With rapid developments in the field of very large-scale integrated circuits,heat dissipation has emerged as a significant factor that restricts the high-density integration of chips.Due to their high thermal conducti...With rapid developments in the field of very large-scale integrated circuits,heat dissipation has emerged as a significant factor that restricts the high-density integration of chips.Due to their high thermal conductivity and low thermal expansion coefficient,diamond/Cu composites have attracted considerable attention as a promising thermal management material.In this study,a surface tungsten carbide gradient layer coating of diamond particles has been realized using comprehensive magnetron sputtering technology and a heat treatment process.Diamond/Cu composites were prepared using high-temperature and high-pressure technology.The results show that,by adjusting the heat treatment process,tungsten carbide and di-tungsten carbide are generated by an in situ reaction at the tungsten–diamond interface,and W–WC–W_(2)C gradient layer-coated diamond particles were obtained.The diamond/Cu composites were sintered by high-temperature and high-pressure technology,and the density of surface-modified diamond/Cu composites was less than 4 g cm^(-3).The W–WC–W_(2)C@diamond/Cu composites have a thermal diffusivity as high as 331 mm^(2)s^(-1),and their thermal expansion coefficient is as low as 1.76×10^(-6)K^(-1).The interface coherent structure of the gradient layer-coated diamond/copper composite can effectively improve the interface heat transport efficiency.展开更多
In this paper,diamond/CuCr and diamond/CuB composites were prepared using the pressure infiltration method.The physical property measurement system(PPMS)was adopted to evaluate the thermal conductivity of diamond/Cu a...In this paper,diamond/CuCr and diamond/CuB composites were prepared using the pressure infiltration method.The physical property measurement system(PPMS)was adopted to evaluate the thermal conductivity of diamond/Cu and MoCu composites within the range of100–350 K,and a scanning electron microscope(SEM)was utilized to analyze the microstructure and fracture appearance of the materials.The research indicates that the thermal conductivity of diamond/Cu composite within the range of100–350 K is 2.5–3.0 times that of the existing MoCu material,and the low-temperature thermal conductivity of diamond/Cu composite presents an exponential relationship with the temperature.If B element was added to a Cu matrix and a low-temperature binder was used for prefabricated elements,favorable interfacial adhesion,relatively high interfacial thermal conductivity,and favorable low-temperature heat conduction characteristics would be apparent.展开更多
Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature （HPHT） sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding ...Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature （HPHT） sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding strength and thermo-physical properties of the composites were achieved using an atomized copper alloy with minor additions of Co, Cr, 13, and Ti. The thermal conductivity （TC） oh- mined exhibited as high as 688 W.m-1.K-1, but also as low as 325 W.m-1.K-l. A large variation in TC can be rationalized by the discrepancy of diamond-matrix interfacial bonding. It was found from fractography that preferential bonding between diamond and the Cu-alloy matrix occurred only on the diamond {100} faces. EDS analysis and Raman spectra suggested that selective interfacial bonding may be attributed to amorphous carbon increasing the wettability between diamond and the Cu-alloy matrix. Amorphous carbon was found to significantly affect the TC of the composite by interface modification.展开更多
Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature （HPHT） infiltration technique. Their microstructural evolution and thermal conductivity were presented as ...Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature （HPHT） infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters （temperature, pressure, and time）. The improvement in interfacial bonding strength and the maximum thermM conductivity of 750 W/（m.K） were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.展开更多
