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Fluid simulation of the effect of a dielectric window with high temperature on plasma parameters in inductively coupled plasma
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作者 李娜 韩道满 +3 位作者 张权治 刘旭辉 王英杰 王友年 《Plasma Science and Technology》 SCIE EI CAS CSCD 2023年第3期51-61,共11页
To maintain the high-density plasma source in inductively coupled plasma(ICP),very high radiofrequency power is often delivered to the antenna,which can heat the dielectric windows near the antenna to high temperature... To maintain the high-density plasma source in inductively coupled plasma(ICP),very high radiofrequency power is often delivered to the antenna,which can heat the dielectric windows near the antenna to high temperature.This high temperature can modulate the plasma characteristics to a large degree.We thus study the effect of dielectric window temperature on plasma parameters in two different ICP structures based on COMSOL software.The distributions of various plasma species are examined at different dielectric window temperatures.The concentration of neutral gas is found to be largely modulated at high dielectric window temperature,which further affects the electron collision probability with neutrals and the electron temperature.However,the electron density profiles are barely affected by the dielectric window temperature,which is mainly concentrated at the center of the reactor due to the fixed power input and pressure. 展开更多
关键词 fluid simulation metastable argon dielectric window temperature inductively coupled plasma
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Modulation of the plasma uniformity by coil and dielectric window structures in an inductively coupled plasma
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作者 孙晓艳 张钰如 +2 位作者 叶静 王友年 何建新 《Plasma Science and Technology》 SCIE EI CAS CSCD 2021年第9期111-122,共12页
The effects of coil and dielectric window structures on the plasma distribution are examined in a cylindrically symmetric planar inductively coupled plasma(ICP).A two-dimensional(2 D)fluid model is employed to investi... The effects of coil and dielectric window structures on the plasma distribution are examined in a cylindrically symmetric planar inductively coupled plasma(ICP).A two-dimensional(2 D)fluid model is employed to investigate the design issues of ICP source for etching.When the gradient coil structure is applied at 400 W and 20 mTorr,the ionization rate caused by the power deposition decreases at the reactor center as compared to that in a reactor with a planar coil above the planar dielectric window,and a rather uniform plasma is obtained.However,for the vertical coil geometry,all the coils move to the position of the outermost coil,and the peaks of the power deposition and ionization rate appear at the radial edge of the substrate.In this case,the plasma density is characterized by an edge-high profile.Further,it is observed that the plasma uniformity is improved by increasing the source power under a gas pressure of 20 mTorr and becomes better when the gas pressure increases to 30 mTorr with the source power being fixed at400 W in the gradient coil configuration,but the uniformity of plasma worsens with the rising source power or pressure due to the strong localization in the vertical coil geometry.Moreover,when the discharge is sustained in a reactor with a stepped dielectric window at r=0.135 m,the best plasma uniformity is obtained at 400 W and 20 m Torr because the ionization rate is enhanced at the outermost coil,and the dielectric window at r=0.135 m blocks the diffusion of plasma towards the axis.In addition,higher source power and lower gas pressure produce more uniform plasma for the designs with a stepped window near the symmetry axis.When the dielectric window is stepped at r=0.135 m,the non-uniformity of plasma initially decreases and then increases with the increase in source power or gas pressure.When the dielectric window is stepped at the radial edge of the chamber,the plasma uniformity is improved by increasing the source power and gas pressure due to the enhanced ionization at the larger radius caused by the severe localization. 展开更多
关键词 fluid simulation gradient coil vertical coil stepped dielectric window plasma uniformity
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