Diffusion bonding between Al and Cu was successfully performed by hot isostatic pressing(HIP). To improve the strength of diffusion bonding joint, pure nickel foils with different thickness were used as intermediate l...Diffusion bonding between Al and Cu was successfully performed by hot isostatic pressing(HIP). To improve the strength of diffusion bonding joint, pure nickel foils with different thickness were used as intermediate layer. Microstructure of the interface between Al and Cu was investigated by X-ray diffraction(XRD) technique, secondary electron microscopy(SEM), and nano-indentation tests. When the temperature was 500 ℃ and held for 3 h with a processing pressure of 50 MPa, Al and Cu could be bonded with its interface formed by several diffusion layers. With the addition of Ni interlayer, the diffusion of aluminum atoms was effectively hindered, and the interface became smoother. The tensile strength of bonded joints increases with increasing the thickness of Ni interlayer, which contributes to a reduction in the thickness of intermetallic compounds(IMCs) and well bonding quality of Al-Cu joints.展开更多
The Ti−6Al−4V(TC4)alloy powder and forged solid were diffusion bonded by hot isostatic pressing(HIP)to fabricate a powder−solid part.The microstructure of the powder−solid part was observed by scanning electron micros...The Ti−6Al−4V(TC4)alloy powder and forged solid were diffusion bonded by hot isostatic pressing(HIP)to fabricate a powder−solid part.The microstructure of the powder−solid part was observed by scanning electron microscope(SEM).The microhardness and tensile tests were conducted to investigate the mechanical properties.The results showed that the powder compact was near-fully dense,and the powder/solid interface was tight and complete.The microhardness of the interface was higher than that of the powder compact and solid.The fractures of all powder−solid tensile specimens were on the solid side rather than at the interface,which indicated that a good interfacial strength was obtained.The tensile strength and elongation of the powder compact were higher than those of the solid.It is concluded that the HIP process can successfully fabricate high-quality Ti−6Al−4V powder−solid parts,which provides a novel near net shape technology for titanium alloys.展开更多
The hot isostatic pressing-diffusion bonding(HIP-DB)was proposed to achieve the joining of CuAgZn and GH909 directly without an interlayer.The microstructure of joint was characterized by scanning electron microscope(...The hot isostatic pressing-diffusion bonding(HIP-DB)was proposed to achieve the joining of CuAgZn and GH909 directly without an interlayer.The microstructure of joint was characterized by scanning electron microscope(SEM),energy dispersive spectrometer(EDS)and X-ray diffraction(XRD).The microhardness and shear strength were tested to investigate the mechanical properties of joint.The results showed that the interface was complete,and the joint was compact,uniform and free of unbonded defects.The maximum microhardness of joint was HV 443,higher than that of two base alloys,and the average shear strength of joint reached 172 MPa.It is concluded that a good metallurgical bonding between CuAgZn and GH909 can be obtained by HIP-DB with the process parameters of 700℃,150 MPa and 3 h.展开更多
Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at temperatures between 623 and 923 K through two thermal processes： hot compression under the deformation rate of 0.2 mrrdmin for 10...Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at temperatures between 623 and 923 K through two thermal processes： hot compression under the deformation rate of 0.2 mrrdmin for 10 rain at pre-set temperatures, and additional pressing at 0.2 mm/min for 20 rain during furnace cooling. After analyzing interface, the feasible diffusion bonding temperature was suggested as 823 K. The three major intermetallic layers generated during diffusion bonding process were identified as AIECu, AlCu＋AlaCu4 and Al4Cu9. Furthermore, local hardness values ofAlECU, AlCu＋AlaCu4 and Al4Cu9 layers average at （4.97±0.05）, （6.33±0.00） and （6.06±0.18） GPa, respectively.展开更多
Diffusion behavior of Nb in elemental powder metallurgy high Nb containing TiAl alloys was investigated. The results show that Nb element dissolves into the matrix by diffusion. Pore nests are formed in situ after Nb ...Diffusion behavior of Nb in elemental powder metallurgy high Nb containing TiAl alloys was investigated. The results show that Nb element dissolves into the matrix by diffusion. Pore nests are formed in situ after Nb diffusion. With the increase in hot pressing temperature, the diffusion of Nb will be more sufficient, and the microstructure is more homogeneous. Nb element diffuses completely at 1400℃. Meanwhile, compression deformation and agglomeration phenomena of pores are observed in some pore nests. Hot isostatic pressing （HIP） treatment can only efficiently decrease but not eliminate porosity completely.展开更多
基金Funded by National Science and Technology Major Project(No.2017-Ⅵ-0009-0080)Science and Technology Planning Project of Wuhan(No.2018010401011281).