To acquire a well bonded interface between the copper and the diamond particles in diamondcopper matrix composites, an available process to apply a vapor deposited aluminum（Al） coating onto diamond particles was use...To acquire a well bonded interface between the copper and the diamond particles in diamondcopper matrix composites, an available process to apply a vapor deposited aluminum（Al） coating onto diamond particles was used to solve this interfacial problem. The diamond-copper matrix composites were prepared by spark plasma sintering（SPS） process and the effect of Al-coated diamond particles was demonstrated. The experimental results showed that the densification, interfacial bonding and thermal conductivity of Al-coated composites were evidently improved compared to those of the uncoated composites. A maximum thermal conductivity（TC） of 565 W/（m·K） was obtained in the coated composite containing 50vol% diamond particles sintered at 1163 K. Additionally, the experimental data of thermal conductivity and coefficient of thermal expansion（CTE） were compared with the predictions from several theoretical models.展开更多
Cr-coated diamond/Cu composites were prepared by spark plasma sintering. The effects of sintering pressure, sintering temperature, sintering duration, and Cu powder particle size on the relative density and thermal co...Cr-coated diamond/Cu composites were prepared by spark plasma sintering. The effects of sintering pressure, sintering temperature, sintering duration, and Cu powder particle size on the relative density and thermal conductivity of the composites were investigated in this paper. The influence of these parameters on the properties and microstructures of the composites was also discussed. The results show that the relative density of Cr-coated diamond/Cu reaches ~100% when the composite is gradually compressed to 30 MPa during the heating process. The densification temperature increases from 880 to 915℃ when the diamond content is increased from 45vol% to 60vol%. The densification temperature does not increase further when the content reaches 65vol%. Cu powder particles in larger size are beneficial for increasing the relative density of the composite.展开更多
A Ti interlayer with thickness about 300 nm was sputtered on Cu microchannels, followed by an ultrasonic seeding with nanodiamond powders. Adherent diamond film with crystalline grains close to thermal equilibrium sha...A Ti interlayer with thickness about 300 nm was sputtered on Cu microchannels, followed by an ultrasonic seeding with nanodiamond powders. Adherent diamond film with crystalline grains close to thermal equilibrium shape was tightly deposited by hot-filament chemical vapor deposition(HF-CVD). The nucleation and growth of diamond were investigated with micro-Raman spectroscope and field emission scanning electron microscope(FE-SEM) with energy dispersive X-ray detector(EDX). Results show that the nucleation density is found to be up to 1010 cm-2. The enhancement of the nucleation kinetics can be attributed to the nanometer rough Ti interlayer surface. An improved absorption of nanodiamond particles is found, which act as starting points for the diamond nucleation during HF-CVD process. Furthermore, finite element simulation was conducted to understand the thermal management properties of prepared diamond/Cu microchannel heat sink.展开更多
To improve the surface quality for aluminum alloy 6061(Al6061) in ultra-precision machining, we investigated the factors affecting the surface finish in single point diamond turning(SPDT)by studying influence of the p...To improve the surface quality for aluminum alloy 6061(Al6061) in ultra-precision machining, we investigated the factors affecting the surface finish in single point diamond turning(SPDT)by studying influence of the precipitates generation of Al6061 on surface integrity and surface roughness.Based on the Johnson-Mehl-Avrami solid phase transformation kinetics equation, theoretical and experimental studies were conducted to build the relationship between the aging condition and the type, size and number of the precipitates for Al6061. Diamond cutting experiments were conducted to machine Al6061 samples under different aging conditions. The experimental results show that, the protruding on the chip surface is mainly Mg_(2)Si and the scratches on the machined surface mostly come from the iron-containing phase(α-, β-AlFeSi).Moreover, the generated Mg_(2)Si and α-, β-AlFeSi affect the surface integrity and the diamond turned surface roughness. Especially, the achieved surface roughness in SPDT is consistent with the variation of the number of AlFeSi and Mg_(2)Si with the medium size(more than 1 μm and less than 2 μm) in Al6061.展开更多
