition stuff such as Al2O3 or SiC can reduce the longevity of grinding wheel.

High Efficiency Axial Deep Creep-Feed Grinding Machining Technology of Engineering Ceramics Materials

Axial deep creep-feed grinding machining technology is a high efficiency process method of engineering ceramics materials, which is an original method to process the cylindrical ceramics materials or hole along its axis. The analysis of axial force and edge fracture proved the cutting thickness and feed rate could be more than 5-10 mm and 200 mm/min respectively in once process, and realized high efficiency, low-cost process of engineering ceramics materials. Compared with high speed-deep grinding machining, this method is also a high efficiency machining technology of engineering ceramics materials as well as with low cost. In addition, removal mechanism analyses showed that both median/radial cracks and lateral cracks appeared in the part to be removed, and the processed part is seldom destroyed, only by adjusting the axial force to control the length of transverse cracks.

Material Removal Behavior and Surface Integrity in Grinding of UltrafineGrained WC-Co Materials

Due to the excellent combination of wear resistance and fracture toughness,the ultrafine-grained WC-Co composites can significantly improve the durability and reliability of industrial tools.However,the grinding of ultrafine-grained WC-Co remains a challenge.In order to provide an experimental basis for improving grinding quality of ultrafine-grained WC-Co,a series of surface grinding experiments on ultrafine-grained WC-Co hardmetals were conducted by diamond wheel under various grinding conditions,and the material removal behavior and surface integrity in grinding of ultrafine-grained WC-Co materials were characterized by means of scanning electron microscopy(SEM),X-ray microstress analyzer and surface roughness analyzer in this paper.The results indicate that the material removal behavior in grinding of ultrafine-grained WC-Co materials is determined not only by the abrasive grain size on the wheel,but also by the depth of cut.The roughness values of ground surface increase with increasing grit size of diamond wheel,and increase initially,then decrease with increase in depth of cut.Grinding causes the residual compressive stress in the surface layer of ground cemented carbides under various grinding conditions;the magnitude of residual surface stress increases with increasing grit size of diamond wheel,and isn't changed obviously along with the change of depth of cut.