文摘Diffusion bonding between Al and Cu was successfully performed by hot isostatic pressing(HIP). To improve the strength of diffusion bonding joint, pure nickel foils with different thickness were used as intermediate layer. Microstructure of the interface between Al and Cu was investigated by X-ray diffraction(XRD) technique, secondary electron microscopy(SEM), and nano-indentation tests. When the temperature was 500 ℃ and held for 3 h with a processing pressure of 50 MPa, Al and Cu could be bonded with its interface formed by several diffusion layers. With the addition of Ni interlayer, the diffusion of aluminum atoms was effectively hindered, and the interface became smoother. The tensile strength of bonded joints increases with increasing the thickness of Ni interlayer, which contributes to a reduction in the thickness of intermetallic compounds(IMCs) and well bonding quality of Al-Cu joints.
基金the National Natural Science Foundation of China(No.51675029).
文摘The Ti−6Al−4V(TC4)alloy powder and forged solid were diffusion bonded by hot isostatic pressing(HIP)to fabricate a powder−solid part.The microstructure of the powder−solid part was observed by scanning electron microscope(SEM).The microhardness and tensile tests were conducted to investigate the mechanical properties.The results showed that the powder compact was near-fully dense,and the powder/solid interface was tight and complete.The microhardness of the interface was higher than that of the powder compact and solid.The fractures of all powder−solid tensile specimens were on the solid side rather than at the interface,which indicated that a good interfacial strength was obtained.The tensile strength and elongation of the powder compact were higher than those of the solid.It is concluded that the HIP process can successfully fabricate high-quality Ti−6Al−4V powder−solid parts,which provides a novel near net shape technology for titanium alloys.
基金The authors are grateful for the financial support from the Advanced Space Propulsion Technology Laboratory Open Fund,China(LabASP-2018-16).
文摘The hot isostatic pressing-diffusion bonding(HIP-DB)was proposed to achieve the joining of CuAgZn and GH909 directly without an interlayer.The microstructure of joint was characterized by scanning electron microscope(SEM),energy dispersive spectrometer(EDS)and X-ray diffraction(XRD).The microhardness and shear strength were tested to investigate the mechanical properties of joint.The results showed that the interface was complete,and the joint was compact,uniform and free of unbonded defects.The maximum microhardness of joint was HV 443,higher than that of two base alloys,and the average shear strength of joint reached 172 MPa.It is concluded that a good metallurgical bonding between CuAgZn and GH909 can be obtained by HIP-DB with the process parameters of 700℃,150 MPa and 3 h.
基金Project (10037273) supported by the Ministry of Knowledge Economy, Korea
文摘Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at temperatures between 623 and 923 K through two thermal processes： hot compression under the deformation rate of 0.2 mrrdmin for 10 rain at pre-set temperatures, and additional pressing at 0.2 mm/min for 20 rain during furnace cooling. After analyzing interface, the feasible diffusion bonding temperature was suggested as 823 K. The three major intermetallic layers generated during diffusion bonding process were identified as AIECu, AlCu＋AlaCu4 and Al4Cu9. Furthermore, local hardness values ofAlECU, AlCu＋AlaCu4 and Al4Cu9 layers average at （4.97±0.05）, （6.33±0.00） and （6.06±0.18） GPa, respectively.
基金This work is financially supported by the Key Grant Project of Chinese Ministry of Education (No. 704008) and by the Program from New Century Excellent Talents in University, China (No. NCET-04-01017).
文摘Diffusion behavior of Nb in elemental powder metallurgy high Nb containing TiAl alloys was investigated. The results show that Nb element dissolves into the matrix by diffusion. Pore nests are formed in situ after Nb diffusion. With the increase in hot pressing temperature, the diffusion of Nb will be more sufficient, and the microstructure is more homogeneous. Nb element diffuses completely at 1400℃. Meanwhile, compression deformation and agglomeration phenomena of pores are observed in some pore nests. Hot isostatic pressing （HIP） treatment can only efficiently decrease but not eliminate porosity completely.