Diamond/aluminium composites have attracted attention in the field of thermal management of electronic packaging for their excellent properties.In order to solve the interfacial problem between diamond and aluminium,a...Diamond/aluminium composites have attracted attention in the field of thermal management of electronic packaging for their excellent properties.In order to solve the interfacial problem between diamond and aluminium,a novel process combining pressure infiltration with vacuum-assisted technology was proposed to prepare diamond/aluminum composites.The effect of diamond particle size on the microstructure and properties of the diamond/Al-12Si composites was investigated.The results show that the diamond/Al-12Si composites exhibit high relative density and a uniform microstructure.Both thermal conductivity and coefficient of thermal expansion increase with increasing particle size,while the bending strength exhibits the opposite trend.When the average diamond particle size increases from 45μm to 425μm,the thermal conductivity of the composites increases from 455 W·m^(-1)·K^(-1)to 713 W·m^(-1)·K^(-1)and the coefficient of thermal expansion increases from 4.97×10^(-6)K^(-1)to 6.72×10^(-6)K^(-1),while the bending strength decreases from 353 MPa to 246 MPa.This research demonstrates that high-quality composites can be prepared by the vacuum-assisted pressure infiltration process and the thermal conductivity of the composites can be effectively improved by increasing the diamond particle size.展开更多
A photonic crystal nanobeam cavity(M-PCNC)with a structure incorporating a mixture of diamond-shaped and circular air holes is pro-posed.The performance of the cavity is simulated and studied theoretically.Using thefin...A photonic crystal nanobeam cavity(M-PCNC)with a structure incorporating a mixture of diamond-shaped and circular air holes is pro-posed.The performance of the cavity is simulated and studied theoretically.Using thefinite-difference time-domain method,the parameters of the M-PCNC,including cavity thickness and width,lattice constant,and radii and numbers of holes,are optimized,with the quality factor Q and mode volume Vm as performance indicators.Mutual modulation of the lattice constant and hole radius enable the proposed M-PCNC to realize outstanding performance.The optimized cavity possesses a high quality factor Q 1.45105 and an ultra-small mode=×volume Vm 0.01(λ/n)[Zeng et al.,Opt Lett 2023:48;3981–3984]in the telecommunications wavelength range.Light can be progres-=sively squeezed in both the propagation direction and the perpendicular in-plane direction by a series of interlocked anti-slots and slots in the diamond-shaped hole structure.Thereby,the energy can be confined within a small mode volume to achieve an ultra-high Q/Vm ratio.展开更多
基金National Natural Science Foundation of China(Grant No.52072327)the China National Key R&D Program(2021YFB3701802)+6 种基金Scientific and Technological Projects of Henan Province(No.232102231050)the Higher Education and Teaching Reformation Project(2014SJGLX064)the Project for Work-station of Zhongyuan scholars of Henan Province(Nos.214400510002,224400510023)the Science and Technology Major Project of Henan Province(No.221100230300)the Postgraduate Education Reform and QualityAcademic Degrees&Graduate Education Reform Project of Henan Province(No.2021SJGLX060Y)the Postgraduate Education Reform and Quality Improvement Project of Henan Province(No.YJS2022JD34)the Science and Technology on Plasma Physics Laboratory(Grant No.JCKYS2021212010).
文摘With rapid developments in the field of very large-scale integrated circuits,heat dissipation has emerged as a significant factor that restricts the high-density integration of chips.Due to their high thermal conductivity and low thermal expansion coefficient,diamond/Cu composites have attracted considerable attention as a promising thermal management material.In this study,a surface tungsten carbide gradient layer coating of diamond particles has been realized using comprehensive magnetron sputtering technology and a heat treatment process.Diamond/Cu composites were prepared using high-temperature and high-pressure technology.The results show that,by adjusting the heat treatment process,tungsten carbide and di-tungsten carbide are generated by an in situ reaction at the tungsten–diamond interface,and W–WC–W_(2)C gradient layer-coated diamond particles were obtained.The diamond/Cu composites were sintered by high-temperature and high-pressure technology,and the density of surface-modified diamond/Cu composites was less than 4 g cm^(-3).The W–WC–W_(2)C@diamond/Cu composites have a thermal diffusivity as high as 331 mm^(2)s^(-1),and their thermal expansion coefficient is as low as 1.76×10^(-6)K^(-1).The interface coherent structure of the gradient layer-coated diamond/copper composite can effectively improve the interface heat transport efficiency.
基金supported by the National Natural Science Foundation of China (No. 50971020)
文摘In this paper,diamond/CuCr and diamond/CuB composites were prepared using the pressure infiltration method.The physical property measurement system(PPMS)was adopted to evaluate the thermal conductivity of diamond/Cu and MoCu composites within the range of100–350 K,and a scanning electron microscope(SEM)was utilized to analyze the microstructure and fracture appearance of the materials.The research indicates that the thermal conductivity of diamond/Cu composite within the range of100–350 K is 2.5–3.0 times that of the existing MoCu material,and the low-temperature thermal conductivity of diamond/Cu composite presents an exponential relationship with the temperature.If B element was added to a Cu matrix and a low-temperature binder was used for prefabricated elements,favorable interfacial adhesion,relatively high interfacial thermal conductivity,and favorable low-temperature heat conduction characteristics would be apparent.
基金supported by the National Natural Science Foundation of China (No.50971020) National High-Tech Research and Development Program of China (No.2008AA03Z505)
文摘Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature （HPHT） sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding strength and thermo-physical properties of the composites were achieved using an atomized copper alloy with minor additions of Co, Cr, 13, and Ti. The thermal conductivity （TC） oh- mined exhibited as high as 688 W.m-1.K-1, but also as low as 325 W.m-1.K-l. A large variation in TC can be rationalized by the discrepancy of diamond-matrix interfacial bonding. It was found from fractography that preferential bonding between diamond and the Cu-alloy matrix occurred only on the diamond {100} faces. EDS analysis and Raman spectra suggested that selective interfacial bonding may be attributed to amorphous carbon increasing the wettability between diamond and the Cu-alloy matrix. Amorphous carbon was found to significantly affect the TC of the composite by interface modification.
基金supported by the National Natural Science Foundation of China (No. 50971020)the National High-Tech Research and Development Program of China (No. 2008AA03Z505)
文摘Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature （HPHT） infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters （temperature, pressure, and time）. The improvement in interfacial bonding strength and the maximum thermM conductivity of 750 W/（m.K） were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.
基金Funded by the National Natural Science Foundation of China(21273192)the Foundation of He’nan Educational Committee(15B430009)the Key Scientific Research Foundation of Xuchang University(2014077)
文摘To acquire a well bonded interface between the copper and the diamond particles in diamondcopper matrix composites, an available process to apply a vapor deposited aluminum（Al） coating onto diamond particles was used to solve this interfacial problem. The diamond-copper matrix composites were prepared by spark plasma sintering（SPS） process and the effect of Al-coated diamond particles was demonstrated. The experimental results showed that the densification, interfacial bonding and thermal conductivity of Al-coated composites were evidently improved compared to those of the uncoated composites. A maximum thermal conductivity（TC） of 565 W/（m·K） was obtained in the coated composite containing 50vol% diamond particles sintered at 1163 K. Additionally, the experimental data of thermal conductivity and coefficient of thermal expansion（CTE） were compared with the predictions from several theoretical models.
基金financially supported by the National Natural Science Foundation of China (No. 51374028)
文摘Cr-coated diamond/Cu composites were prepared by spark plasma sintering. The effects of sintering pressure, sintering temperature, sintering duration, and Cu powder particle size on the relative density and thermal conductivity of the composites were investigated in this paper. The influence of these parameters on the properties and microstructures of the composites was also discussed. The results show that the relative density of Cr-coated diamond/Cu reaches ~100% when the composite is gradually compressed to 30 MPa during the heating process. The densification temperature increases from 880 to 915℃ when the diamond content is increased from 45vol% to 60vol%. The densification temperature does not increase further when the content reaches 65vol%. Cu powder particles in larger size are beneficial for increasing the relative density of the composite.
基金Project(21271188) supported by the National Natural Science Foundation of China
文摘A Ti interlayer with thickness about 300 nm was sputtered on Cu microchannels, followed by an ultrasonic seeding with nanodiamond powders. Adherent diamond film with crystalline grains close to thermal equilibrium shape was tightly deposited by hot-filament chemical vapor deposition(HF-CVD). The nucleation and growth of diamond were investigated with micro-Raman spectroscope and field emission scanning electron microscope(FE-SEM) with energy dispersive X-ray detector(EDX). Results show that the nucleation density is found to be up to 1010 cm-2. The enhancement of the nucleation kinetics can be attributed to the nanometer rough Ti interlayer surface. An improved absorption of nanodiamond particles is found, which act as starting points for the diamond nucleation during HF-CVD process. Furthermore, finite element simulation was conducted to understand the thermal management properties of prepared diamond/Cu microchannel heat sink.
基金Funded by Natural Science Foundation of Guangdong Province,China (No.2017A030313330)Science and Technology Program of Guangzhou (No.201804020040)。
文摘To improve the surface quality for aluminum alloy 6061(Al6061) in ultra-precision machining, we investigated the factors affecting the surface finish in single point diamond turning(SPDT)by studying influence of the precipitates generation of Al6061 on surface integrity and surface roughness.Based on the Johnson-Mehl-Avrami solid phase transformation kinetics equation, theoretical and experimental studies were conducted to build the relationship between the aging condition and the type, size and number of the precipitates for Al6061. Diamond cutting experiments were conducted to machine Al6061 samples under different aging conditions. The experimental results show that, the protruding on the chip surface is mainly Mg_(2)Si and the scratches on the machined surface mostly come from the iron-containing phase(α-, β-AlFeSi).Moreover, the generated Mg_(2)Si and α-, β-AlFeSi affect the surface integrity and the diamond turned surface roughness. Especially, the achieved surface roughness in SPDT is consistent with the variation of the number of AlFeSi and Mg_(2)Si with the medium size(more than 1 μm and less than 2 μm) in Al6061.
文摘Diamond/aluminium composites have attracted attention in the field of thermal management of electronic packaging for their excellent properties.In order to solve the interfacial problem between diamond and aluminium,a novel process combining pressure infiltration with vacuum-assisted technology was proposed to prepare diamond/aluminum composites.The effect of diamond particle size on the microstructure and properties of the diamond/Al-12Si composites was investigated.The results show that the diamond/Al-12Si composites exhibit high relative density and a uniform microstructure.Both thermal conductivity and coefficient of thermal expansion increase with increasing particle size,while the bending strength exhibits the opposite trend.When the average diamond particle size increases from 45μm to 425μm,the thermal conductivity of the composites increases from 455 W·m^(-1)·K^(-1)to 713 W·m^(-1)·K^(-1)and the coefficient of thermal expansion increases from 4.97×10^(-6)K^(-1)to 6.72×10^(-6)K^(-1),while the bending strength decreases from 353 MPa to 246 MPa.This research demonstrates that high-quality composites can be prepared by the vacuum-assisted pressure infiltration process and the thermal conductivity of the composites can be effectively improved by increasing the diamond particle size.
基金supported by the Open Fund of the State Key Laboratory of Advanced Optical Communication Systems and Networks (SJTU)(Grant No. 2023GZKF018)the Open Fund of IPOC (BUPT)(Grant No. IPOC2021B03)+4 种基金the National Natural Science Foundation of China (NSFC)(Grant No. 11974188)the China Postdoctoral Science Foundation (Grant Nos. 2021T140339 and 2018M632345)the Jiangsu Province Postdoctoral Science Foundation (Grant No. 2021K617C)the Postgraduate Research and Practice Innovation Program of Jiangsu Province (Grant No.KYCX22_0945)the Qing Lan Project of Jiangsu Province
文摘A photonic crystal nanobeam cavity(M-PCNC)with a structure incorporating a mixture of diamond-shaped and circular air holes is pro-posed.The performance of the cavity is simulated and studied theoretically.Using thefinite-difference time-domain method,the parameters of the M-PCNC,including cavity thickness and width,lattice constant,and radii and numbers of holes,are optimized,with the quality factor Q and mode volume Vm as performance indicators.Mutual modulation of the lattice constant and hole radius enable the proposed M-PCNC to realize outstanding performance.The optimized cavity possesses a high quality factor Q 1.45105 and an ultra-small mode=×volume Vm 0.01(λ/n)[Zeng et al.,Opt Lett 2023:48;3981–3984]in the telecommunications wavelength range.Light can be progres-=sively squeezed in both the propagation direction and the perpendicular in-plane direction by a series of interlocked anti-slots and slots in the diamond-shaped hole structure.Thereby,the energy can be confined within a small mode volume to achieve an ultra-high Q/Vm ratio.
